M7AFS600-2FG256

IC FPGA 119 I/O 256FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 119 110592 256-LBGA

Quantity 1,533 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-LBGANumber of I/O119Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M7AFS600-2FG256 – Fusion® Field Programmable Gate Array (FPGA) IC 119 I/Os, 110592 bits, 256-LBGA

The M7AFS600-2FG256 is a Fusion family mixed-signal, flash-based FPGA from Microchip Technology. Built on a reprogrammable flash architecture, this commercial-grade device combines digital logic, embedded memory, on-chip analog, and flexible I/O for mixed-signal embedded applications.

Targeted at designs that require integrated analog peripherals, nonvolatile configuration and a mid-range logic capacity, the M7AFS600-2FG256 delivers 600,000 system gates and 13,824 logic elements in a compact 256-LBGA package with 119 available I/Os.

Key Features

  • Core Logic — 600,000 system gates and 13,824 logic elements provide a mid-range programmable fabric for control, signal processing and glue-logic integration.
  • Embedded RAM — Approximately 108 kbits of embedded RAM (110,592 total RAM bits) suitable for FIFOs, small buffers and state storage.
  • Nonvolatile Flash Configuration — Flash-based, reprogrammable architecture delivers instant-on, nonvolatile configuration and in-system programming with FlashLock® protection and 128-bit AES ISP via JTAG.
  • Integrated Analog and Mixed-Signal — On-chip ADC capability up to 12-bit resolution and analog I/O support with up to 30 analog input channels and multiple analog quads for sensor interfacing and analog control.
  • Advanced I/O Flexibility — 119 I/Os in the 256-LBGA package with bank-selectable voltages and mixed-voltage operation (1.5 V, 1.8 V, 2.5 V and 3.3 V), and support for single-ended and differential standards as described in the Fusion family.
  • Clocking and Timing — Internal 100 MHz RC oscillator (1% accuracy), crystal oscillator support and multiple clock conditioning circuits with integrated PLLs (Fusion AFS600 provides two PLLs) for flexible clock tree design.
  • Power and Supply — Core supply requirement between 1.425 V and 1.575 V; the Fusion family also includes an on-chip 1.5 V regulator and low-power operating modes for energy-conscious designs.
  • Package and Operating Range — Surface-mount 256-LBGA (256-FPBGA, 17×17) package; commercial operating temperature range from 0 °C to 70 °C.

Typical Applications

  • Industrial Control — Motor control, gate-driver interfacing and mixed-signal supervisory functions using on-chip ADCs and MOSFET gate-driver outputs.
  • Sensor Hubs and Data Acquisition — Multi-channel analog input capability and embedded memory for collecting, buffering and preprocessing sensor data at the edge.
  • Embedded System Glue Logic — Mid-range programmable logic to integrate peripheral interfaces, timing control and board-management functions in mixed-voltage systems.
  • Power Management and Monitoring — Built-in current and temperature monitor blocks and programmable gate-driver outputs for power-stage control and telemetry.

Unique Advantages

  • Integrated Mixed-Signal Capability: On-chip ADCs, analog I/Os and gate drivers reduce external component count and simplify board design for sensor and power applications.
  • Nonvolatile, Instant-On Configuration: Flash-based architecture retains configuration without external configuration memory and supports secure in-system updates.
  • Flexible I/O and Voltage Support: Bank-selectable mixed-voltage I/Os enable direct interfacing to a wide range of peripherals and legacy logic levels without intermediate level shifters.
  • Balanced Logic and Memory Resources: 13,824 logic elements paired with roughly 108 kbits of embedded RAM suit designs that require moderate logic density with on-chip buffering.
  • Compact, Surface-Mount Packaging: 256-LBGA (17×17) delivers a small footprint suitable for space-constrained PCBs while exposing 119 usable I/Os for system connectivity.

Why Choose M7AFS600-2FG256?

The M7AFS600-2FG256 positions itself as a commercially rated, mixed-signal FPGA solution for designs that need mid-range programmable logic combined with integrated analog peripherals and nonvolatile flash configuration. Its balance of logic capacity, embedded RAM and analog resources makes it well suited for control, sensing and board-management roles where reducing BOM and board complexity matter.

Engineers selecting this device benefit from the Fusion family’s on-chip clocking, secure ISP and flexible I/O voltage options, providing scalability and long-term robustness for iterative hardware development and in-field updates.

Request a quote or contact sales to submit a purchasing inquiry or request more product and availability information for the M7AFS600-2FG256.

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