M7AFS600-FG484I

IC FPGA 172 I/O 484FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

Quantity 278 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M7AFS600-FG484I – Fusion® Field Programmable Gate Array (FPGA), 172 I/Os, 600,000 Gates, 484-BGA

The M7AFS600-FG484I is a Fusion® mixed-signal, flash-based FPGA in a 484-BGA package designed for industrial applications. Built on the Fusion family architecture, this device combines reprogrammable nonvolatile flash configuration, embedded analog blocks, and programmable logic—making it suitable for embedded designs that require integrated ADCs, gate drivers, and flexible I/O.

Key architectural highlights include approximately 600,000 system gates, 13,824 logic elements, 172 digital I/Os, and on-chip RAM totaling 110,592 bits. The device is specified for industrial temperature operation and RoHS compliance.

Key Features

  • Core Logic — Approximately 600,000 system gates and 13,824 logic elements provide substantial programmable fabric for control, signal processing, and glue-logic implementations.
  • Embedded Memory — On-chip RAM totaling 110,592 bits and multiple 4,608-bit SRAM block organizations with true dual-port capability and programmable FIFO logic for buffering and data path customization.
  • Nonvolatile Flash & Instant On — Flash-based configuration preserves programming when powered off and enables instant-on single-chip operation (Fusion family flash architecture).
  • Mixed-Signal Integration — Integrated ADC capability: up to 12-bit resolution, up to 600 ksps, internal 2.56 V or external reference, and up to 30 analog input channels. Includes current and temperature monitor blocks.
  • MOSFET Gate Drivers — Up to 10 gate driver outputs with programmable drive strengths and support for P- and N-channel MOSFETs for direct power-stage interfacing.
  • Clocking & Timing — Internal 100 MHz RC oscillator (±1%), crystal oscillator support (32 kHz–20 MHz), programmable RTC, and up to six Clock Conditioning Circuits (CCCs) with integrated PLLs supporting input 1.5–350 MHz and output 0.75–350 MHz.
  • Advanced I/O — 172 I/Os with mixed-voltage bank-selectable operation (1.5 V, 1.8 V, 2.5 V, 3.3 V), support for single-ended and differential standards, built-in I/O registers, hot-swappable I/Os, and programmable slew, drive strength, and weak pull settings.
  • Security & In-System Programming (ISP) — ISP via JTAG with 128-bit AES support and FlashLock® protection for secure field updates.
  • Power & Packaging — Surface-mount 484-FPBGA (23×23) package; device core supply range 1.425 V to 1.575 V. The Fusion family supports a single 3.3 V supply with an on-chip 1.5 V regulator (as described in Fusion family documentation).
  • Operating Range & Compliance — Industrial grade operation from –40 °C to 85 °C and RoHS compliant.

Typical Applications

  • Board Management and System Control — Integrated flash, security, and mixed-signal resources support secure firmware updates, monitoring, and management functions for complex boards and systems.
  • Advanced Mezzanine & Module Management — Support for AdvancedMC and mezzanine designs with on-chip analog, ADC channels, and MCU integration options for module-level control.
  • Mixed-Signal Sensing and Monitoring — Up to 30 analog input channels and high-resolution ADCs enable sensor interfacing, data acquisition, and condition monitoring in industrial applications.
  • Power Stage Control and Gate Driving — Integrated MOSFET gate drivers and programmable drive strengths simplify power-conversion and motor-drive front-end implementations.

Unique Advantages

  • Highly Integrated Mixed-Signal Platform: Combines flash configuration, embedded ADCs, gate drivers, and programmable logic to reduce system component count and simplify board design.
  • Nonvolatile, Instant-On Operation: Flash-based configuration retains programming when powered off for predictable startup and field programmability without external configuration memory.
  • Flexible I/O and Voltage Support: Bank-selectable I/O voltages and support for multiple interface standards enable easy integration with varied digital and analog peripherals.
  • Security and Field Update Support: ISP with 128-bit AES and FlashLock® protection enable secure firmware updates and protection of IP on the device.
  • Industrial Temperature Rating: –40 °C to 85 °C operating range makes the device suitable for industrial environments that demand stable operation across temperature extremes.

Why Choose M7AFS600-FG484I?

The M7AFS600-FG484I positions itself as a robust mixed-signal FPGA option for industrial embedded systems that need combined analog measurement, power-stage control, and substantial programmable logic in a single device. With roughly 600,000 gates, 13,824 logic elements, integrated ADCs and gate drivers, and secure in-system programming, it targets designs that benefit from on-chip integration to reduce BOM and simplify system architecture.

Its industrial temperature rating, RoHS compliance, and 484-FPBGA packaging provide a production-ready footprint for board-level integration. The Fusion family feature set—flash-based configuration, multiple clocking options, and flexible I/O—supports scalable designs and long-term maintenance via secure field updates.

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