M7AFS600-1FGG484I

IC FPGA 172 I/O 484FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

Quantity 945 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M7AFS600-1FGG484I – Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

The M7AFS600-1FGG484I is a Fusion® family mixed-signal FPGA from Microchip Technology delivering a highly integrated flash-based FPGA fabric with analog and power-driver capabilities. Built on the Fusion architecture, this device combines reprogrammable nonvolatile logic, embedded memory, and mixed-signal peripherals for industrial and embedded system designs.

With 13,824 logic elements, 172 I/Os, and approximately 110,592 bits of on-chip RAM, the device targets applications that require compact integration of digital logic, analog input channels and MOSFET gate drivers while operating across an industrial temperature range.

Key Features

  • Core Logic — 13,824 logic elements (tiles) and approximately 600,000 system gates provide programmable digital logic capacity for medium-complexity FPGA designs.
  • Embedded Memory — Approximately 110,592 bits of embedded RAM and family-level flash memory capacity (AFS600 family shows 4 Mbits total flash) for configuration storage and user data buffering.
  • Analog and Mixed-Signal Integration — Fusion family analog features include up to 12-bit ADC capability, up to 30 scalable analog input channels, current and temperature monitor blocks, and high-voltage input tolerance (–10.5 V to +12 V).
  • MOSFET Gate Drivers — Up to 10 gate driver outputs with programmable drive strengths suitable for P- and N-channel power MOSFET support.
  • I/O Flexibility — 172 total I/Os with multi-voltage bank-selectable operation and support for a range of single-ended and differential standards; built-in I/O registers, programmable slew/drive and weak pull-up/down options.
  • Clocking and Timing — On-chip clocking features include an internal 100 MHz RC oscillator, crystal oscillator support, clock conditioning circuits (CCCs) and PLLs with family-level frequency coverage up to 350 MHz system performance.
  • Security and In-System Programming — In-system programming (ISP) with 128-bit AES via JTAG and FlashLock® support for protecting FPGA contents.
  • Power and Low-Power Modes — Device-level core supply specified at 1.425 V to 1.575 V; Fusion family supports single 3.3 V supply with an on-chip 1.5 V regulator and low-power standby/sleep modes.
  • Package and Environmental — 484-ball BGA (484-FPBGA, 23 × 23) surface-mount package; industrial grade operation from –40 °C to 85 °C; RoHS compliant.

Typical Applications

  • Industrial Control — Integration of digital control logic with multiple analog inputs and MOSFET gate drivers enables compact motor control, power sequencing and process-control designs operating across industrial temperature ranges.
  • Sensor Interface and Data Acquisition — On-chip ADC channels and analog monitoring blocks simplify front-end sensor interfacing, enabling mixed-signal acquisition and preprocessing before digital logic processing.
  • Power Management and Gate Driving — Programmable gate driver outputs and high-voltage input tolerance support local MOSFET control and power stage management in embedded power subsystems.
  • Embedded System Integration — Balanced logic density, embedded RAM and nonvolatile flash configuration make the device suitable for systems that require instant-on reconfigurable logic combined with analog peripherals.

Unique Advantages

  • Highly Integrated Mixed-Signal Capability: Combines reprogrammable flash logic with ADC channels, analog monitors and gate drivers to reduce BOM and board area compared with separate components.
  • Nonvolatile Flash-Based FPGA: Flash configuration provides instant-on behavior and retains programming when powered off, simplifying system startup and configuration management.
  • Flexible I/O and Bank-Selectable Voltages: Wide I/O standard support and bank-selectable voltages enable straightforward interfacing to multiple voltage domains and legacy interfaces.
  • Industrial Temperature Range: Rated for operation from –40 °C to 85 °C, supporting deployment in industrial and embedded environments.
  • On-Chip Power Options: Core supply range specified at 1.425 V to 1.575 V with Fusion family support for a single 3.3 V supply and on-chip 1.5 V regulator, simplifying power distribution.

Why Choose M7AFS600-1FGG484I?

The M7AFS600-1FGG484I positions itself as a mixed-signal FPGA solution that brings together reprogrammable nonvolatile logic, embedded memory and analog peripherals in a single 484-BGA package. Its combination of 13,824 logic elements, approximately 110,592 bits of on-chip RAM, extensive analog I/O and MOSFET gate-driving capability makes it well suited to compact industrial and embedded designs that benefit from integration and instant-on operation.

Designed for developers seeking a balance of programmable logic, mixed-signal integration and industrial-grade operating range, this Fusion family device offers a scalable platform for designs that require reliable system-level features with vendor-supported FPGA architecture and security features such as AES-protected ISP and FlashLock®.

Request a quote or submit a pricing request to learn more about availability and lead times for the M7AFS600-1FGG484I.

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