M7AFS600-1FGG256

IC FPGA 119 I/O 256FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 119 110592 256-LBGA

Quantity 529 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-LBGANumber of I/O119Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M7AFS600-1FGG256 – Fusion® Field Programmable Gate Array (FPGA) IC 119 110592 256-LBGA

The M7AFS600-1FGG256 is a Fusion® family mixed-signal FPGA from Microchip Technology, combining reprogrammable flash-based logic with integrated analog and system peripherals. Built on an advanced flash CMOS process, this device targets applications that require combined digital logic, embedded flash, precision A/D conversion and MOSFET gate drive capability in a compact 256-LBGA package.

With 600,000 system gates and 13,824 logic elements, plus embedded flash and on-chip analog resources, the M7AFS600-1FGG256 is suitable for commercial designs where instant-on nonvolatile logic, mixed-signal integration and a moderate I/O count (119 pins) reduce board-level complexity.

Key Features

  • Core Logic — 600,000 system gates and 13,824 logic elements provide programmable digital resources for custom logic, control and signal-processing functions.
  • Embedded Flash Memory — 4 Mbits of on-chip flash memory (device family value) with a 1 Kbit FlashROM; user flash supports 8-, 16- or 32-bit datapaths and read-ahead access times down to 10 ns.
  • Embedded RAM — Approximately 108 kbits of embedded RAM (110,592 bits) organized in multiple SRAM blocks for FIFOs and data buffering.
  • Analog & A/D — Integrated A/D converter capability up to 12-bit resolution and up to 600 ksps, with up to 30 scalable analog input channels and internal or external reference options.
  • MOSFET Gate Drivers & Monitors — Up to 10 programmable MOSFET gate driver outputs with selectable drive strengths, plus dedicated current and temperature monitor blocks.
  • On-Chip Clocking — Internal 100 MHz RC oscillator and support for crystal oscillators; includes clock conditioning circuits and integrated PLLs supporting input 1.5–350 MHz and output 0.75–350 MHz ranges.
  • Mixed-Voltage I/O — Bank-selectable I/O voltage support across common standards and 119 available I/O pins for flexible interfacing.
  • Nonvolatile, Flash-Based Architecture — Flash configuration retains programming when powered off and enables instant-on behavior.
  • Package & Mounting — Surface-mount 256-LBGA (supplier package: 256-FPBGA, 17×17) suitable for compact, high-density board designs.
  • Electrical & Environmental — Core supply range 1.425 V to 1.575 V; commercial operating temperature 0 °C to 70 °C; RoHS compliant.

Typical Applications

  • Power conversion and motor control — Integrated A/D channels, current/temperature monitors and programmable MOSFET gate drivers enable closed-loop control and power stage interfacing.
  • Sensor and analog signal acquisition — Up to 30 analog inputs and a 12-bit ADC support multi-channel sensor interfacing, data acquisition and preprocessing.
  • Board management and module control — Fusion family support for BMR/ATCA and AdvancedMC designs makes the device suitable for module and system management tasks.
  • Custom digital control and interface bridging — 600k gates and 13,824 logic elements provide capacity for protocol bridging, glue logic and custom state machines while minimizing external components.

Unique Advantages

  • Mixed-signal integration: Combines flash-configurable logic with precision ADCs, analog inputs and MOSFET gate drivers to reduce BOM and board area.
  • Nonvolatile instant-on: Flash-based configuration retains programming without additional configuration memory, simplifying power-up behavior.
  • Flexible clocking and timing: On-chip oscillators, clock conditioning circuits and PLLs provide versatile timing options for system and interface clocks.
  • Compact, high-density package: 256-LBGA surface-mount package with 119 I/Os balances I/O availability and board space for mid-density designs.
  • Commercial-grade fit: Designed for commercial temperature ranges and RoHS-compliant manufacturing environments.
  • Scalable family options: Part of the Fusion family, enabling migration within family densities while retaining common architectural features and pin compatibility across certain packages.

Why Choose M7AFS600-1FGG256?

The M7AFS600-1FGG256 positions itself as a mixed-signal FPGA platform that brings nonvolatile flash configuration, substantial programmable logic (600k gates / 13,824 logic elements) and integrated analog peripherals into a single 256-LBGA package. Its combination of embedded flash, multiple ADC channels, MOSFET gate drivers and flexible clocking makes it a practical choice for commercial designs that benefit from on-chip analog/digital integration and instant-on operation.

Choose this device when you need a commercially graded Fusion family FPGA that reduces external component count, supports multi-channel analog acquisition and offers the logic capacity to implement custom control, interface and signal-processing functions in a compact, surface-mount package.

Request a quote or submit a parts inquiry today to check availability, pricing and lead times for the M7AFS600-1FGG256.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up