MPF200T-1FCSG325E

The MPF200T-1FCSG325E is a PolarFire™ Field Programmable Gate Array (FPGA) IC in a 325-LFBGA package (supplier package: 325-FCBGA, 11×14.5). It delivers high logic capacity with 192,000 logic elements and approximately 13.62 Mbits of on-chip RAM, combined with 170 I/O pins and a compact surface-mount BGA footprint.

This device operates from a core supply range of 0.97 V to 1.08 V and is specified for extended-grade operation from 0 °C to 100 °C. It is RoHS compliant.

Key Features

• Logic Capacity — 192,000 logic elements provide substantial programmable fabric for complex logic implementations and system integration.
• Embedded Memory — Approximately 13.62 Mbits of on-chip RAM to support buffering, state storage, and embedded data structures without external memory.
• I/O and Packaging — 170 I/O pins in a 325-LFBGA package (supplier package 325-FCBGA, 11×14.5) delivered in a surface-mount form factor for compact board designs.
• Power Supply — Core voltage range of 0.97 V to 1.08 V for predictable power budgeting and integration with system power rails.
• Temperature and Grade — Extended-grade device with an operating temperature range of 0 °C to 100 °C, suitable for standard commercial and extended-environment deployments.
• Regulatory Compliance — RoHS compliant.

Unique Advantages

• High programmable density: 192,000 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 13.62 Mbits of embedded RAM supports large buffers and local data processing without immediate need for external memory.
• Generous I/O in a compact package: 170 I/O pins in a 325-LFBGA (11×14.5) package provide broad external connectivity while minimizing PCB area.
• Defined power envelope: Core supply specified between 0.97 V and 1.08 V aids in precise power-supply design and thermal planning.
• Extended-grade and RoHS compliant: Rated 0 °C to 100 °C and RoHS compliant for deployments that require extended commercial temperature operation and environmental compliance.

Why Choose MPF200T-1FCSG325E?

The MPF200T-1FCSG325E is positioned for designs that require a high-density PolarFire FPGA with significant embedded memory and a substantial number of I/O in a compact BGA package. Its combination of 192,000 logic elements, approximately 13.62 Mbits of on-chip RAM, and 170 I/O pins makes it suitable where consolidation of logic and local memory is a priority.

With a defined core voltage range and extended-grade temperature rating, this device supports predictable power and thermal planning while meeting RoHS environmental requirements. It is appropriate for design teams seeking a verified specification set for integration into complex, space-constrained FPGA designs.

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