Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC68HC000EI10MC68HC000EI10NXP SemiconductorsIC MPU M680X0 10MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
10MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
1,444
MC68HC000EI10RMC68HC000EI10RNXP SemiconductorsIC MPU M680X0 10MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
10MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
1,270
MC68HC000EI12MC68HC000EI12NXP SemiconductorsIC MPU M680X0 12MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
12MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
566
MC68HC000EI16MC68HC000EI16NXP SemiconductorsIC MPU M680X0 16MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
62
MC68HC000EI16R2MC68HC000EI16R2NXP SemiconductorsIC MPU M680X0 16MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
1,954
MC68HC000EI20MC68HC000EI20NXP SemiconductorsIC MPU M680X0 20MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
20MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
652
MC68HC000EI8MC68HC000EI8NXP SemiconductorsIC MPU M680X0 8MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
8MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
1,580
MC68HC000EI8R2MC68HC000EI8R2NXP SemiconductorsIC MPU M680X0 8MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
8MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
1,289
MC68HC000FN16MC68HC000FN16NXP SemiconductorsIC MPU M680X0 16MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
512
MC68HC000FN16R2MC68HC000FN16R2NXP SemiconductorsIC MPU M680X0 16MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
692
MC68HC000IEI16RMC68HC000IEI16RNXP SemiconductorsIC MPU M680X0 16MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
1,168
MC68HC000RC10MC68HC000RC10NXP SemiconductorsIC MPU M680X0 10MHZ 68PGAMicroprocessors68-PGA (26.92x26.92)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
10MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
68-BCPGA
Supplier Device Package:
68-PGA (26.92×26.92)
275
MC68HC000RC12MC68HC000RC12NXP SemiconductorsIC MPU M680X0 12MHZ 68PGAMicroprocessors68-PGA (26.92x26.92)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
12MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
68-BCPGA
Supplier Device Package:
68-PGA (26.92×26.92)
803
MC68HC000RC16MC68HC000RC16NXP SemiconductorsIC MPU M680X0 16MHZ 68PGAMicroprocessors68-PGA (26.92x26.92)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
68-BCPGA
Supplier Device Package:
68-PGA (26.92×26.92)
118
MC68HC000RC8MC68HC000RC8NXP SemiconductorsIC MPU M680X0 8MHZ 68PGAMicroprocessors68-PGA (26.92x26.92)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
8MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
68-BCPGA
Supplier Device Package:
68-PGA (26.92×26.92)
984
MC68HC11A0CFNE3MC68HC11A0CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
737
MC68HC11A1CFNE3MC68HC11A1CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
81
MC68HC11A1CFNE3RMC68HC11A1CFNE3RNXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,461
MC68HC11A1MFNEMC68HC11A1MFNENXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 125°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
394
MC68HC11A1MFNERMC68HC11A1MFNERNXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 125°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
786

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