M7AFS600-1FG484

IC FPGA 172 I/O 484FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

Quantity 176 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M7AFS600-1FG484 – Fusion® Field Programmable Gate Array (FPGA), 172 I/Os, 110,592-bit RAM, 484-BGA

The M7AFS600-1FG484 is a Fusion® family mixed-signal flash-based FPGA offering a high level of digital logic, embedded memory, and integrated analog peripherals in a 484-ball BGA (23×23) surface-mount package. This device combines roughly 600,000 system gates and 13,824 logic elements with embedded RAM and on-chip flash to support reprogrammable, nonvolatile system designs.

Designed for commercial applications requiring mixed-signal integration, the device delivers instant-on nonvolatile operation, embedded ADCs and analog I/O, flexible multi-voltage I/O banks, and on-chip clocking — enabling consolidation of digital, analog and control functions into a single component.

Key Features

  • Logic Capacity  Approximately 600,000 system gates and 13,824 logic elements to implement substantial RTL, glue logic, and control functions.
  • Embedded Memory  110,592 bits (approximately 108 kbits) of on-chip RAM organized in multiple SRAM blocks for FIFOs and buffering.
  • Nonvolatile Flash  Fusion family flash-based architecture provides reprogrammable, nonvolatile configuration and instant-on behavior (series flash memory reported in family datasheet).
  • Analog and Mixed-Signal Integration  Integrated ADC capability (family features up to 12-bit resolution and up to 600 ksps) plus multiple analog input channels and MOSFET gate driver outputs for sensor and power-control interfaces (family-level features).
  • Advanced I/O  172 digital I/Os with bank-selectable voltages supporting 1.5 V, 1.8 V, 2.5 V and 3.3 V operation, differential and single-ended standards, and programmable drive/slew options (family-level I/O capability).
  • Clocking and Timing  On-chip clocking support including RC oscillator, crystal oscillator support, clock conditioning circuits and integrated PLLs (family-level features) to enable system clocking flexibility up to the family’s supported frequency ranges.
  • Power and Low-Power Modes  Core supply specified at 1.425 V to 1.575 V; family datasheet documents on-chip regulator and low-power sleep/standby modes for power-conscious designs.
  • Package & Temperature  Surface-mount 484-FPBGA (23×23) package; commercial-grade operating temperature range 0 °C to 70 °C. RoHS-compliant.
  • Security & In-System Programming  Family-level support for in-system programming and flash security features including AES-based ISP and FlashLock® protection (as described for the Fusion family).

Typical Applications

  • Power and Motor Control  Use integrated ADCs, MOSFET gate driver outputs and programmable I/Os to implement motor-drive control loops, power converters and gate-driver interfaces.
  • Data Acquisition and Sensor Fusion  Combine analog inputs, ADC channels and embedded memory to perform multi-channel data capture, preprocessing and buffering at the edge.
  • Embedded Control and Instrumentation  Leverage the large logic capacity and on-chip flash to implement complex control algorithms, real-time sequencing and nonvolatile configuration in commercial equipment.
  • High-Density I/O and Interface Bridging  Utilize 172 I/Os with mixed-voltage support to bridge subsystems, implement protocol adapters, or consolidate multiple discrete interfaces into a single device.

Unique Advantages

  • Highly integrated mixed-signal platform: Combines significant digital logic, embedded RAM, flash configuration and analog peripherals to reduce external BOM and simplify board design.
  • Nonvolatile, instant-on operation: Flash-based configuration preserves design state without external configuration memory and enables immediate startup behavior.
  • Flexible I/O and voltage support: Bank-selectable I/O voltages and broad I/O standard support allow direct interfacing to multiple system domains without level translators.
  • Scalable performance: Large logic capacity and on-chip memory support complex algorithms, buffering and protocol handling within a single FPGA package.
  • Commercial temperature and packaging: Surface-mount 484-FPBGA package and 0 °C to 70 °C rating suit standard commercial electronic products and production assembly processes.

Why Choose M7AFS600-1FG484?

The M7AFS600-1FG484 positions itself as a compact, mixed-signal FPGA solution when you need substantial logic resources alongside integrated analog, ADC and power-driving features. With roughly 600,000 system gates, 13,824 logic elements, 110,592 bits of embedded RAM and family-level flash configuration, this device enables consolidation of digital control, data acquisition and analog interfacing into a single, RoHS-compliant FPGA package.

This device is well suited for commercial designs where mixed-signal integration, instant-on nonvolatile configuration and flexible I/O are priorities. Its package, supply and temperature specifications support standard surface-mount manufacturing and commercial deployments while providing a stable platform for scalable designs and ongoing firmware updates.

Request a quote or contact sales to discuss pricing, availability and lead times for the M7AFS600-1FG484.

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