M7AFS600-2FGG256

The M7AFS600-2FGG256 is a Fusion® family mixed-signal FPGA offering a high level of integration for commercial embedded designs. It delivers 600,000 system gates and 13,824 logic elements in a 256-pin LBGA package, combining reprogrammable digital fabric with on-chip analog capability and embedded nonvolatile flash.

Designed for mixed-signal control, signal acquisition and onboard power management, this device provides 119 I/Os, approximately 110,592 bits of on-chip RAM, a 1.425 V–1.575 V core supply range, and commercial temperature operation from 0 °C to 70 °C. The Fusion family architecture adds integrated ADCs, MOSFET gate drivers and flexible clocking to simplify system design.

Key Features

• Core and Logic  600,000 system gates and 13,824 logic elements deliver the programmable digital resources required for medium-complexity FPGA designs.
• Embedded Flash and RAM  AFS600-family devices include up to 4 Mbits of embedded flash memory and the part provides 110,592 bits of on-chip RAM for FIFOs and scratch storage.
• Integrated Analog  Family-level analog features include ADCs up to 12-bit resolution and up to 600 ksps, up to 30 analog input channels, current and temperature monitors, and up to 10 MOSFET gate driver outputs.
• Flexible I/O  119 I/Os on this package with support for mixed-voltage single-ended and differential interfaces across banks (1.5 V, 1.8 V, 2.5 V, 3.3 V and several differential standards are supported by the Fusion family).
• Clocking and Timing  On-chip clock resources include multiple clock conditioning circuits and up to two PLLs (family-level capability) to support system frequencies up to the documented Fusion range.
• Power and Supply  Core supply operation is 1.425 V to 1.575 V; the Fusion family offers a single 3.3 V I/O supply architecture with on-chip 1.5 V regulator and low-power modes for reduced standby consumption.
• In-System Programming and Security  ISP with 128-bit AES via JTAG and FlashLock® support secure in-field reprogramming and protection of the FPGA image (family-level features).
• Package and Grade  Surface-mount 256-LBGA (256-FPBGA 17×17 supplier package) in a commercial-grade device rated 0 °C to 70 °C; RoHS compliant.

Typical Applications

• Mixed-signal control and monitoring  On-chip ADCs, analog inputs and monitoring blocks enable sensor acquisition, health monitoring and closed-loop control in embedded systems.
• Motor and power conversion control  Integrated MOSFET gate driver outputs and programmable I/O drive strength simplify gate-driving and power-management tasks for motor drives and converters.
• Signal conditioning and preprocessing  Combination of embedded RAM, flash memory and flexible logic makes the device suitable for front-end signal preprocessing, filtering and protocol conversion.
• Compact embedded systems  Nonvolatile flash configuration and single-chip mixed-signal integration reduce BOM and enable instant-on operation for compact controllers and instrumentation.

Unique Advantages

• Highly integrated mixed-signal platform: Combines reprogrammable logic, embedded flash and analog peripherals to reduce external components and simplify board design.
• Nonvolatile, instant-on operation: Flash-based configuration retains the design without external configuration memory, enabling fast startup and simplified system initialization.
• Family-level analog and gate-driving capability: ADCs, analog input channels and MOSFET gate drivers support direct sensor interfacing and power stage control on-chip.
• Flexible I/O and clocking: Bank-selectable I/O voltages and multiple clock conditioning resources allow easy interface to diverse system peripherals and clocks.
• Security and in-system reprogramming: AES-based ISP and FlashLock® functionality provide secure field updates and content protection.
• Commercial-grade, RoHS compliant: Package and temperature rating meet commercial deployment requirements while adhering to environmental compliance.

Why Choose M7AFS600-2FGG256?

The M7AFS600-2FGG256 positions Fusion® family capabilities in a 256-LBGA package for designs that require a balanced mix of digital logic, embedded memory and analog integration. With 600k gates, 13,824 logic elements, on-chip flash and ADC/gate-driver resources, it is suited to engineers consolidating multiple functions onto a single programmable device to reduce board complexity and part count.

This part is appropriate for teams building commercial embedded controllers, mixed-signal acquisition systems, and power-control applications that need nonvolatile configuration, flexible I/O and embedded analog peripherals. The Fusion family’s configuration, security and clocking features support scalable designs and in-field updates while meeting commercial temperature and RoHS requirements.

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