M7AFS600-2FGG484

IC FPGA 172 I/O 484FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA

Quantity 308 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BGANumber of I/O172Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M7AFS600-2FGG484 – Fusion® Field Programmable Gate Array (FPGA) IC, 172 I/O, 484-BGA

The M7AFS600-2FGG484 is a Fusion® family mixed-signal, flash-based FPGA from Microchip Technology supplied in a 484-ball FPBGA (23 × 23) surface-mount package. It combines reprogrammable flash logic, embedded memory, and integrated analog blocks to address commercial embedded designs that require mixed-signal integration and flexible I/O.

Engineered for commercial applications, the device delivers 600,000 system gates, 13,824 logic elements, and 172 digital I/Os, while supporting on-chip analog data acquisition and MOSFET gate driver outputs for compact system implementations.

Key Features

  • Core Architecture — Flash-based CMOS process with nonvolatile configuration; 600,000 system gates and 13,824 logic elements provide substantial programmable logic capacity.
  • Embedded Memory — Approximately 0.11 Mbits (110,592 bits) of on-chip RAM and family-level embedded flash (AFS600 devices include 4 Mbits total flash) for code, configuration and buffer storage.
  • Analog and Mixed-Signal Integration — Up to 12-bit ADC resolution at up to 600 ksps, with up to 30 analog input channels and built-in current and temperature monitor blocks; high-voltage analog input tolerance (−10.5 V to +12 V).
  • Digital I/O and Standards — 172 maximum digital I/Os, bank-selectable mixed-voltage operation (1.5 V, 1.8 V, 2.5 V, 3.3 V), and support for common single-ended and differential signaling standards.
  • Clocking and Timing — Internal 100 MHz RC oscillator, crystal support, 6 clock conditioning circuits with up to 2 integrated PLLs, and system performance up to 350 MHz (family specification).
  • Power and Packaging — Surface-mount 484-FPBGA (23 × 23) package; core supply range 1.425 V to 1.575 V; device operates over a commercial temperature range of 0 °C to 70 °C and is RoHS compliant.
  • Low-Power and Power Management — Single 3.3 V I/O supply option with on-chip 1.5 V regulator and low-power modes such as sleep and standby (family features).
  • In-System Programming and Security — ISP capability with 128-bit AES via JTAG and FlashLock® for protecting FPGA contents (family-level features).

Typical Applications

  • Mixed-Signal Data Acquisition: Integrate ADC channels and programmable logic to consolidate sensor front-ends, sampling and preprocessing in a single device.
  • Power and Motor Control: Use on-chip MOSFET gate driver outputs and analog monitors for compact motor drives and power-conversion control loops.
  • Embedded System Control: Implement glue logic, custom state machines or protocol bridges while leveraging embedded flash for nonvolatile configuration and instant-on operation.
  • Industrial and Commercial Instrumentation: Combine analog measurement, local signal processing and configurable I/O standards for instrumentation and test equipment.

Unique Advantages

  • Mixed-Signal Integration: Combines multi-channel ADCs, analog monitoring and MOSFET gate drivers with programmable logic to reduce BOM and board area.
  • Nonvolatile Flash Configuration: Flash-based architecture retains configuration when powered off, enabling instant-on behavior and simplified system startup.
  • Flexible I/O Voltage Support: Bank-selectable I/O voltages from 1.5 V to 3.3 V accommodate mixed-voltage systems without external level translators.
  • Secure In-System Programming: 128-bit AES ISP and FlashLock® protect device contents and enable secure field updates via JTAG.
  • Compact Commercial Package: 484-FPBGA (23 × 23) surface-mount packaging delivers high I/O density (172 I/Os) for space-constrained designs.
  • Scalable Family Options: Part of the Fusion® family with pin-compatible packages across device densities, enabling migration within the same package footprint.

Why Choose M7AFS600-2FGG484?

The M7AFS600-2FGG484 is positioned for commercial embedded designs that need a high degree of mixed-signal integration, substantial programmable logic (600k gates, 13,824 logic elements) and a high I/O count in a compact BGA package. Its combination of embedded RAM, multi-megahertz clocking capability, integrated ADC resources and MOSFET gate driver outputs makes it suitable for consolidating functions that would otherwise require multiple components.

As a member of the Fusion® family, this device offers nonvolatile flash configuration, secure ISP options and pin-compatible migration paths to other densities in the family, helping teams scale performance and memory without wholesale redesigns.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for the M7AFS600-2FGG484.

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