M7AFS600-1FGG484

IC FPGA 172 I/O 484FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

Quantity 1,683 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M7AFS600-1FGG484 – Fusion Field Programmable Gate Array (FPGA) IC, 600k Gates, 172 I/O, 484-BGA

The M7AFS600-1FGG484 is a Fusion family mixed-signal FPGA offering flash-based, nonvolatile reprogrammability and high integration of digital and analog resources. It combines 600,000 system gates and 13,824 logic elements with embedded memory, integrated analog functions and scalable I/O to address mixed-signal control, monitoring and embedded system applications.

Built in a 484-ball FBGA (23 × 23 mm) surface-mount package and specified for commercial operation (0 °C to 70 °C), this device provides a compact, reprogrammable platform with on-chip flash, ADC resources and flexible I/O voltage support for a range of embedded designs.

Key Features

  • Core Capacity — 600,000 system gates and 13,824 logic elements provide substantial logic resource density for complex control and signal-processing functions.
  • Embedded Memory — Approximately 108 kbits (110,592 bits) of embedded RAM plus on-chip flash memory architecture (AFS600 series shows 4 Mbits total flash in datasheet) and an additional 1 Kbit of FlashROM for configuration and persistent storage.
  • Mixed-Signal Integration — On-chip ADCs with up to 12-bit resolution and up to 600 ksps per datasheet, up to 30 analog input channels, internal or external voltage reference options, and dedicated MOSFET gate driver outputs for power-stage integration.
  • I/O Flexibility — 172 digital I/Os with bank-selectable voltages and support for single-ended and differential standards across 1.5 V, 1.8 V, 2.5 V and 3.3 V domains; built-in I/O registers and programmable drive/slew settings.
  • Clocking and Timing — On-chip clocking includes internal RC oscillator, crystal oscillator support, real-time counter and multiple clock-conditioning circuits with integrated PLL capability for input frequencies up to 350 MHz and outputs up to 350 MHz (series capability).
  • Power and Supply — Core supply range listed at 1.425 V to 1.575 V; the Fusion family supports a single 3.3 V power supply with an on-chip 1.5 V regulator according to the datasheet.
  • Security and In-System Programming (ISP) — ISP support with 128-bit AES via JTAG and FlashLock® protection for secure configuration and field updates (per series datasheet).
  • Package and Environmental — Surface-mount 484-FPBGA (23 × 23 mm) package, commercial grade operation from 0 °C to 70 °C, and RoHS compliant.

Typical Applications

  • Power and Motor Control — Integrated ADC channels and MOSFET gate driver outputs enable precise sensing and direct drive of power stages for motor controllers, power converters and UPS systems.
  • Board Management and System Monitoring — Flash-based nonvolatile configuration, secure ISP and on-chip analog monitoring make this device suitable for system health monitoring, board management and supervisory functions in embedded platforms.
  • Mixed-Signal Data Acquisition — Multiple scalable analog inputs and embedded memory allow aggregation, pre-processing and buffering of sensor data for industrial monitoring and instrumentation.
  • Advanced Mezzanine and Embedded Modules — Compact 484-BGA package with flexible I/O supports mezzanine cards, embedded modules and compact board-level instantiations that require mixed-voltage interfacing.

Unique Advantages

  • Highly Integrated Mixed-Signal Platform: Combines digital logic, embedded RAM and flash with ADCs and gate drivers to reduce external component count and simplify board design.
  • Nonvolatile, Instant-On Configuration: Flash-based architecture preserves configuration when powered off and supports field reprogramming and secure ISP workflows.
  • Flexible I/O and Voltage Domains: Bank-selectable I/O voltages and support for multiple single-ended and differential standards enable easy interfacing to a wide range of peripherals and transceivers.
  • Compact Surface-Mount Packaging: 484-FPBGA (23 × 23 mm) provides a high pin count in a board-friendly footprint for space-constrained systems.
  • Secure Update and Configuration: 128-bit AES ISP and FlashLock® features in the Fusion family help protect IP and enable trusted firmware/bitstream updates.
  • Commercial Temperature and RoHS Compliance: Designed for commercial environments (0 °C to 70 °C) and RoHS compliant for global manufacturing requirements.

Why Choose M7AFS600-1FGG484?

The M7AFS600-1FGG484 delivers a balanced mix of programmable logic, embedded memory and analog integration suited to mixed-signal embedded designs that require onboard data acquisition, control and power-stage interfacing. With 600k system gates, 13,824 logic elements and the Fusion family’s flash-based architecture, it supports designs that need in-field reprogrammability, secure updates and compact high-pin-count packaging.

This commercial-grade FPGA is appropriate for developers building board management, data acquisition, power control and mezzanine/embedded module applications who want tight integration of analog and digital functions, flexible I/O voltage support and on-chip resources that reduce external BOM and simplify system architecture.

Request a quote or submit an RFQ to get pricing, lead-time and availability information for the M7AFS600-1FGG484.

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