Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC68HC11D0CFBE2MC68HC11D0CFBE2NXP SemiconductorsIC MCU 8BIT ROMLESS 44QFPMicrocontrollers44-QFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
26
Program Memory Type:
ROMless
RAM Size:
192 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFP (10×10)
Package / Case:
44-QFP
185
MC68HC11D0CFBE3MC68HC11D0CFBE3NXP SemiconductorsIC MCU 8BIT ROMLESS 44QFPMicrocontrollers44-QFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
26
Program Memory Type:
ROMless
RAM Size:
192 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFP (10×10)
Package / Case:
44-QFP
720
MC68HC11D0CFNE2MC68HC11D0CFNE2NXP SemiconductorsIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
26
Program Memory Type:
ROMless
RAM Size:
192 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
1,387
MC68HC11D0CFNE3MC68HC11D0CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
26
Program Memory Type:
ROMless
RAM Size:
192 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
330
MC68HC11D0CFNE3RMC68HC11D0CFNE3RNXP SemiconductorsIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
26
Program Memory Type:
ROMless
RAM Size:
192 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
788
MC68HC11E0CFN2MC68HC11E0CFN2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,013
MC68HC11E0CFNE2MC68HC11E0CFNE2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,248
MC68HC11E0CFNE2RMC68HC11E0CFNE2RNXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
511
MC68HC11E0CFNE3MC68HC11E0CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
800
MC68HC11E0CFNE3RMC68HC11E0CFNE3RNXP SemiconductorsIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
1,615
MC68HC11E0MFNE2MC68HC11E0MFNE2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 125°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
907
MC68HC11E1CFN2MC68HC11E1CFN2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
793
MC68HC11E1CFN2R2MC68HC11E1CFN2R2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
374
MC68HC11E1CFN3MC68HC11E1CFN3NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
238
MC68HC11E1CFNE2MC68HC11E1CFNE2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,008
MC68HC11E1CFNE2RMC68HC11E1CFNE2RNXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
988
MC68HC11E1CFNE3MC68HC11E1CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
851
MC68HC11E1CFNE3RMC68HC11E1CFNE3RNXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
496
MC68HC11E1MFNE3MC68HC11E1MFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 125°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
315
MC68HC11E1VFNE3MC68HC11E1VFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 105°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
440

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