M7AFS600-2FGG484I
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA |
|---|---|
| Quantity | 163 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 172 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M7AFS600-2FGG484I – Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA
The M7AFS600-2FGG484I is a Fusion® family mixed-signal FPGA in a 484-ball BGA package designed for industrial applications. This flash-based, nonvolatile device combines programmable digital logic with integrated analog functionality—providing instant-on operation and high integration for mixed-signal embedded designs.
Built on a reprogrammable flash CMOS architecture, the device delivers 600,000 system gates and 13,824 logic elements with family-level features such as embedded flash, on-chip ADCs and MOSFET gate drivers. It targets applications that require combined digital logic, analog interfacing and control in an industrial temperature range.
Key Features
- Core Logic 600,000 system gates and 13,824 logic elements enable complex programmable logic and state-machine implementations.
- Embedded Flash Memory AFS600 family devices provide 4 Mbits of user flash memory (configurable 8/16/32-bit datapaths) with 10 ns read-ahead access for nonvolatile configuration and code storage.
- On-chip RAM Approximately 0.11 Mbits of embedded RAM (110,592 bits) organized as 4,608-bit SRAM blocks with true dual-port capability and programmable FIFO control logic.
- Mixed-Signal and Analog I/O Integrated ADC capability up to 12-bit resolution and up to 600 ksps, with up to 30 analog input channels, internal/external reference options and high-voltage input tolerance (–10.5 V to +12 V).
- MOSFET Gate Drivers Up to 10 programmable gate-driver outputs supporting P‑ and N‑channel MOSFETs with selectable drive strengths (including microamp and 20 mA settings).
- High-Performance Clocking Internal 100 MHz RC oscillator, crystal support (32 kHz–20 MHz), programmable RTC, 6 clock conditioning circuits and up to 2 PLLs with phase shift and multiply/divide capabilities (system frequency support to 350 MHz).
- Advanced I/O 172 I/Os with mixed-voltage operation (1.5 V, 1.8 V, 2.5 V, 3.3 V), bank-selectable voltages (up to 5 banks), single-ended and differential standards, built-in I/O registers and hot-swap capability.
- Power and Low-Power Modes Designed for single 3.3 V I/O supply with on-chip 1.5 V regulator; supports sleep and standby low-power modes for power-sensitive systems. Core supply range: 1.425 V to 1.575 V.
- Security and In-System Programming In-System Programming (ISP) with 128-bit AES over JTAG and FlashLock® support for protecting configuration and firmware.
- Package and Environmental 484-FPBGA (23×23 mm) surface-mount package, industrial grade operation from –40 °C to 85 °C, and RoHS compliant.
Typical Applications
- Mixed-signal embedded systems Integrate digital control with on-chip ADCs and analog I/O for compact mixed-signal designs requiring instant-on nonvolatile configuration.
- Power stage control and MOSFET driving Use integrated gate-driver outputs and high-voltage input tolerance to implement MOSFET gate control and power management functions.
- Board and module management Support management and monitoring functions in mezzanine and board-management applications leveraging analog monitoring blocks, RTC and programmable I/Os.
Unique Advantages
- Highly integrated mixed-signal capability: Combines programmable logic, ADCs, analog I/O and MOSFET drivers on a single chip to reduce BOM and board complexity.
- Nonvolatile, instant-on operation: Flash-based configuration retains design state without external configuration memory and enables fast system startup.
- Flexible I/O and interfacing: 172 I/Os with bank-selectable voltages and multiple single-ended/differential standards simplify interfacing to a wide range of peripherals and transceivers.
- Embedded memory balance: 4 Mbits of user flash paired with approximately 0.11 Mbits of on-chip RAM supports code storage and runtime data buffering within the device.
- Industrial temperature capability: Rated for –40 °C to 85 °C operation to meet industrial-environment deployment requirements.
Why Choose M7AFS600-2FGG484I?
The M7AFS600-2FGG484I positions itself as an industrial-grade mixed-signal FPGA that brings together substantial programmable logic (600k gates / 13,824 logic elements), plentiful embedded flash, and analog integration in a compact 484-BGA package. Its family-level features—on-chip ADCs, MOSFET gate drivers, dual PLLs and versatile I/O—make it suitable for designs that require tight integration of control, sensing and power interfacing.
This device is aimed at design teams seeking a reprogrammable, nonvolatile FPGA with instant-on capability, embedded analog resources and industrial temperature operation—delivering a practical balance of performance, integration and system-level simplification backed by documented Fusion family features and specifications.
Request a quote or submit a pricing inquiry to check availability, lead times and to obtain a formal proposal for the M7AFS600-2FGG484I.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D