M7AFS600-FGG484I

IC FPGA 172 I/O 484FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

Quantity 525 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M7AFS600-FGG484I – Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

The M7AFS600-FGG484I is a Fusion® mixed-signal FPGA from Microchip Technology, built on a flash-based CMOS architecture and offered in a 484‑BGA (484‑FPBGA, 23×23) package. It combines high-density digital logic with embedded analog and memory resources to address industrial embedded designs that require reprogrammable logic, on-chip analog conversion and reliable nonvolatile configuration.

Key on-chip resources include 13,824 logic elements, approximately 110,592 bits of embedded RAM, 172 I/Os, and system-level support for mixed-voltage I/O and integrated analog peripherals—enabling compact, single-chip solutions for a range of control and mixed-signal applications.

Key Features

  • Core Logic — 13,824 logic elements (tiles) and approximately 600,000 system gates for mid-range reprogrammable logic integration.
  • Embedded Memory — Approximately 110,592 bits of on-chip RAM (≈108 kbits) and Fusion-family flash memory blocks providing up to 4 Mbits of nonvolatile user flash for configuration and code storage.
  • Mixed-Signal Integration — Integrated A/D converter capability with up to 12‑bit resolution and scalable analog input channels (up to 30 channels in the AFS600 family), plus internal or external reference options and on-chip temperature/current monitors.
  • MOSFET Gate Drive Support — On-chip gate driver outputs (up to 10) with programmable drive strengths and support for P‑ and N‑channel MOSFETs, suitable for power stage interfacing.
  • Advanced I/O — 172 digital I/Os with bank-selectable voltages (1.5 V, 1.8 V, 2.5 V, 3.3 V) and wide single-ended/differential standard support for flexible mixed-voltage system interfaces.
  • Clocking and Timing — On-chip 100 MHz RC oscillator, crystal oscillator support, multiple clock conditioning circuits and integrated PLLs for flexible timing and frequency synthesis.
  • Nonvolatile Configuration & Security — Flash-based, instant-on architecture with in-system programming (ISP) and AES-based ISP security (AES via JTAG) plus FlashLock® protection features.
  • Package & Industrial Grade — 484‑BGA (484‑FPBGA, 23×23) surface‑mount package rated for industrial operation from -40°C to 85°C; core supply specified 1.425 V to 1.575 V.

Typical Applications

  • Industrial Control and Automation — Integrated analog inputs, MOSFET gate drivers and robust I/O make the device well suited for motor drives, power converters and embedded control nodes.
  • Mixed-Signal Data Acquisition — On-chip ADCs with up to 12‑bit resolution and scalable channels support sensor interfacing and condition monitoring in instrumentation and test systems.
  • Board Management and Mezzanine Modules — Flash-based nonvolatile configuration, multiple I/O banks and clocking resources fit supervisory, management and mezzanine applications where reliable instant-on operation is required.

Unique Advantages

  • Highly Integrated Mixed-Signal Platform: Combines FPGA fabric, embedded flash, SRAM and analog peripherals to reduce external components and board complexity.
  • Instant-On, Nonvolatile Configuration: Flash-based architecture retains configuration when powered off, enabling reliable, fast startup behavior for embedded systems.
  • Flexible I/O and Voltage Support: Bank-selectable I/O voltages and wide I/O standard support simplify interfacing with legacy and modern peripherals without level-shifting.
  • On-Chip Power Stage Support: Integrated MOSFET gate driver outputs and programmable strengths enable tighter integration of power and drive functions on a single device.
  • Industrial Temperature Range: Specified operation from -40°C to 85°C for deployment in industrial environments.

Why Choose M7AFS600-FGG484I?

The M7AFS600-FGG484I positions itself as a versatile mixed-signal FPGA for industrial embedded designs that demand reprogrammable logic, embedded analog, and nonvolatile configuration in a single package. With 13,824 logic elements, approximately 110,592 bits of embedded RAM, and integrated ADC and gate-drive functionality, it enables consolidation of digital, analog and power-control functions to reduce board area and BOM complexity.

Engineers designing control systems, data acquisition modules, and management mezzanines will find the combination of flexible I/O, on-chip memory and flash-based instant-on configuration valuable for scalable, robust designs that benefit from Microchip’s Fusion family architecture.

Request a quote or submit an inquiry to get pricing and availability for the M7AFS600-FGG484I and to discuss integration support for your project.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up