MPF200TL-FCG784E

The MPF200TL-FCG784E is a PolarFire™ field programmable gate array (FPGA) IC supplied in a 784‑ball FCBGA package. It provides a high-capacity programmable logic fabric with a large number of I/O and on-chip memory, designed for systems that require substantial logic resources and dense I/O integration.

With 192,000 logic elements, approximately 13.62 Mbits of embedded memory and up to 364 I/O, this device targets designs that need high logic density, significant embedded RAM and flexible interfacing while operating from a core supply of 0.97 V to 1.08 V.

Key Features

• Logic Capacity — 192,000 logic elements to implement complex programmable logic and custom data paths.
• Logic Block Count — Equivalent to 48,000 logic blocks for structured logic partitioning and architectural mapping.
• Embedded Memory — Approximately 13.62 Mbits of on‑chip RAM for buffering, lookup tables and on‑chip data storage.
• I/O Density — 364 I/O pins to support high‑pin‑count interfaces and dense peripheral connectivity.
• Package and Mounting — 784‑ball FCBGA (29 × 29 mm) surface‑mount package for compact board integration.
• Power Supply Range — Core operating range from 0.97 V to 1.08 V to match system power domains.
• Operating Temperature — Rated for 0 °C to 100 °C; device grade: Extended.
• Environment — RoHS compliant.

Typical Applications

• High‑density digital logic systems — Implements large custom logic functions and data processing pipelines using abundant logic elements and embedded memory.
• Interface aggregation and I/O expansion — Supports designs that require many peripheral connections and multi‑lane interfaces thanks to 364 I/O pins.
• Embedded buffering and data handling — Uses on‑chip RAM for temporary storage, FIFOs and packet buffering in data‑centric designs.

Unique Advantages

• Substantial programmable capacity: 192,000 logic elements enable implementation of complex algorithms and custom accelerators on a single device.
• Significant on‑chip RAM: Approximately 13.62 Mbits of embedded memory reduces dependence on external DRAM for many buffering and table lookup tasks.
• High I/O count: 364 I/O pins provide flexibility for multi‑interface designs and dense peripheral connectivity, simplifying board routing.
• Compact, manufacturable package: 784‑ball FCBGA (29 × 29 mm) surface‑mount package supports compact system layouts and automated assembly.
• RoHS compliance: Environmentally compliant material status for deployment in regulated markets.

Why Choose MPF200TL-FCG784E?

The MPF200TL-FCG784E positions itself as a high‑capacity PolarFire FPGA option for designs that require a combination of large programmable logic resources, substantial on‑chip RAM and a high I/O count in a compact FCBGA package. Its extended temperature grade and RoHS compliance make it suitable for a wide range of electronic systems that operate within the specified thermal and voltage ranges.

Choose this device when your design needs scaleable logic, on‑chip memory for buffering and lookup tasks, and dense connectivity while maintaining compact board footprint and surface‑mount assembly compatibility.

Request a quote or submit a parts inquiry to receive pricing and availability information for the MPF200TL-FCG784E. Our team can provide lead‑time details and support documentation upon request.