M7AFS600-1FGG256
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 119 110592 256-LBGA |
|---|---|
| Quantity | 529 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 119 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M7AFS600-1FGG256 – Fusion® Field Programmable Gate Array (FPGA) IC 119 110592 256-LBGA
The M7AFS600-1FGG256 is a Fusion® family mixed-signal FPGA from Microchip Technology, combining reprogrammable flash-based logic with integrated analog and system peripherals. Built on an advanced flash CMOS process, this device targets applications that require combined digital logic, embedded flash, precision A/D conversion and MOSFET gate drive capability in a compact 256-LBGA package.
With 600,000 system gates and 13,824 logic elements, plus embedded flash and on-chip analog resources, the M7AFS600-1FGG256 is suitable for commercial designs where instant-on nonvolatile logic, mixed-signal integration and a moderate I/O count (119 pins) reduce board-level complexity.
Key Features
- Core Logic — 600,000 system gates and 13,824 logic elements provide programmable digital resources for custom logic, control and signal-processing functions.
- Embedded Flash Memory — 4 Mbits of on-chip flash memory (device family value) with a 1 Kbit FlashROM; user flash supports 8-, 16- or 32-bit datapaths and read-ahead access times down to 10 ns.
- Embedded RAM — Approximately 108 kbits of embedded RAM (110,592 bits) organized in multiple SRAM blocks for FIFOs and data buffering.
- Analog & A/D — Integrated A/D converter capability up to 12-bit resolution and up to 600 ksps, with up to 30 scalable analog input channels and internal or external reference options.
- MOSFET Gate Drivers & Monitors — Up to 10 programmable MOSFET gate driver outputs with selectable drive strengths, plus dedicated current and temperature monitor blocks.
- On-Chip Clocking — Internal 100 MHz RC oscillator and support for crystal oscillators; includes clock conditioning circuits and integrated PLLs supporting input 1.5–350 MHz and output 0.75–350 MHz ranges.
- Mixed-Voltage I/O — Bank-selectable I/O voltage support across common standards and 119 available I/O pins for flexible interfacing.
- Nonvolatile, Flash-Based Architecture — Flash configuration retains programming when powered off and enables instant-on behavior.
- Package & Mounting — Surface-mount 256-LBGA (supplier package: 256-FPBGA, 17×17) suitable for compact, high-density board designs.
- Electrical & Environmental — Core supply range 1.425 V to 1.575 V; commercial operating temperature 0 °C to 70 °C; RoHS compliant.
Typical Applications
- Power conversion and motor control — Integrated A/D channels, current/temperature monitors and programmable MOSFET gate drivers enable closed-loop control and power stage interfacing.
- Sensor and analog signal acquisition — Up to 30 analog inputs and a 12-bit ADC support multi-channel sensor interfacing, data acquisition and preprocessing.
- Board management and module control — Fusion family support for BMR/ATCA and AdvancedMC designs makes the device suitable for module and system management tasks.
- Custom digital control and interface bridging — 600k gates and 13,824 logic elements provide capacity for protocol bridging, glue logic and custom state machines while minimizing external components.
Unique Advantages
- Mixed-signal integration: Combines flash-configurable logic with precision ADCs, analog inputs and MOSFET gate drivers to reduce BOM and board area.
- Nonvolatile instant-on: Flash-based configuration retains programming without additional configuration memory, simplifying power-up behavior.
- Flexible clocking and timing: On-chip oscillators, clock conditioning circuits and PLLs provide versatile timing options for system and interface clocks.
- Compact, high-density package: 256-LBGA surface-mount package with 119 I/Os balances I/O availability and board space for mid-density designs.
- Commercial-grade fit: Designed for commercial temperature ranges and RoHS-compliant manufacturing environments.
- Scalable family options: Part of the Fusion family, enabling migration within family densities while retaining common architectural features and pin compatibility across certain packages.
Why Choose M7AFS600-1FGG256?
The M7AFS600-1FGG256 positions itself as a mixed-signal FPGA platform that brings nonvolatile flash configuration, substantial programmable logic (600k gates / 13,824 logic elements) and integrated analog peripherals into a single 256-LBGA package. Its combination of embedded flash, multiple ADC channels, MOSFET gate drivers and flexible clocking makes it a practical choice for commercial designs that benefit from on-chip analog/digital integration and instant-on operation.
Choose this device when you need a commercially graded Fusion family FPGA that reduces external component count, supports multi-channel analog acquisition and offers the logic capacity to implement custom control, interface and signal-processing functions in a compact, surface-mount package.
Request a quote or submit a parts inquiry today to check availability, pricing and lead times for the M7AFS600-1FGG256.

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