M7AFS600-2FG256I

IC FPGA 119 I/O 256FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 119 110592 256-LBGA

Quantity 192 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case256-LBGANumber of I/O119Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M7AFS600-2FG256I – Fusion FPGA, 600k Gates, 119 I/Os, 256-LBGA

The M7AFS600-2FG256I is a Fusion family mixed-signal Field Programmable Gate Array (FPGA) from Microchip Technology. Built around a flash-based 130 nm process and offering 600,000 system gates with 13,824 logic elements, this device integrates digital logic, on-chip flash, embedded RAM and mixed-signal peripherals in a single surface-mount 256-LBGA package.

Designed for industrial applications that require compact, reprogrammable mixed-signal solutions, the device delivers nonvolatile instant-on operation, integrated ADCs and analog I/Os, flexible clocking and strong system security and in-system programming features to simplify board-level design and reduce BOM complexity.

Key Features

  • Core Density: 600,000 system gates and 13,824 logic elements provide substantial programmable logic capacity for mid-range FPGA designs.
  • Embedded Flash Memory: Approximately 4 Mbits of nonvolatile on-chip flash (two 2 Mbit blocks), plus a 1 Kbit FlashROM for configuration and code storage.
  • Embedded RAM: Approximately 108 kbits of embedded SRAM organized as multiple 4,608-bit blocks with true dual-port support and programmable FIFO control logic.
  • Analog Integration: Integrated multi-channel ADCs (up to 12-bit resolution, up to 600 ksps) with up to 30 scalable analog input channels, high-voltage input tolerance and dedicated gate-driver outputs for power FET control.
  • On-Chip Clocking: Internal 100 MHz RC oscillator (1% accuracy), crystal oscillator support and up to six Clock Conditioning Circuits (CCCs) with one or two integrated PLLs supporting 0.75–350 MHz outputs.
  • Advanced I/O: 119 I/Os with bank-selectable voltages (1.5 V, 1.8 V, 2.5 V, 3.3 V), support for single-ended and differential standards and programmable slew, drive strength and weak pull resistors.
  • Security & In-System Programming: ISP capability with 128-bit AES via JTAG and FlashLock® protection to secure FPGA contents.
  • Power & Low Power Modes: Single 3.3 V primary power with an on-chip 1.5 V regulator, plus sleep and standby low-power modes to support power-sensitive designs.
  • Package & Environmental: Surface-mount 256-LBGA (supplier package: 256-FPBGA 17×17), industrial-grade operation from −40 °C to 85 °C, and RoHS compliant.

Typical Applications

  • Industrial Control & Motor Drive: Mixed-signal integration and gate-driver outputs enable precise sensor acquisition and MOSFET control for motor control and power-conversion systems.
  • Data Acquisition & Sensor Interfaces: On-chip ADC channels and analog I/Os simplify front-end designs for multi-channel sensor systems and condition monitoring.
  • Embedded System Management: Nonvolatile flash, ISP with AES security and programmable clocking make the device suitable for board and module management functions in industrial platforms.
  • Mezzanine & AdvancedMC Designs: Pin-compatible packages across the Fusion family and mixed-voltage I/O support mezzanine modules and AdvancedMC-style management applications.

Unique Advantages

  • Highly integrated mixed-signal platform: Combines programmable logic, on-chip flash, embedded RAM and analog peripherals to reduce external components and simplify system design.
  • Nonvolatile instant-on operation: Flash-based architecture retains configuration without external memory and enables immediate startup behavior after power-up.
  • Flexible clocking and timing: Multiple CCCs and integrated PLLs provide versatile clock generation and conditioning for diverse system timing needs.
  • Secure in-field updates: ISP with 128-bit AES and FlashLock® protection support secure firmware updates and protect intellectual property.
  • Industrial temperature rating: Specified −40 °C to 85 °C operation suitable for a broad range of industrial environments.
  • Scalable I/O and interfacing: Bank-selectable I/O voltages and support for differential and single-ended standards ease integration with mixed-voltage systems.

Why Choose M7AFS600-2FG256I?

The M7AFS600-2FG256I positions itself as a versatile, industrial-grade mixed-signal FPGA that consolidates logic, memory and analog peripherals into a single 256-LBGA package. With 600k gates, substantial on-chip flash and SRAM, integrated ADCs and advanced clocking, it is well suited to mid-range industrial designs that demand reprogrammability, secure in-system updates and mixed-signal integration.

Design teams building motor controls, data acquisition units, module management or mezzanine cards can leverage the Fusion architecture to reduce external BOM, simplify signal-chain design and maintain secure, field-updatable firmware over the product lifecycle.

If you would like pricing, availability or to request a quote for M7AFS600-2FG256I, please contact sales or submit a request for a quote. Our team can provide lead-time and ordering information to support your design schedule.

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