M7AFS600-2FGG484
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 172 110592 484-BGA |
|---|---|
| Quantity | 308 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 172 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M7AFS600-2FGG484 – Fusion® Field Programmable Gate Array (FPGA) IC, 172 I/O, 484-BGA
The M7AFS600-2FGG484 is a Fusion® family mixed-signal, flash-based FPGA from Microchip Technology supplied in a 484-ball FPBGA (23 × 23) surface-mount package. It combines reprogrammable flash logic, embedded memory, and integrated analog blocks to address commercial embedded designs that require mixed-signal integration and flexible I/O.
Engineered for commercial applications, the device delivers 600,000 system gates, 13,824 logic elements, and 172 digital I/Os, while supporting on-chip analog data acquisition and MOSFET gate driver outputs for compact system implementations.
Key Features
- Core Architecture — Flash-based CMOS process with nonvolatile configuration; 600,000 system gates and 13,824 logic elements provide substantial programmable logic capacity.
- Embedded Memory — Approximately 0.11 Mbits (110,592 bits) of on-chip RAM and family-level embedded flash (AFS600 devices include 4 Mbits total flash) for code, configuration and buffer storage.
- Analog and Mixed-Signal Integration — Up to 12-bit ADC resolution at up to 600 ksps, with up to 30 analog input channels and built-in current and temperature monitor blocks; high-voltage analog input tolerance (−10.5 V to +12 V).
- Digital I/O and Standards — 172 maximum digital I/Os, bank-selectable mixed-voltage operation (1.5 V, 1.8 V, 2.5 V, 3.3 V), and support for common single-ended and differential signaling standards.
- Clocking and Timing — Internal 100 MHz RC oscillator, crystal support, 6 clock conditioning circuits with up to 2 integrated PLLs, and system performance up to 350 MHz (family specification).
- Power and Packaging — Surface-mount 484-FPBGA (23 × 23) package; core supply range 1.425 V to 1.575 V; device operates over a commercial temperature range of 0 °C to 70 °C and is RoHS compliant.
- Low-Power and Power Management — Single 3.3 V I/O supply option with on-chip 1.5 V regulator and low-power modes such as sleep and standby (family features).
- In-System Programming and Security — ISP capability with 128-bit AES via JTAG and FlashLock® for protecting FPGA contents (family-level features).
Typical Applications
- Mixed-Signal Data Acquisition: Integrate ADC channels and programmable logic to consolidate sensor front-ends, sampling and preprocessing in a single device.
- Power and Motor Control: Use on-chip MOSFET gate driver outputs and analog monitors for compact motor drives and power-conversion control loops.
- Embedded System Control: Implement glue logic, custom state machines or protocol bridges while leveraging embedded flash for nonvolatile configuration and instant-on operation.
- Industrial and Commercial Instrumentation: Combine analog measurement, local signal processing and configurable I/O standards for instrumentation and test equipment.
Unique Advantages
- Mixed-Signal Integration: Combines multi-channel ADCs, analog monitoring and MOSFET gate drivers with programmable logic to reduce BOM and board area.
- Nonvolatile Flash Configuration: Flash-based architecture retains configuration when powered off, enabling instant-on behavior and simplified system startup.
- Flexible I/O Voltage Support: Bank-selectable I/O voltages from 1.5 V to 3.3 V accommodate mixed-voltage systems without external level translators.
- Secure In-System Programming: 128-bit AES ISP and FlashLock® protect device contents and enable secure field updates via JTAG.
- Compact Commercial Package: 484-FPBGA (23 × 23) surface-mount packaging delivers high I/O density (172 I/Os) for space-constrained designs.
- Scalable Family Options: Part of the Fusion® family with pin-compatible packages across device densities, enabling migration within the same package footprint.
Why Choose M7AFS600-2FGG484?
The M7AFS600-2FGG484 is positioned for commercial embedded designs that need a high degree of mixed-signal integration, substantial programmable logic (600k gates, 13,824 logic elements) and a high I/O count in a compact BGA package. Its combination of embedded RAM, multi-megahertz clocking capability, integrated ADC resources and MOSFET gate driver outputs makes it suitable for consolidating functions that would otherwise require multiple components.
As a member of the Fusion® family, this device offers nonvolatile flash configuration, secure ISP options and pin-compatible migration paths to other densities in the family, helping teams scale performance and memory without wholesale redesigns.
Request a quote or submit an inquiry to obtain pricing, lead time and availability for the M7AFS600-2FGG484.

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