MPF200TL-FCG484I

The MPF200TL-FCG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology, packaged in a 484-BFBGA surface-mount package. It provides 192,000 logic elements, approximately 13.6 Mbits of embedded memory, and 244 I/O pins, designed for industrial applications requiring substantial on-chip logic, memory and I/O capacity.

With an industrial operating temperature range and a low-voltage core supply window, this FPGA is positioned for designs that need high integration and reliable operation across a broad temperature range.

Key Features

• Core Logic 192,000 logic elements for implementing complex custom logic, state machines, and data-paths.
• Embedded Memory Approximately 13.6 Mbits of on-chip RAM to support buffering, packet queues, and local data storage.
• I/O Capacity 244 I/O pins to interface with multiple peripherals, sensors, and external devices.
• Package & Mounting 484-BFBGA package (supplier package: 484-FPBGA, 19×19) in a surface-mount form factor for compact board layouts.
• Power Core voltage supply range from 970 mV to 1.08 V to match low-voltage system domains.
• Temperature Range Rated for industrial operation from -40 °C to 100 °C.
• RoHS Compliance Meets RoHS requirements for materials compliance.

Typical Applications

• Industrial Control — Implement control logic, sensor aggregation, and machine interfacing using the device’s high logic capacity and industrial temperature rating.
• Embedded Computing — Use the large logic element count and on-chip memory for custom processing, data handling, and protocol offload in embedded systems.
• High-Density I/O Systems — Leverage 244 I/Os for multi-channel interfaces, signal routing, and peripheral connectivity in compact designs.

Unique Advantages

• High Logic Capacity: 192,000 logic elements enable implementation of sizeable custom logic and parallel processing pipelines.
• Substantial On-Chip Memory: Approximately 13.6 Mbits of embedded RAM reduces dependence on external memory for many buffering and local storage needs.
• Extensive I/O Count: 244 I/O pins provide flexibility for multi-interface designs and high channel counts.
• Industrial Temperature Capability: Rated from -40 °C to 100 °C for deployment in demanding thermal environments.
• Compact BFBGA Package: 484-BFBGA surface-mount package supports dense PCB integration while maintaining high pin count.
• Low-Voltage Core Operation: Core supply range (970 mV–1.08 V) supports low-voltage system architectures.

Why Choose MPF200TL-FCG484I?

The MPF200TL-FCG484I combines a high count of logic elements, significant embedded memory, and a large I/O complement in a compact 484-BFBGA package, making it well suited for industrial designs that demand on-chip capacity and reliable operation across a wide temperature range. Its low-voltage core and RoHS compliance further align with modern, space-constrained system designs.

This FPGA is appropriate for engineering teams building industrial control, embedded computing, or I/O-dense systems that require integrated logic, local memory resources, and robust thermal performance.

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