MPF200T-1FCVG484T2

MPF200T-1FCVG484T2
Part Description

PolarFire™ Field Programmable Gate Array (FPGA) IC 284 13946061 192000 484-BFBGA

Quantity 418 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (19x19)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case484-BFBGANumber of I/O284Voltage970 mV - 1.08 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs48000Number of Logic Elements/Cells192000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits13946061

Overview of MPF200T-1FCVG484T2 – PolarFire™ Field Programmable Gate Array (FPGA) IC 284 13946061 192000 484-BFBGA

The MPF200T-1FCVG484T2 is a PolarFire™ field programmable gate array (FPGA) in a 484-BFBGA package. It provides a high integration of programmable logic, on-chip memory and I/O resources, delivered in a surface-mount package qualified to AEC-Q100.

Key electrical and environmental parameters include a core supply range of 970 mV to 1.08 V and an operating temperature span from -40 °C to 125 °C, supporting designs that require automotive-grade qualification and robust thermal range.

Key Features

  • Programmable Logic  192,000 logic elements provide substantial programmable capacity for complex digital designs.
  • Embedded Memory  Approximately 13.95 Mbits of on-chip RAM to support buffering, state storage and data processing functions.
  • I/O Density  284 user I/Os for flexible interfacing to external peripherals and subsystems.
  • Package and Mounting  484-ball BFBGA package (supplier device package: 484-FBGA, 19×19) in a surface-mount form factor for compact board-level integration.
  • Automotive Qualification  AEC-Q100 qualification and an Automotive grade designation, indicating suitability for automotive application environments.
  • Power and Temperature  Nominal core voltage range of 0.97–1.08 V and an operating temperature range of -40 °C to 125 °C for extended thermal resilience.
  • Environmental Compliance  RoHS compliant to meet lead-free assembly and regulatory requirements.

Unique Advantages

  • High integration density: The combination of 192,000 logic elements and approximately 13.95 Mbits of embedded memory reduces the need for external logic and memory components.
  • Automotive-qualified design: AEC-Q100 qualification and automotive grade classification provide traceable suitability for automotive environments.
  • Broad operating range: -40 °C to 125 °C operation supports deployment across demanding temperature conditions.
  • Compact, high-pin-count package: 484-ball BFBGA (19×19) delivers significant I/O in a space-efficient surface-mount footprint.
  • Low-voltage operation: Core supply range of 0.97–1.08 V enables compatibility with low-voltage system designs.
  • Regulatory-ready: RoHS compliance simplifies integration into lead-free manufacturing processes.

Why Choose MPF200T-1FCVG484T2?

The MPF200T-1FCVG484T2 positions itself as a high-capacity PolarFire™ FPGA option for designs that require substantial programmable logic, embedded memory and a large complement of I/Os within an automotive-qualified package. Its electrical and environmental specifications—low-voltage core operation and an extended -40 °C to 125 °C temperature range—align with applications demanding robustness and regulatory compliance.

This device is well suited for engineers and procurement focused on scalable FPGA resources, compact board-level integration, and the assurance of AEC-Q100 qualification and RoHS compliance. It delivers a balance of integration, thermal range and I/O density for long-term design projects.

Request a quote or submit a pricing inquiry to get availability and lead-time information for the MPF200T-1FCVG484T2.

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