MPF050TL-FCVG484I

The MPF050TL-FCVG484I is a PolarFire family FPGA from Microchip Technology, delivered in a compact 484-ball BFBGA package. It provides a dense logic fabric and on-chip memory for mid- to high-density programmable logic applications in industrial environments.

Key architectural characteristics include 3,774,874 logic elements, approximately 3.6 Mbits of embedded memory, and 176 user I/Os. The device targets designs that require significant logic capacity, on-chip RAM and industrial operating temperature support.

Key Features

• Logic Capacity — 3,774,874 logic elements to support complex programmable logic and large designs.
• Embedded Memory — approximately 3.6 Mbits of on-chip RAM for data buffering, state storage and local memory functions.
• I/O Resources — 176 user I/Os for broad interfacing to peripherals, sensors and system buses.
• Package — 484-BFBGA package case; supplier device package listed as 484-FBGA (19×19 mm) for compact board integration.
• Power — Core voltage supply range 0.970 V to 1.08 V, enabling designs that conform to the device’s recommended operating window.
• Industrial Grade — Specified operating temperature range of –40 °C to 100 °C and listed as Industrial grade in the product data.
• Mounting — Surface mount package suitable for modern PCB assembly processes.
• Regulatory — RoHS compliant.
• Programming Note — PolarFire device programming functions (programming, verify and digest check) are allowed over the Industrial temperature range.

Typical Applications

• Industrial Control — Use the device’s large logic capacity and industrial temperature rating for PLCs, motor-control controllers and factory automation where robust operation across –40 °C to 100 °C is required.
• Communications Infrastructure — 176 I/Os and substantial on-chip memory support protocol handling, packet buffering and interface bridging in network equipment.
• Compute Acceleration & DSP — Dense logic and embedded RAM enable hardware-accelerated data processing, signal conditioning or custom DSP implementations.
• High-Density Board Designs — The 484-ball BFBGA (19×19 mm) package fits space-constrained boards while providing extensive I/O and logic resources.

Unique Advantages

• Large Logic Fabric: 3,774,874 logic elements permit implementation of complex state machines, custom accelerators and multi-function systems on a single device.
• Significant On-Chip Memory: Approximately 3.6 Mbits of embedded RAM reduces external memory requirements for many designs, simplifying BOM and board routing.
• Broad I/O Count: 176 I/Os provide flexible connectivity options for sensors, high-speed interfaces and system peripherals.
• Industrial Temperature Support: Rated for –40 °C to 100 °C, enabling deployment in demanding thermal environments common to industrial applications.
• Compact High-Density Package: 484-ball BFBGA (supplier 484-FBGA, 19×19 mm) balances I/O density and board area for space-constrained applications.
• Regulatory Compliance: RoHS compliant for modern manufacturing and environmental requirements.

Why Choose MPF050TL-FCVG484I?

The MPF050TL-FCVG484I combines a very large logic element count with multiple megabits of embedded RAM and a high I/O count in a compact BFBGA package, making it suitable for industrial-grade programmable logic designs that need extensive on-chip resources. Its core voltage range and industrial operating temperature specification allow designers to target robust embedded systems requiring sustained operation across a wide temperature range.

This device is appropriate for engineering teams building industrial control systems, communications modules, and compute-accelerated subsystems that benefit from integrated memory and a dense logic fabric, while maintaining RoHS compliance and a surface-mount form factor for standard production assembly.

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