M7AFS600-FGG484I
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA |
|---|---|
| Quantity | 525 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 172 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M7AFS600-FGG484I – Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA
The M7AFS600-FGG484I is a Fusion® mixed-signal FPGA from Microchip Technology, built on a flash-based CMOS architecture and offered in a 484‑BGA (484‑FPBGA, 23×23) package. It combines high-density digital logic with embedded analog and memory resources to address industrial embedded designs that require reprogrammable logic, on-chip analog conversion and reliable nonvolatile configuration.
Key on-chip resources include 13,824 logic elements, approximately 110,592 bits of embedded RAM, 172 I/Os, and system-level support for mixed-voltage I/O and integrated analog peripherals—enabling compact, single-chip solutions for a range of control and mixed-signal applications.
Key Features
- Core Logic — 13,824 logic elements (tiles) and approximately 600,000 system gates for mid-range reprogrammable logic integration.
- Embedded Memory — Approximately 110,592 bits of on-chip RAM (≈108 kbits) and Fusion-family flash memory blocks providing up to 4 Mbits of nonvolatile user flash for configuration and code storage.
- Mixed-Signal Integration — Integrated A/D converter capability with up to 12‑bit resolution and scalable analog input channels (up to 30 channels in the AFS600 family), plus internal or external reference options and on-chip temperature/current monitors.
- MOSFET Gate Drive Support — On-chip gate driver outputs (up to 10) with programmable drive strengths and support for P‑ and N‑channel MOSFETs, suitable for power stage interfacing.
- Advanced I/O — 172 digital I/Os with bank-selectable voltages (1.5 V, 1.8 V, 2.5 V, 3.3 V) and wide single-ended/differential standard support for flexible mixed-voltage system interfaces.
- Clocking and Timing — On-chip 100 MHz RC oscillator, crystal oscillator support, multiple clock conditioning circuits and integrated PLLs for flexible timing and frequency synthesis.
- Nonvolatile Configuration & Security — Flash-based, instant-on architecture with in-system programming (ISP) and AES-based ISP security (AES via JTAG) plus FlashLock® protection features.
- Package & Industrial Grade — 484‑BGA (484‑FPBGA, 23×23) surface‑mount package rated for industrial operation from -40°C to 85°C; core supply specified 1.425 V to 1.575 V.
Typical Applications
- Industrial Control and Automation — Integrated analog inputs, MOSFET gate drivers and robust I/O make the device well suited for motor drives, power converters and embedded control nodes.
- Mixed-Signal Data Acquisition — On-chip ADCs with up to 12‑bit resolution and scalable channels support sensor interfacing and condition monitoring in instrumentation and test systems.
- Board Management and Mezzanine Modules — Flash-based nonvolatile configuration, multiple I/O banks and clocking resources fit supervisory, management and mezzanine applications where reliable instant-on operation is required.
Unique Advantages
- Highly Integrated Mixed-Signal Platform: Combines FPGA fabric, embedded flash, SRAM and analog peripherals to reduce external components and board complexity.
- Instant-On, Nonvolatile Configuration: Flash-based architecture retains configuration when powered off, enabling reliable, fast startup behavior for embedded systems.
- Flexible I/O and Voltage Support: Bank-selectable I/O voltages and wide I/O standard support simplify interfacing with legacy and modern peripherals without level-shifting.
- On-Chip Power Stage Support: Integrated MOSFET gate driver outputs and programmable strengths enable tighter integration of power and drive functions on a single device.
- Industrial Temperature Range: Specified operation from -40°C to 85°C for deployment in industrial environments.
Why Choose M7AFS600-FGG484I?
The M7AFS600-FGG484I positions itself as a versatile mixed-signal FPGA for industrial embedded designs that demand reprogrammable logic, embedded analog, and nonvolatile configuration in a single package. With 13,824 logic elements, approximately 110,592 bits of embedded RAM, and integrated ADC and gate-drive functionality, it enables consolidation of digital, analog and power-control functions to reduce board area and BOM complexity.
Engineers designing control systems, data acquisition modules, and management mezzanines will find the combination of flexible I/O, on-chip memory and flash-based instant-on configuration valuable for scalable, robust designs that benefit from Microchip’s Fusion family architecture.
Request a quote or submit an inquiry to get pricing and availability for the M7AFS600-FGG484I and to discuss integration support for your project.

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