MPF200T-FCSG536I

The MPF200T-FCSG536I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a dense array of programmable logic with approximately 13.6 Mbits of embedded memory and 300 general I/Os, packaged for surface-mount applications.

Designed for industrial-grade applications, this device targets designs that require high logic capacity, substantial on-chip RAM, and extensive I/O connectivity while operating across a wide industrial temperature range.

Key Features

• Programmable Logic 192,000 logic elements provide substantial configurable fabric for complex logic and custom processing pipelines.
• Embedded Memory Approximately 13.6 Mbits of on-chip RAM to support buffering, state storage, and data processing without external memory dependency.
• I/O Density 300 available I/Os to accommodate multiple peripherals, interfaces, and high-pin-count system integration.
• Power Supply Operates from 0.97 V to 1.08 V supply range, enabling precise power-domain planning in system designs.
• Package & Mounting 536-LFBGA (536-CSPBGA, 16×16) surface-mount package for compact board-level integration and reliable solder attachment.
• Industrial Temperature Grade Qualified to operate from -40 °C to 100 °C, suitable for industrial environments and temperature-stressed deployments.
• Environmental Compliance RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• Industrial Control & Automation — Leverages high logic density and numerous I/Os for motor control, PLC functions, and distributed automation nodes.
• Embedded Processing — Uses on-chip RAM and programmable logic for custom data handling, protocol offload, and real-time processing tasks.
• I/O-Intensive Systems — Supports interface aggregation, protocol bridging, and sensor/actuator connectivity with its 300 I/Os.

Unique Advantages

• High Logic Capacity: 192,000 logic elements enable implementation of complex finite-state machines, datapaths, and custom accelerators without external programmable logic.
• Significant On-Chip Memory: Approximately 13.6 Mbits of embedded RAM reduces reliance on external memory, simplifying board design and improving determinism.
• Large I/O Count: 300 I/Os allow direct connection to multiple peripherals and buses, minimizing the need for additional interface chips.
• Industrial Temperature Range: Rated from -40 °C to 100 °C to meet the needs of temperature-challenging industrial environments.
• Compact Surface-Mount Package: 536-LFBGA (CSPBGA) footprint balances pin count and board area for dense system integration.
• Regulatory Compliance: RoHS compliance supports environmentally constrained designs and procurement requirements.

Why Choose MPF200T-FCSG536I?

The MPF200T-FCSG536I combines a large programmable fabric, substantial embedded memory, and a high I/O count in a single industrial-grade, surface-mount package. It is positioned for designs that require extensive on-chip resources and reliable operation across industrial temperature ranges.

This device suits engineering teams building scalable, robust systems where on-board logic capacity, internal RAM, and broad connectivity reduce external components and simplify system architecture. Its specifications offer clear trade-offs for teams prioritizing logic density, embedded storage, and industrial temperature tolerance.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the MPF200T-FCSG536I.