MPF100TS-1FCG484I

The MPF100TS-1FCG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a significant logic and memory footprint in a compact 484‑FCBGA (23×23) surface‑mount package targeted at industrial and embedded applications that require high I/O density and reliable operation across a wide temperature range.

With large on‑chip memory and a substantial number of logic elements, this device is designed to support complex logic, data buffering and interfacing tasks while operating from a low‑voltage core supply.

Key Features

• Logic Capacity — 27,250 LABs and 109,000 logic element cells provide a large fabric for implementing complex digital functions and custom accelerators.
• Embedded Memory — Approximately 7.78 Mbits of on‑chip RAM to support frame buffering, packet storage and intermediate data sets without reliance on external memory.
• I/O Resources — 244 general‑purpose I/Os enable extensive peripheral, sensor and interface connectivity directly from the FPGA.
• Power Supply — Core voltage range of 0.97 V to 1.08 V for the FPGA core supply domain.
• Package & Mounting — Supplier device package: 484‑FCBGA (23×23); surface mount mounting for board‑level integration.
• Temperature & Grade — Industrial grade operation with an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance — RoHS compliant for regional environmental requirements.

Typical Applications

• Industrial Control & Automation — Use the device’s industrial temperature rating and abundant I/O to implement sensor interfacing, motor control logic and protocol bridging in factory equipment.
• Communications & Networking — Large logic resources and on‑chip RAM support packet processing, buffering and custom protocol implementations in networking equipment.
• Embedded Signal Processing — Combine the FPGA’s logic capacity and embedded memory for data‑path acceleration, filtering and real‑time processing tasks.
• I/O Aggregation & Interface Bridging — High I/O count allows consolidation of multiple peripheral interfaces and reduces external glue logic.

Unique Advantages

• High logic density: 109,000 logic element cells enable large or multiple concurrent designs on a single device.
• Substantial embedded memory: Approximately 7.78 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and temporary storage tasks.
• Broad I/O capability: 244 I/Os provide flexibility to connect sensors, transceivers and peripherals directly to the FPGA fabric.
• Industrial robustness: Rated for −40 °C to 100 °C operation to meet demanding thermal environments.
• Compact, board‑ready package: 484‑FCBGA (23×23) surface‑mount package supports high‑density PCB integration while keeping board footprint predictable.
• Low‑voltage core operation: Core supply range of 0.97–1.08 V supports designs targeting efficient power budgets.

Why Choose MPF100TS-1FCG484I?

The MPF100TS-1FCG484I combines a large logic fabric, multi‑megabit on‑chip RAM and a high I/O count in a compact industrial‑grade FCBGA package. This combination makes it well suited to embedded and industrial applications where integration, I/O density and reliable temperature performance are key design drivers.

Designed and manufactured by Microchip Technology, the device offers a balanced mix of logic capacity, memory and robust operating parameters for teams building scalable, long‑lived industrial and embedded systems.

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