MPF200T-FCVG484T2

The MPF200T-FCVG484T2 is a PolarFire™ field programmable gate array (FPGA) IC designed for high-density, low-power programmable logic. It delivers 192,000 logic elements, approximately 13.95 Mbits of embedded memory, and 284 I/Os in a compact 484‑BFBGA package suitable for surface-mount assembly.

With AEC-Q100 qualification and an operating range from −40 °C to 125 °C, this device targets demanding automotive and embedded applications that require reliable, configurable hardware acceleration and I/O integration at low core voltage.

Key Features

• Core Logic 192,000 logic elements for implementing complex custom logic, state machines, and hardware accelerators.
• Embedded Memory Approximately 13.95 Mbits of on-chip RAM to support buffering, lookup tables, and data staging without external memory in many designs.
• I/O Density 284 I/O pins to connect multiple peripherals, sensors, or high-channel-count interfaces directly to the FPGA fabric.
• Power and Voltage Operates from 970 mV to 1.08 V core supply, enabling low-voltage system designs and power-optimized implementations.
• Package & Mounting 484‑BFBGA package (supplier package: 484‑FBGA, 19×19) in a surface-mount form factor for space-efficient PCB layouts.
• Automotive Qualification AEC‑Q100 qualified and designated as automotive grade for use in in-vehicle applications that require component-level automotive qualification.
• Temperature Range Rated for operation from −40 °C to 125 °C to support extended-temperature and automotive environments.

Typical Applications

• Automotive electronics — AEC‑Q100 qualification and extended temperature range make this FPGA suitable for in-vehicle control, infotainment interfacing, and domain-specific logic functions.
• Embedded compute and acceleration — Use the device to implement custom accelerators, protocol offloads, or deterministic control logic where on-chip memory and dense logic are required.
• I/O aggregation and bridging — High I/O count supports multiplexing, protocol bridging, and sensor/interface consolidation on compact PCBs.

Unique Advantages

• High logic density: 192,000 logic elements enable complex designs and multiple concurrent functions on a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 13.95 Mbits of on-chip RAM lowers reliance on external memory for many data-path and buffering needs.
• Broad I/O capability: 284 I/Os support dense connectivity to sensors, controllers, and interface transceivers without additional bridge devices.
• Automotive-grade reliability: AEC‑Q100 qualification supports use in automotive applications that demand component-level qualification and long-term robustness.
• Compact, manufacturable package: 484‑BFBGA surface-mount package (484‑FBGA, 19×19) enables compact board layouts and automated assembly.
• Wide operating temperature and low-voltage operation: −40 °C to 125 °C range and 0.97–1.08 V supply enable deployment in temperature-challenging, power-sensitive systems.

Why Choose MPF200T-FCVG484T2?

The MPF200T-FCVG484T2 positions itself as a robust, automotive-qualified FPGA option that balances high logic capacity, significant on-chip memory, and extensive I/O in a compact surface-mount package. It is suited for engineers building configurable hardware for automotive and embedded applications that require deterministic logic, data buffering, and a high degree of integration.

Choosing this device supports designs that need scalability and reliability over extended temperature ranges while keeping board-level complexity and external component count under control. Its qualification and package choices help accelerate deployment in production automotive and embedded programs.

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