MPF200T-1FCVG484E
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 284 13619200 192000 484-BFBGA |
|---|---|
| Quantity | 326 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (19x19) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BFBGA | Number of I/O | 284 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 48000 | Number of Logic Elements/Cells | 192000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13619200 |
Overview of MPF200T-1FCVG484E – PolarFire™ Field Programmable Gate Array (FPGA) IC, 192,000 logic elements, 284 I/Os
The MPF200T-1FCVG484E is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a high logic capacity and on-chip memory in a 484-BFBGA package, supporting designs that require substantial programmable logic, embedded memory and a large number of I/Os.
Key on-chip resources include 192,000 logic elements and approximately 13.62 Mbits of embedded memory, while the device is specified for extended-grade operation and RoHS compliance.
Key Features
- Core / Logic Provides 192,000 logic elements for implementing complex digital logic and custom accelerators.
- Embedded Memory Approximately 13.62 Mbits of on-chip RAM to support buffering, LUT-based storage and local data structures.
- I/O & Package 284 user I/Os in a 484-BFBGA package (supplier device package: 484-FPBGA, 19×19) for high-density board-level integration.
- Power Supply Core supply range specified at 0.970 V to 1.080 V for devices designed around a low-voltage core domain.
- Operating Conditions & Grade Extended-grade device with an operating temperature range of 0 °C to 100 °C suitable for many commercial and industrial ambient environments.
- Mounting & Compliance Surface-mount BFBGA package and RoHS-compliant construction.
Unique Advantages
- High logic capacity: 192,000 logic elements provide headroom for complex designs and multi-function implementations.
- Substantial embedded memory: Approximately 13.62 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
- Flexible I/O count: 284 I/Os allow for broad interface connectivity without immediate external multiplexing.
- Compact, industry-standard package: 484-BFBGA (484-FPBGA, 19×19) enables dense board layouts while supporting high pin counts.
- Extended-grade operation: Rated for 0 °C to 100 °C, enabling deployment in applications requiring above-room-temperature operation.
- Regulatory compliance: RoHS-compliant construction supports regulatory and environmental requirements.
Why Choose MPF200T-1FCVG484E?
The MPF200T-1FCVG484E combines high logic density, ample embedded memory and a large I/O complement in a single PolarFire™ FPGA package from Microchip Technology. Its configuration is suited to designs that demand significant programmable logic and on-chip RAM while maintaining a compact board footprint.
With extended-grade temperature rating, surface-mount BFBGA packaging and RoHS compliance, this device offers a balance of performance, integration and environmental compliance for engineering teams focused on robust, scalable FPGA-based designs.
Request a quote or submit a purchase inquiry today to learn more about availability and lead times for the MPF200T-1FCVG484E.
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