Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC68711E20CFUE3MC68711E20CFUE3NXP SemiconductorsIC MCU 8BIT 20KB OTP 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Size:
20KB (20K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
1,079
MC68711E20MFNE2N/AMC68711E20MFNE2NXP SemiconductorsIC MCU 8BIT 20KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 125°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Size:
20KB (20K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,730
MC68711E20MFNE3N/AMC68711E20MFNE3NXP SemiconductorsIC MCU 8BIT 20KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 125°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Size:
20KB (20K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
222
MC68711E20VFNE2N/AMC68711E20VFNE2NXP SemiconductorsIC MCU 8BIT 20KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 105°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Size:
20KB (20K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,412
MC68908GR16CFJEMC68908GR16CFJENXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
226
MC68908GR16MFJEMC68908GR16MFJENXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,192
MC68908GR16VFJEMC68908GR16VFJENXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
842
MC68908GZ16CFJEMC68908GZ16CFJENXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
381
MC68908GZ16MFJEMC68908GZ16MFJENXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
434
MC68908GZ16VFJEMC68908GZ16VFJENXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,472
MC68908GZ8CFAEMC68908GZ8CFAENXP SemiconductorsIC MCU 8BIT 8KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
37
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,329
MC68908GZ8CFJEMC68908GZ8CFJENXP SemiconductorsIC MCU 8BIT 8KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
501
MC68908GZ8CFJERMC68908GZ8CFJERNXP SemiconductorsIC MCU 8BIT 8KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,406
MC68908GZ8MFAEMC68908GZ8MFAENXP SemiconductorsIC MCU 8BIT 8KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
37
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,245
MC68908GZ8MFJEMC68908GZ8MFJENXP SemiconductorsIC MCU 8BIT 8KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
963
MC68908GZ8VFAEMC68908GZ8VFAENXP SemiconductorsIC MCU 8BIT 8KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
37
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
875
MC68908GZ8VFJEMC68908GZ8VFJENXP SemiconductorsIC MCU 8BIT 8KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
887
MC68CK16Z1CAG16MC68CK16Z1CAG16NXP SemiconductorsIC MCU 16BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
350
MC68CK331CAG16MC68CK331CAG16NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
115
MC68E360VR25VLR2MC68E360VR25VLR2NXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
73

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