MPF200T-FCG484E

The MPF200T-FCG484E is a PolarFire™ Field Programmable Gate Array (FPGA) IC designed to deliver substantial logic capacity, embedded memory, and a broad I/O complement in a compact FCBGA package. It targets designs that require high logic density and significant on-chip RAM while operating within an extended commercial temperature range.

Key value comes from a combination of 192,000 logic elements, approximately 13.6 Mbits of embedded memory, and 244 I/O pins, all supplied in a 484-FCBGA (23 × 23) surface-mount package with RoHS compliance.

Key Features

• Logic Capacity  192,000 logic elements provide large-scale programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 13.6 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive algorithms.
• I/O and Package  244 I/O pins in a 484-BBGA / 484-FCBGA (23 × 23) package, delivered as a surface-mount device for dense board layouts.
• Power Supply  Core supply range from 970 mV to 1.08 V, enabling operation within specified low-voltage bounds.
• Operating Range & Grade  Extended-grade device rated for operation from 0 °C to 100 °C to suit a variety of commercial and embedded applications.
• Compliance  RoHS compliant.

Typical Applications

• Custom digital logic and prototyping  Use the large logic element count and embedded RAM for complex state machines, protocol implementations, and custom accelerators.
• Signal processing and hardware acceleration  On-chip memory and abundant logic resources support buffering and parallel processing for DSP and streaming workloads.
• Communication and I/O-intensive systems  The 244 I/O pins and compact FCBGA package enable dense connectivity for multi-channel interfaces and protocol aggregation.
• Embedded systems and appliances  Extended operating temperature and surface-mount packaging make the device suitable for a range of embedded controllers and appliance-level electronics.

Unique Advantages

• High logic density: 192,000 logic elements allow integration of complex functions on a single device, reducing the need for multiple FPGAs or external glue logic.
• Substantial on-chip memory: Approximately 13.6 Mbits of embedded RAM helps minimize external memory dependence and improve data throughput.
• Broad I/O capability: 244 I/O pins enable flexible interfacing to peripherals, sensors, and high-channel-count systems.
• Compact, surface-mount package: 484-FCBGA (23 × 23) packaging supports high-density PCB designs while maintaining mechanical and electrical integration.
• Low-voltage core operation: Core supply range of 970 mV to 1.08 V aligns with modern low-voltage design practices.
• Extended temperature grade: Rated 0 °C to 100 °C for applications requiring reliable operation across typical commercial and embedded temperature ranges.

Why Choose MPF200T-FCG484E?

The MPF200T-FCG484E positions itself as a high-capacity, memory-rich PolarFire™ FPGA option for designers needing large programmable logic resources, significant on-chip RAM, and a high I/O count in a compact FCBGA package. Its extended temperature rating and RoHS compliance make it suitable for a wide range of commercial and embedded projects.

This device is well suited to engineering teams building complex digital systems, hardware accelerators, and multi-interface controllers that benefit from a single-device implementation to reduce BOM complexity and streamline board design. The combination of logic density, embedded memory, and packaging supports scalable designs with long-term maintainability.

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