M7AFS600-2FGG484I

IC FPGA 172 I/O 484FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

Quantity 163 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M7AFS600-2FGG484I – Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

The M7AFS600-2FGG484I is a Fusion® family mixed-signal FPGA in a 484-ball BGA package designed for industrial applications. This flash-based, nonvolatile device combines programmable digital logic with integrated analog functionality—providing instant-on operation and high integration for mixed-signal embedded designs.

Built on a reprogrammable flash CMOS architecture, the device delivers 600,000 system gates and 13,824 logic elements with family-level features such as embedded flash, on-chip ADCs and MOSFET gate drivers. It targets applications that require combined digital logic, analog interfacing and control in an industrial temperature range.

Key Features

  • Core Logic  600,000 system gates and 13,824 logic elements enable complex programmable logic and state-machine implementations.
  • Embedded Flash Memory  AFS600 family devices provide 4 Mbits of user flash memory (configurable 8/16/32-bit datapaths) with 10 ns read-ahead access for nonvolatile configuration and code storage.
  • On-chip RAM  Approximately 0.11 Mbits of embedded RAM (110,592 bits) organized as 4,608-bit SRAM blocks with true dual-port capability and programmable FIFO control logic.
  • Mixed-Signal and Analog I/O  Integrated ADC capability up to 12-bit resolution and up to 600 ksps, with up to 30 analog input channels, internal/external reference options and high-voltage input tolerance (–10.5 V to +12 V).
  • MOSFET Gate Drivers  Up to 10 programmable gate-driver outputs supporting P‑ and N‑channel MOSFETs with selectable drive strengths (including microamp and 20 mA settings).
  • High-Performance Clocking  Internal 100 MHz RC oscillator, crystal support (32 kHz–20 MHz), programmable RTC, 6 clock conditioning circuits and up to 2 PLLs with phase shift and multiply/divide capabilities (system frequency support to 350 MHz).
  • Advanced I/O  172 I/Os with mixed-voltage operation (1.5 V, 1.8 V, 2.5 V, 3.3 V), bank-selectable voltages (up to 5 banks), single-ended and differential standards, built-in I/O registers and hot-swap capability.
  • Power and Low-Power Modes  Designed for single 3.3 V I/O supply with on-chip 1.5 V regulator; supports sleep and standby low-power modes for power-sensitive systems. Core supply range: 1.425 V to 1.575 V.
  • Security and In-System Programming  In-System Programming (ISP) with 128-bit AES over JTAG and FlashLock® support for protecting configuration and firmware.
  • Package and Environmental  484-FPBGA (23×23 mm) surface-mount package, industrial grade operation from –40 °C to 85 °C, and RoHS compliant.

Typical Applications

  • Mixed-signal embedded systems  Integrate digital control with on-chip ADCs and analog I/O for compact mixed-signal designs requiring instant-on nonvolatile configuration.
  • Power stage control and MOSFET driving  Use integrated gate-driver outputs and high-voltage input tolerance to implement MOSFET gate control and power management functions.
  • Board and module management  Support management and monitoring functions in mezzanine and board-management applications leveraging analog monitoring blocks, RTC and programmable I/Os.

Unique Advantages

  • Highly integrated mixed-signal capability: Combines programmable logic, ADCs, analog I/O and MOSFET drivers on a single chip to reduce BOM and board complexity.
  • Nonvolatile, instant-on operation: Flash-based configuration retains design state without external configuration memory and enables fast system startup.
  • Flexible I/O and interfacing: 172 I/Os with bank-selectable voltages and multiple single-ended/differential standards simplify interfacing to a wide range of peripherals and transceivers.
  • Embedded memory balance: 4 Mbits of user flash paired with approximately 0.11 Mbits of on-chip RAM supports code storage and runtime data buffering within the device.
  • Industrial temperature capability: Rated for –40 °C to 85 °C operation to meet industrial-environment deployment requirements.

Why Choose M7AFS600-2FGG484I?

The M7AFS600-2FGG484I positions itself as an industrial-grade mixed-signal FPGA that brings together substantial programmable logic (600k gates / 13,824 logic elements), plentiful embedded flash, and analog integration in a compact 484-BGA package. Its family-level features—on-chip ADCs, MOSFET gate drivers, dual PLLs and versatile I/O—make it suitable for designs that require tight integration of control, sensing and power interfacing.

This device is aimed at design teams seeking a reprogrammable, nonvolatile FPGA with instant-on capability, embedded analog resources and industrial temperature operation—delivering a practical balance of performance, integration and system-level simplification backed by documented Fusion family features and specifications.

Request a quote or submit a pricing inquiry to check availability, lead times and to obtain a formal proposal for the M7AFS600-2FGG484I.

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