MPF200T-FCG784I

The MPF200T-FCG784I is a PolarFire™ field programmable gate array (FPGA) in a 784-ball FCBGA package, specified for industrial applications. It delivers high logic density and embedded memory for complex digital designs while supporting a wide operating temperature range and low-voltage core operation.

This device is suited for systems that require large on-chip logic capacity, significant embedded RAM, and a substantial number of I/O connections in a surface-mount FCBGA footprint.

Key Features

• Logic Capacity — 48,000 CLBs providing 192,000 logic elements to implement complex digital functions and custom processing blocks.
• Embedded Memory — Approximately 13.62 Mbits of on-chip RAM to support buffering, packet storage, and stateful logic without external memory.
• I/O — 364 user I/O pins to accommodate multiple interfaces, parallel buses, and multi-channel connectivity.
• Power Supply — Core voltage range from 0.97 V to 1.08 V for optimized low-voltage operation.
• Package & Mounting — 784-ball BGA (784-FCBGA, 29×29) in a surface-mount package to support compact, high-density board designs.
• Temperature & Grade — Industrial grade device rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control Systems — Use the device’s industrial temperature range and high logic capacity to implement real-time control, signal processing, and deterministic I/O handling.
• Communications Infrastructure — Leverage the large embedded RAM and abundant I/O to support packet buffering, protocol bridging, and multi-port data plane functions.
• Instrumentation and Test Equipment — Employ the FPGA’s logic resources and flexible I/O to implement custom measurement, data aggregation, and pre-processing tasks.

Unique Advantages

• High Logic Density: 192,000 logic elements enable complex SoC-style implementations and extensive custom logic integration on a single device.
• Significant On-Chip Memory: Approximately 13.62 Mbits of embedded RAM reduce dependence on external memory for buffering and real-time data handling.
• Large I/O Count: 364 I/O pins simplify system integration by accommodating multiple interfaces and parallel connections without external expander logic.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet the thermal requirements of harsh and temperature-variable environments.
• Compact Surface-Mount Package: 784-FCBGA (29×29) package supports high-density PCB layouts while maintaining broad functionality.
• Low-Voltage Core Operation: Core supply range of 0.97 V to 1.08 V supports efficient power budgeting in constrained power envelopes.

Why Choose MPF200T-FCG784I?

The MPF200T-FCG784I combines substantial logic resources, meaningful on-chip memory, and a high I/O count in an industrial-grade, surface-mount FCBGA package. It is positioned for designers who need to consolidate complex digital processing, buffering, and interface tasks into a single FPGA while meeting industrial thermal and mounting requirements.

This device is a practical choice for engineering teams building scalable, robust systems where logic capacity, embedded memory, and reliable operation across a wide temperature range are essential. Its package and specifications support compact board designs and long-term deployment in industrial environments.

Request a quote or submit your requirements to get pricing and availability for the MPF200T-FCG784I.