MPF100TL-FCSG325I

The MPF100TL-FCSG325I is a PolarFire™ Field Programmable Gate Array (FPGA) IC in a 325-LFBGA (325-FCBGA, 11×11) surface-mount package. It provides a large logic resource set with 109,000 logic elements across 27,250 CLBs, approximately 7.78 Mbits of embedded memory and 170 user I/Os, making it suitable for complex system designs that require deterministic, reprogrammable logic.

Specified for industrial operation with a supply range of 0.970–1.08 V and an operating temperature range of –40 °C to 100 °C, this device targets applications that need extended temperature capability and robust board-level integration.

Key Features

• Core Logic  27,250 CLBs and 109,000 logic elements deliver extensive programmable logic capacity for complex finite-state machines, custom datapaths and control logic.
• Embedded Memory  Approximately 7.78 Mbits of on-chip RAM to support buffering, packet storage, lookup tables and intermediate data processing without external memory.
• I/O and Packaging  170 user I/Os in a 325-LFBGA (325-FCBGA, 11×11) surface-mount package enable high-density board integration and multiple external interface connections.
• Power  Core voltage supply range from 0.970 V to 1.08 V for compatibility with targeted power domains and system-level power planning.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to meet extended temperature requirements for industrial environments.
• Mounting and Package Details  Surface-mount 325-FCBGA (11×11) package simplifies placement on standard PCB assembly flows.
• Standards and Compliance  RoHS compliant for environmental and regulatory adherence in manufacturing.

Typical Applications

• Industrial Control & Automation  Extended temperature rating and industrial grade design make this FPGA suitable for motor control, PLC logic and factory instrumentation that require reliable operation across –40 °C to 100 °C.
• Communications and Networking  High logic capacity, embedded memory and 170 I/Os support protocol handling, packet buffering and interface bridging in networking and telecom equipment.
• Embedded Systems & Signal Processing  Large logic element count and on-chip RAM enable custom signal paths, preprocessing and deterministic control functions for embedded platforms.

Unique Advantages

• Substantial Logic Resources: 109,000 logic elements and 27,250 CLBs provide headroom for complex logic integration and iterative design updates without immediate part changes.
• Integrated On-Chip Memory: Approximately 7.78 Mbits of embedded RAM reduces dependence on external memory, simplifying BOM and lowering system latency for data buffering tasks.
• High I/O Density: 170 user I/Os in a compact 325-FCBGA package enable multiple peripheral and protocol interfaces on a single device footprint.
• Industrial Temperature Range: Rated from –40 °C to 100 °C to support deployment in harsh or wide-range temperature environments typical of industrial applications.
• Low-Voltage Core Operation: Core supply range of 0.970–1.08 V supports integration into modern power architectures and system-level power optimization.
• RoHS Compliant: Meets common environmental requirements for manufacturing and assembly.

Why Choose MPF100TL-FCSG325I?

The MPF100TL-FCSG325I combines a large programmable logic fabric, substantial embedded memory and a high I/O count in a compact 325-FCBGA package targeted at industrial applications. Its specified operating voltage and extended temperature range make it well suited to designs that require reliable, reprogrammable logic in challenging environments.

This FPGA is a practical choice for engineers building mid- to high-complexity systems—industrial controllers, networking modules and embedded signal-processing platforms—who need scalable logic capacity, on-chip memory and robust thermal performance with RoHS compliance.

Request a quote or submit your procurement request for the MPF100TL-FCSG325I to receive pricing and availability information tailored to your project needs.