MPF200T-FCG484I

IC FPGA 244 I/O 484FCBGA
Part Description

PolarFire™ Field Programmable Gate Array (FPGA) IC 244 13619200 192000 484-BBGA, FCBGA

Quantity 472 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O244Voltage970 mV - 1.08 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs48000Number of Logic Elements/Cells192000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13619200

Overview of MPF200T-FCG484I – PolarFire™ FPGA, 192,000 logic elements, 484‑FCBGA

The MPF200T-FCG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high-density FPGA fabric with 192,000 logic elements and approximately 13.6 Mbits of embedded RAM in a 484‑ball FCBGA surface‑mount package.

Specified for industrial use, the device offers a broad operating temperature range and a comprehensive set of I/O, making it suitable for designs that require substantial logic capacity, on‑chip memory, and robust environmental tolerance.

Key Features

  • Logic Core Approximately 48,000 configurable logic blocks (CLBs) providing 192,000 logic elements for complex programmable logic and custom hardware acceleration.
  • Embedded Memory Approximately 13.6 Mbits of on‑chip RAM to support large buffering, state machines, and data‑path storage without external memory.
  • I/O and Package 244 user I/O pins in a 484‑ball FCBGA (23 × 23) package; surface‑mount mounting for compact board integration.
  • Power Core voltage supply range of 0.970 V to 1.080 V to match system power domains and support stable core operation.
  • Temperature and Grade Industrial grade device rated for operation from −40°C to 100°C for deployment in demanding temperature environments.
  • Compliance RoHS‑compliant construction to support regulatory requirements for electronic assemblies.

Unique Advantages

  • High logic density: 192,000 logic elements enable implementation of large digital designs on a single FPGA, reducing the need for multiple devices.
  • Substantial embedded memory: Approximately 13.6 Mbits of on‑chip RAM minimizes reliance on external memory for many applications.
  • Ample I/O count: 244 I/Os provide connectivity headroom for parallel interfaces, peripheral control, and system expansion.
  • Industrial temperature range: Rated from −40°C to 100°C for reliable operation in industrial and other temperature‑challenging environments.
  • Compact FCBGA package: 484‑ball FCBGA (23 × 23) surface‑mount package supports high‑density board layouts while maintaining thermal and electrical integrity.
  • Regulatory readiness: RoHS compliance simplifies use in lead‑free manufacturing processes.

Why Choose MPF200T-FCG484I?

The MPF200T-FCG484I positions itself as a robust, high‑capacity PolarFire FPGA solution for industrial designs that require a large number of logic elements, significant on‑chip RAM, and extensive I/O in a compact FCBGA footprint. Its specified core voltage range and wide operating temperature support stable deployment across varied environments.

Choose this device when your design demands consolidated programmable logic, embedded memory, and industrial‑grade environmental tolerance in a single, surface‑mount package from Microchip Technology.

Request a quote or submit a sales inquiry to obtain pricing, lead‑time, and availability for MPF200T-FCG484I.

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