MC94MX21DVKN3

IC MPU I.MX21 350MHZ 289LFBGA
Part Description

ARM926EJ-S Microprocessor IC i.MX21 1 Core, 32-Bit 350MHz 289-LFBGA (14x14)

Quantity 440 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMC94
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorARM926EJ-SDevice Package289-LFBGA (14x14)ECCN5A002A1 FRE
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-30°C ~ 70°C (TA)Package / Case289-LFBGARAM ControllersSDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed350MHz
Supplier Device Package289-LFBGA (14×14)USBUSB 1.x (2)Voltage – I/O1.8V, 3.0V

Overview of MC94MX21DVKN3 – IC MPU I.MX21 350MHz 289-LFBGA

The MC94MX21DVKN3 is an NXP Semiconductors i.MX21-series microprocessor based on a single ARM926EJ-S core running at up to 350 MHz. It targets portable and handheld products that require integrated multimedia, storage and peripheral functions within a compact surface-mount package.

Designed for mobile and embedded systems, the device combines a power-efficient ARM926EJ-S core with on-chip controllers and accelerators to reduce external BOM while supporting graphics, sensor and storage interfaces for rich multimedia applications.

Key Features

  • Processor Core Single ARM926EJ‑S 32‑bit core running at 350 MHz, providing a balance of processing performance and power efficiency.
  • Memory Controllers Integrated SDRAM controller for system memory, plus support for external memory expansion through on-chip memory interfaces.
  • Storage and Boot Options Built‑in NAND flash controller with on‑chip ECC and parity checking to support low‑cost NAND Flash devices as primary or secondary non‑volatile storage.
  • Multimedia and Graphics On‑chip video accelerator module and LCD controller provide graphics acceleration and display support for handheld multimedia applications.
  • Peripherals and Interfaces USB On‑The‑Go plus two USB 1.x hosts, two MMC/SD host controllers and PCMCIA/CF support offer flexible I/O and expansion paths. Additional interfaces include 1‑Wire, CMOS sensor interface and multiple synchronous serial ports.
  • Connectivity and System I/O Integrated UARTs, I2C and SPI interfaces plus GPIO give extensive system control and peripheral connectivity options.
  • Debug and System Control JTAG/Multi‑ICE support and on‑chip system control and clock management assist development and runtime reliability.
  • Package and Mounting 289‑pin LFBGA package (14×14 mm) in surface‑mount MAPBGA format, suitable for compact embedded designs.
  • Operating Range Specified operating temperature range of −30 °C to 70 °C for applications in varied environmental conditions.
  • Compliance RoHS‑compliant manufacturing status.

Typical Applications

  • Smartphones and Mobile Devices Integrated multimedia, USB OTG and sensor interfaces make the device suitable for handheld communication and multimedia features.
  • Portable Multimedia Players Video acceleration and LCD controller enable display and video playback functions in compact media players.
  • Imaging and Camera Modules CMOS sensor interface supports camera and imaging subsystems in portable devices.
  • Embedded Consumer Electronics SDRAM controller, multiple serial interfaces and flexible storage options support a range of consumer handheld products.

Unique Advantages

  • Highly integrated peripherals: On‑chip video accelerator, LCD controller, USB OTG, sensor and serial interfaces reduce external components and simplify board design.
  • Flexible storage support: NAND controller with ECC, MMC/SD hosts and PCMCIA/CF options enable designers to choose cost and capacity tradeoffs for non‑volatile storage.
  • Power‑efficient core: ARM926EJ‑S architecture delivers processing capability at low power, suitable for battery‑operated handhelds.
  • Compact surface‑mount package: 289‑pin LFBGA (14×14 mm) minimizes PCB footprint while providing a high pin count for system I/O.
  • Development and debug support: JTAG/Multi‑ICE compatibility and integrated system control features streamline bring‑up and validation.
  • Broad temperature capability: Rated for −30 °C to 70 °C operation to address a range of environmental conditions.

Why Choose MC94MX21DVKN3?

The MC94MX21DVKN3 combines an ARM926EJ‑S processing core with extensive on‑chip multimedia, storage and peripheral functions to deliver a compact, integrated solution for portable and handheld designs. Its combination of graphics acceleration, NAND ECC, USB OTG and multiple host controllers reduces external component count while supporting rich user experiences.

As part of the MC94 i.MX21 family, this device is suited to designers seeking a balanced mix of performance, integration and system flexibility for mobile multimedia, imaging and embedded consumer applications, offering scalability across related device variants.

Request a quote or submit a quotation request to receive pricing, availability and lead‑time information for the MC94MX21DVKN3. Our team can provide the details you need to evaluate this device for your next design.

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