MPF200T-FCSG536E

The MPF200T-FCSG536E is a PolarFire™ field programmable gate array (FPGA) from Microchip Technology. It provides a fixed hardware platform with 192,000 logic elements, approximately 13.6 Mbits of embedded memory, and 300 configurable I/Os for complex digital designs.

This device is supplied in a 536‑LFBGA / 536‑CSPBGA (16×16) package, operates from 0 °C to 100 °C, and uses a core supply range of 970 mV to 1.08 V. It is RoHS compliant and specified in Extended grade.

Key Features

• Logic Capacity — 192,000 logic elements to implement large-scale digital designs and complex programmable functions.
• Embedded Memory — Approximately 13.6 Mbits of on-chip RAM to support data buffering, lookup tables, and state storage.
• I/O Count — 300 user I/Os to interface with peripherals, sensors, and external logic.
• Power Supply — Core voltage range from 970 mV to 1.08 V to match system power-rail requirements.
• Package and Mounting — Available in a 536‑LFBGA, CSPBGA (536‑CSPBGA, 16×16) package and designed for surface-mount assembly.
• Temperature and Grade — Extended-grade device with an operating temperature range of 0 °C to 100 °C for deployment in controlled-ambient environments.
• Regulatory — RoHS compliant.

Typical Applications

• High-density logic implementations — Deploy where 192,000 logic elements are required for complex finite-state machines, custom datapaths, or algorithm acceleration.
• Memory-intensive FPGA functions — Use the device’s approximately 13.6 Mbits of embedded RAM for buffering, packet processing, and large lookup tables.
• High-pin-count I/O designs — Apply when up to 300 I/Os are needed for multi-channel interfaces, parallel peripherals, or broad sensor arrays.
• Compact board layouts — Leverage the 536‑CSPBGA (16×16) package for high I/O density in space-constrained PCBs.

Unique Advantages

• Substantial logic resources — 192,000 logic elements enable consolidation of multiple functions into a single FPGA, simplifying system partitioning.
• Significant embedded memory — Approximately 13.6 Mbits of on-chip RAM reduces dependence on external memory for many buffering and table-driven tasks.
• High I/O integration — 300 I/Os support extensive peripheral connectivity without additional interface chips.
• Compact packaging — 536‑CSPBGA (16×16) provides a balance of I/O count and board space efficiency for compact systems.
• Controlled operating envelope — Extended grade and a 0 °C to 100 °C operating range provide predictable behavior within specified ambient conditions.

Why Choose MPF200T-FCSG536E?

The MPF200T-FCSG536E positions itself as a highly capable PolarFire FPGA option for designs that require a large number of logic elements, sizable on-chip RAM, and substantial I/O capacity in a compact surface-mount package. Its defined core voltage range and extended operating temperature rating make it suitable for systems designed to operate within those electrical and thermal bounds.

Designers seeking to integrate complex digital functions and memory-intensive logic into a single, RoHS-compliant device will find the MPF200T-FCSG536E applicable for projects where the cited specifications align with system requirements.

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