Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC68HC16Z1CEH16MC68HC16Z1CEH16NXP SemiconductorsIC MCU 16BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
593
MC68HC16Z1CEH20MC68HC16Z1CEH20NXP SemiconductorsIC MCU 16BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU16
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
1,658
MC68HC16Z1CEH25MC68HC16Z1CEH25NXP SemiconductorsIC MCU 16BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU16
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
1,591
MC68HC16Z1CPV16MC68HC16Z1CPV16NXP SemiconductorsIC MCU 16BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
372
MC68HC16Z1CPV25MC68HC16Z1CPV25NXP SemiconductorsIC MCU 16BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU16
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
512
MC68HC16Z1MAG16MC68HC16Z1MAG16NXP SemiconductorsIC MCU 16BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,763
MC68HC16Z1MEH16MC68HC16Z1MEH16NXP SemiconductorsIC MCU 16BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
24
MC68HC16Z1VEH16MC68HC16Z1VEH16NXP SemiconductorsIC MCU 16BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A-40°C ~ 105°C (TA)
Core Processor:
CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
1,031
MC68HC705B16NCFNMC68HC705B16NCFNNXP SemiconductorsIC MCU 8BIT 15KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Size:
15KB (15K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
352 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
183
MC68HC705C8ABMC68HC705C8ABNXP SemiconductorsIC MCU 8BIT 8KB OTP 42DIPMicrocontrollers42-PDIPN/A0°C ~ 70°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
42-PDIP
Package / Case:
42-SDIP (0.600″”, 15.24mm)
667
MC68HC705C8ACFBMC68HC705C8ACFBNXP SemiconductorsIC MCU 8BIT 8KB OTP 44QFPMicrocontrollers44-QFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFP (10×10)
Package / Case:
44-QFP
104
MC68HC705C8ACFNMC68HC705C8ACFNNXP SemiconductorsIC MCU 8BIT 8KB OTP 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
87
MC68HC705C8ACFNEMC68HC705C8ACFNENXP SemiconductorsIC MCU 8BIT 8KB OTP 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
231
MC68HC705C8ACPMC68HC705C8ACPNXP SemiconductorsIC MCU 8BIT 8KB OTP 40DIPMicrocontrollers40-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIP
Package / Case:
40-DIP (0.600″”, 15.24mm)
1,767
MC68HC705C8AFNEMC68HC705C8AFNENXP SemiconductorsIC MCU 8BIT 8KB OTP 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A0°C ~ 70°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
314
MC68HC705C8AVFNEMC68HC705C8AVFNENXP SemiconductorsIC MCU 8BIT 8KB OTP 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 105°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
1,127
MC68HC705C9ACFBMC68HC705C9ACFBNXP SemiconductorsIC MCU 8BIT 16KB OTP 44QFPMicrocontrollers44-QFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
352 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFP (10×10)
Package / Case:
44-QFP
681
MC68HC705C9ACFBEMC68HC705C9ACFBENXP SemiconductorsIC MCU 8BIT 16KB OTP 44QFPMicrocontrollers44-QFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
352 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFP (10×10)
Package / Case:
44-QFP
352
MC68HC705C9ACFNMC68HC705C9ACFNNXP SemiconductorsIC MCU 8BIT 16KB OTP 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
352 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
550
MC68HC705C9ACPMC68HC705C9ACPNXP SemiconductorsIC MCU 8BIT 16KB OTP 40DIPMicrocontrollers40-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
352 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIP
Package / Case:
40-DIP (0.600″”, 15.24mm)
1,580

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