M7AFS600-1FGG256I

IC FPGA 119 I/O 256FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 119 110592 256-LBGA

Quantity 607 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case256-LBGANumber of I/O119Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M7AFS600-1FGG256I – Fusion® Field Programmable Gate Array (FPGA) IC 119 110592 256-LBGA

The M7AFS600-1FGG256I is a Fusion® family mixed-signal FPGA from Microchip Technology built on a flash-based CMOS process. It combines reprogrammable digital fabric with integrated analog features and on-chip memory to support embedded mixed-signal applications.

Designed for industrial-temperature operation, the device targets designs that require a blend of programmable logic, embedded RAM and flash, analog inputs and MOSFET gate-drive capability, and flexible I/O in a compact 256-LBGA package.

Key Features

  • Logic Capacity — 13824 logic elements providing a programmable fabric equivalent to 600,000 system gates for custom digital functions.
  • Embedded Memory — Approximately 0.11 Mbits of on-chip RAM (110,592 bits) plus 4 Mbits of embedded Flash memory for nonvolatile configuration and user storage.
  • Mixed-Signal Integration — Up to 12-bit ADC resolution with up to 30 analog input channels and up to 10 MOSFET gate driver outputs for power and motor control applications.
  • Digital I/O — 119 user I/Os with mixed-voltage bank support and programmable drive/slew options for interfacing to a wide range of devices and voltage domains.
  • Clocking and Performance — Architecture supports up to 350 MHz system performance and includes clock conditioning resources with 2 integrated PLLs for flexible clock generation.
  • Power and Supply — Core voltage support 1.425 V to 1.575 V; Fusion family architecture supports a single 3.3 V supply with an on-chip 1.5 V regulator per the family datasheet.
  • Package and Mounting — 256-LBGA (supplier device package: 256-FPBGA 17×17) in a surface-mount format suitable for compact board layouts.
  • Industrial Temperature Grade — Rated for operation from −40°C to 85°C and RoHS compliant.

Typical Applications

  • Industrial Control — Embedded logic, integrated ADCs and gate drivers enable motor control and power-management functions in industrial systems.
  • Data Acquisition and Sensor Interfaces — Multiple analog input channels and on-chip ADCs simplify analog sensor sampling and preprocessing at the edge.
  • Embedded Mixed-Signal Systems — Combination of nonvolatile Flash, embedded RAM, and programmable logic supports compact, instant-on embedded controllers.
  • Power Conversion and Drive Electronics — MOSFET gate-driver outputs and analog monitoring blocks provide direct support for gate-driving and system monitoring tasks.

Unique Advantages

  • Nonvolatile, Flash-Based FPGA: Retains configuration when powered off, enabling instant-on operation and simplified system boot sequences.
  • Highly Integrated Mixed-Signal Capability: On-chip ADC channels, analog I/Os and MOSFET gate drivers reduce external component count and board complexity.
  • Embedded Memory and Storage: Combined on-chip RAM and multi-megabit Flash provide storage for runtime data and configuration without external memory.
  • Flexible Clocking: Multiple PLLs and clock-conditioning resources support a range of timing architectures and system frequencies up to 350 MHz.
  • Industrial Reliability: Industrial temperature rating (−40°C to 85°C) and RoHS compliance support deployment in commercial and industrial environments.
  • Compact Packaging: 256-LBGA (17×17 FPBGA) surface-mount package enables high-density board designs while providing 119 I/Os.

Why Choose M7AFS600-1FGG256I?

The M7AFS600-1FGG256I offers a balanced mix of programmable logic, substantial on-chip Flash and RAM, and integrated analog functionality tailored for mixed-signal embedded designs. Its Fusion family architecture delivers instant-on nonvolatile operation, flexible clocking and a broad set of I/O options in an industrial-temperature, compact 256-LBGA package.

This device is well suited for engineers building industrial control, sensor interface, power conversion, and embedded data-acquisition systems who need a single-chip solution that reduces BOM count and consolidates analog and digital functions.

Request a quote or submit a pricing inquiry to evaluate the M7AFS600-1FGG256I for your next mixed-signal FPGA design.

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