M7AFS600-1FG484
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA |
|---|---|
| Quantity | 176 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 172 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M7AFS600-1FG484 – Fusion® Field Programmable Gate Array (FPGA), 172 I/Os, 110,592-bit RAM, 484-BGA
The M7AFS600-1FG484 is a Fusion® family mixed-signal flash-based FPGA offering a high level of digital logic, embedded memory, and integrated analog peripherals in a 484-ball BGA (23×23) surface-mount package. This device combines roughly 600,000 system gates and 13,824 logic elements with embedded RAM and on-chip flash to support reprogrammable, nonvolatile system designs.
Designed for commercial applications requiring mixed-signal integration, the device delivers instant-on nonvolatile operation, embedded ADCs and analog I/O, flexible multi-voltage I/O banks, and on-chip clocking — enabling consolidation of digital, analog and control functions into a single component.
Key Features
- Logic Capacity Approximately 600,000 system gates and 13,824 logic elements to implement substantial RTL, glue logic, and control functions.
- Embedded Memory 110,592 bits (approximately 108 kbits) of on-chip RAM organized in multiple SRAM blocks for FIFOs and buffering.
- Nonvolatile Flash Fusion family flash-based architecture provides reprogrammable, nonvolatile configuration and instant-on behavior (series flash memory reported in family datasheet).
- Analog and Mixed-Signal Integration Integrated ADC capability (family features up to 12-bit resolution and up to 600 ksps) plus multiple analog input channels and MOSFET gate driver outputs for sensor and power-control interfaces (family-level features).
- Advanced I/O 172 digital I/Os with bank-selectable voltages supporting 1.5 V, 1.8 V, 2.5 V and 3.3 V operation, differential and single-ended standards, and programmable drive/slew options (family-level I/O capability).
- Clocking and Timing On-chip clocking support including RC oscillator, crystal oscillator support, clock conditioning circuits and integrated PLLs (family-level features) to enable system clocking flexibility up to the family’s supported frequency ranges.
- Power and Low-Power Modes Core supply specified at 1.425 V to 1.575 V; family datasheet documents on-chip regulator and low-power sleep/standby modes for power-conscious designs.
- Package & Temperature Surface-mount 484-FPBGA (23×23) package; commercial-grade operating temperature range 0 °C to 70 °C. RoHS-compliant.
- Security & In-System Programming Family-level support for in-system programming and flash security features including AES-based ISP and FlashLock® protection (as described for the Fusion family).
Typical Applications
- Power and Motor Control Use integrated ADCs, MOSFET gate driver outputs and programmable I/Os to implement motor-drive control loops, power converters and gate-driver interfaces.
- Data Acquisition and Sensor Fusion Combine analog inputs, ADC channels and embedded memory to perform multi-channel data capture, preprocessing and buffering at the edge.
- Embedded Control and Instrumentation Leverage the large logic capacity and on-chip flash to implement complex control algorithms, real-time sequencing and nonvolatile configuration in commercial equipment.
- High-Density I/O and Interface Bridging Utilize 172 I/Os with mixed-voltage support to bridge subsystems, implement protocol adapters, or consolidate multiple discrete interfaces into a single device.
Unique Advantages
- Highly integrated mixed-signal platform: Combines significant digital logic, embedded RAM, flash configuration and analog peripherals to reduce external BOM and simplify board design.
- Nonvolatile, instant-on operation: Flash-based configuration preserves design state without external configuration memory and enables immediate startup behavior.
- Flexible I/O and voltage support: Bank-selectable I/O voltages and broad I/O standard support allow direct interfacing to multiple system domains without level translators.
- Scalable performance: Large logic capacity and on-chip memory support complex algorithms, buffering and protocol handling within a single FPGA package.
- Commercial temperature and packaging: Surface-mount 484-FPBGA package and 0 °C to 70 °C rating suit standard commercial electronic products and production assembly processes.
Why Choose M7AFS600-1FG484?
The M7AFS600-1FG484 positions itself as a compact, mixed-signal FPGA solution when you need substantial logic resources alongside integrated analog, ADC and power-driving features. With roughly 600,000 system gates, 13,824 logic elements, 110,592 bits of embedded RAM and family-level flash configuration, this device enables consolidation of digital control, data acquisition and analog interfacing into a single, RoHS-compliant FPGA package.
This device is well suited for commercial designs where mixed-signal integration, instant-on nonvolatile configuration and flexible I/O are priorities. Its package, supply and temperature specifications support standard surface-mount manufacturing and commercial deployments while providing a stable platform for scalable designs and ongoing firmware updates.
Request a quote or contact sales to discuss pricing, availability and lead times for the M7AFS600-1FG484.

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