MC68360ZP25VL

The MC68360ZP25VL is a single‑core CPU32+ microprocessor in the MC68360 series, featuring a 32‑bit core running at 25 MHz and integrated communications functionality. It combines a CPU32+ core, a Communications Processor Module (CPM), and a System Integration Module (SIM60) to support embedded communications and system integration in compact surface‑mount designs.

Designed for embedded systems requiring on‑chip communications resources and DRAM support, this device provides hardware interfaces and controllers that simplify implementation of networked and communications‑centric applications while operating from 3.3 V I/O and a 0 °C to 70 °C temperature range.

Key Features

• CPU Core  Single CPU32+ 32‑bit core running at 25 MHz for general‑purpose embedded processing.
• Communications Processor Module (CPM)  On‑chip CPM for communications offload and serial handling as described in the MC68360 series documentation.
• Ethernet  10 Mbps Ethernet support (1 port) for basic network connectivity.
• Memory Support  Integrated DRAM controller to interface with external DRAM memory.
• Serial and Peripheral Interfaces  Includes SCC and additional serial interfaces for diverse communications configurations.
• Power and I/O  3.3 V I/O signaling compatible with common embedded logic levels.
• Package and Mounting  357‑PBGA (25 × 25 mm) package in a surface‑mount form factor for compact board layouts.
• Operating Range  Specified for operation from 0 °C to 70 °C.
• Compliance  RoHS compliant.

Typical Applications

• Embedded Communications Equipment  Use the on‑chip CPM and serial interfaces to implement protocol handling and serial communications in networked appliances and controllers.
• Networking and Access Devices  10 Mbps Ethernet and integrated serial controllers support basic network connectivity and packet handling in small form‑factor network devices.
• Industrial and Commercial Embedded Controllers  CPU32+ processing with DRAM controller and 3.3 V I/O for control, monitoring, and system‑level integration in embedded systems.

Unique Advantages

• Integrated Communications Subsystem: The on‑chip Communications Processor Module reduces external component count and centralizes serial and protocol handling.
• Straightforward Memory Interface: Built‑in DRAM controller simplifies connection to external memory for data buffering and application code storage.
• Compact PBGA Package: 357‑PBGA (25 × 25 mm) surface‑mount package enables dense PCB layouts for space‑constrained designs.
• Industry‑Standard I/O Voltage: 3.3 V I/O compatibility eases integration with modern logic and peripheral devices.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product designs and supply requirements.

Why Choose MC68360ZP25VL?

The MC68360ZP25VL positions itself as an integrated solution for embedded designs that require a 32‑bit CPU32+ core paired with dedicated communications resources. Its combination of a CPM, serial controllers, DRAM interface, and 10 Mbps Ethernet in a compact PBGA package makes it suitable for projects that prioritize on‑chip communications and simplified system integration.

Engineers and procurement teams will find this device appropriate for product lines where moderate processing, integrated communications, and a compact surface‑mount package deliver long‑term value through reduced BOM complexity and clear interface support.

Request a quote or submit a procurement inquiry to evaluate MC68360ZP25VL for your next embedded communications design.