M7AFS600-2FG484

IC FPGA 172 I/O 484FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

Quantity 891 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M7AFS600-2FG484 – Fusion® Field Programmable Gate Array (FPGA) IC, 172 I/Os, 110,592-bit RAM, 484-BGA

The M7AFS600-2FG484 is a Fusion® FPGA IC from Microchip Technology in a 484-BGA supplier package. This commercial-grade device integrates 13,824 logic elements (cells), approximately 110,592 bits of on-chip RAM and 172 I/O pins, supporting complex programmable-logic implementations within a compact BGA footprint.

Designed for commercial electronic designs, the device operates from a core voltage supply range of 1.425 V to 1.575 V and across an operating temperature range of 0 °C to 70 °C, and is supplied in a surface-mount 484-FPBGA (23×23) package.

Key Features

  • Core & Logic  13,824 logic elements (cells) and 600,000 gates provide the programmable fabric required for implementing custom logic, state machines and control functions.
  • Embedded Memory  110,592 bits of on-chip RAM provide local storage for buffers, FIFOs and other embedded data structures.
  • I/O Capacity  172 I/O pins support a wide range of external connectivity and interface requirements for mixed-signal systems and peripheral integration.
  • Power  Specified core voltage supply range of 1.425 V to 1.575 V enables predictable power planning for the programmable core.
  • Package & Mounting  Surface-mount 484-BGA enclosure (supplier device package: 484-FPBGA (23×23)) for compact board-level integration.
  • Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 70 °C for standard commercial environments.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • Substantial logic capacity: 13,824 logic elements and 600,000 gates enable implementation of sizable custom logic blocks and control functions in a single FPGA.
  • On-chip memory for local buffering: 110,592 bits of embedded RAM reduce dependence on external memory for many temporary-storage needs.
  • High I/O count: 172 I/Os provide flexibility to connect multiple peripherals and interfaces without additional multiplexing hardware.
  • Compact BGA footprint: 484-BGA (484-FPBGA, 23×23) packaging supports dense board layouts while maintaining a surface-mount form factor.
  • Commercial temperature rating: Specified 0 °C to 70 °C operating range suits standard commercial electronic products and systems.
  • Regulatory readiness: RoHS compliance supports environmentally conscious product designs and supply-chain requirements.

Why Choose M7AFS600-2FG484?

The M7AFS600-2FG484 combines a significant logic resource set, embedded RAM and a high I/O count within a compact 484-BGA package, delivering a balanced mix of capacity and integration for commercial electronic designs. Its defined supply-voltage window and commercial operating range make it suitable for designers who require predictable electrical and thermal characteristics in a surface-mount FPGA solution.

Backed by Microchip Technology, this device fits projects that need programmable logic density, on-chip memory and flexible I/O in a RoHS-compliant, commercially rated package—offering a scalable option for board-level integration and development.

Request a quote or contact sales to check availability and pricing for the M7AFS600-2FG484.

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