M7AFS600-2FGG256I

The M7AFS600-2FGG256I is a Fusion Family mixed-signal, flash-based FPGA from Microchip Technology. It combines reprogrammable digital fabric with integrated analog resources to address mixed-signal embedded designs that require on-chip ADCs, MOSFET gate drivers and flexible I/O in a single device.

With 600,000 system gates and 13,824 logic elements, this industrial-grade device targets industrial and embedded control applications that need high logic density, integrated analog front-ends and robust I/O in a 256-LBGA package.

Key Features

• Core Density — 600,000 system gates and 13,824 logic elements provide substantial programmable logic resources for complex control, DSP and glue-logic tasks.
• Embedded Memory — Approximately 110,592 bits of on-chip RAM and 4 Mbits of embedded flash (two 2-Mbit blocks) for configuration and user data storage.
• Mixed-Signal Integration — Up to 12-bit ADC resolution with sampling up to 600 ksps and support for up to 30 analog input channels, plus current and temperature monitoring blocks.
• Gate Driver Outputs — Up to 10 MOSFET gate driver outputs supporting P- and N-channel devices with programmable drive strengths for power-stage control.
• High-Speed and Clocking — System performance to 350 MHz, internal 100 MHz RC oscillator, crystal oscillator support and two integrated PLLs for clock conditioning and frequency synthesis.
• Flexible I/O — 119 I/Os with bank-selectable voltages (1.5 V, 1.8 V, 2.5 V, 3.3 V) and support for single-ended and differential standards; built-in I/O registers and programmable slew/drive settings.
• Power and Low-Power Modes — Supports single 3.3 V supply architecture with an on-chip 1.5 V regulator, plus sleep and standby low-power modes to help manage system power.
• Package and Temperature — 256-LBGA (256-FPBGA, 17×17) surface-mount package rated for industrial operation from −40 °C to 85 °C.
• Security and Programming — Flash-based nonvolatile configuration with in-system programming (ISP) and 128-bit AES ISP security features.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Motor and Power Control — Integrated ADC channels, MOSFET gate drivers and programmable I/O support motor-drive, inverter and power-conversion control loops.
• Sensor Acquisition and Conditioning — On-chip ADCs with multiple analog inputs and internal monitoring blocks enable compact sensor front-ends and data acquisition subsystems.
• Embedded System Glue Logic — High logic density and mixed-voltage I/Os allow integration of control, protocol handling and peripheral interfaces in a single device.
• Mezzanine and Board Management — Flexible I/O banks, clock conditioning and on-chip flash make the device suitable for management and supervisory functions on carrier or mezzanine cards.

Unique Advantages

• Highly Integrated Mixed-Signal Platform: Combines sizable programmable logic, embedded RAM and multi-channel ADCs to reduce external component count and board complexity.
• Nonvolatile, Instant-On Operation: Flash-based architecture retains configuration without external memory and supports secure in-system programming with AES protection.
• Industrial Temperature Rating: Qualified for −40 °C to 85 °C operation, suitable for industrial embedded environments.
• Flexible Power and I/O: Supports mixed-voltage I/O banks and a single 3.3 V supply architecture with an on-chip regulator, simplifying power-supply design.
• Deterministic Clocking and Performance: Integrated PLLs and clock-conditioning circuits with up to 350 MHz system performance help meet timing-critical application requirements.

Why Choose M7AFS600-2FGG256I?

The M7AFS600-2FGG256I delivers a balanced blend of digital density and mixed-signal capability in a single industrial-grade FPGA package. Its 600,000 gates, 13,824 logic elements, embedded RAM and multi-megabit flash make it well suited for embedded control, power-management and sensor-interface designs that benefit from on-chip ADCs and MOSFET gate drivers.

Engineers can consolidate functionality, reduce BOM complexity and accelerate time-to-market by leveraging the device’s integrated analog resources, flexible I/O and secure flash configuration. The Fusion architecture and industrial temperature rating provide a reliable platform for long-term deployments in demanding embedded systems.

Request a quote or submit an inquiry to receive pricing and availability for the M7AFS600-2FGG256I. Our team can provide volume pricing, lead-time details and support for design-in considerations.