MPF200T-FCSG325I

The MPF200T-FCSG325I is a PolarFire Field Programmable Gate Array (FPGA) IC from Microchip Technology delivering 192,000 logic elements and substantial on-chip memory for industrial applications. Packaged in a 325-ball LFBGA/FC format with surface-mount mounting, it provides a combination of logic density, I/O capacity and industrial temperature range for programmable control and system integration tasks.

Key Features

• Programmable Logic Density — 192,000 logic elements to implement complex custom logic and control functions.
• Embedded Memory — Approximately 13.62 Mbits of on-chip RAM to support buffering, state storage and data processing within the FPGA fabric.
• I/O Capability — 170 user I/O pins to interface with sensors, peripherals, transceivers and external logic.
• Power — Core voltage supply range of 970 mV to 1.08 V for the device core power domain.
• Package & Mounting — 325-LFBGA, FC package (supplier device package: 325-FCBGA, 11 × 14.5 mm) with surface-mount mounting for compact board integration.
• Industrial Temperature Grade — Rated for operation from -40°C to 100°C to meet demanding environmental conditions.
• Regulatory Compliance — RoHS compliant material declaration for environmental compliance.

Typical Applications

• Industrial Control Systems — Programmable logic and on-chip memory support motor control, PLC functions and machine automation tasks within industrial temperature ranges.
• Industrial I/O Aggregation — 170 I/O pins enable aggregation and protocol bridging for multiple sensors, actuators and field interfaces.
• Embedded Logic Acceleration — Dense logic resources and embedded RAM allow offloading custom data-paths and control loops from host processors in industrial embedded designs.

Unique Advantages

• High Logic Capacity: 192,000 logic elements provide the resources needed for large, integrated FPGA designs without external logic expansion.
• Significant On-Chip Memory: Approximately 13.62 Mbits of embedded RAM minimizes external memory dependence for buffering and state storage.
• Generous I/O Count: 170 I/O pins give flexibility in system partitioning and direct interfacing to peripherals and sensors.
• Industrial Reliability: Specified -40°C to 100°C operating range supports deployment in harsh industrial environments.
• Compact, Surface-Mount Package: 325-LFBGA / 325-FCBGA (11 × 14.5 mm) package enables space-efficient board designs.
• Manufacturer Backing: Part of the PolarFire FPGA family from Microchip Technology, offering consistent form-factor and specification references.

Why Choose MPF200T-FCSG325I?

The MPF200T-FCSG325I targets industrial customers needing a high-density, RoHS-compliant FPGA with substantial embedded memory and a broad I/O complement. Its combination of 192,000 logic elements, approximately 13.62 Mbits of on-chip RAM and a 170-pin I/O footprint provides a solid platform for integrating complex control, data-path and interface functions on a single device.

With a surface-mount 325-ball LFBGA package and an operating range from -40°C to 100°C, this PolarFire FPGA is positioned for robust, space-conscious designs where long-term stability and integration matter. It is suitable for engineers and procurement teams specifying industrial-grade programmable logic for embedded and automation applications.

Request a quote or submit an inquiry for MPF200T-FCSG325I to check availability and pricing for your design needs.