 | | MC68EN360CZQ25L | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | 5.0V | -40°C – 85°C | Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 188 | |
 | | MC68EN360EM25L | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 702 | |
 | | MC68EN360EM25VL | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 325 | |
 | | MC68EN360EM33L | NXP Semiconductors | IC MPU M683XX 33MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 298 | |
| N/A | | MC68EN360RC25L | NXP Semiconductors | IC MPU M683XX 25MHZ 241PGA | Microprocessors | 241-PGA (47.24x47.24) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Supplier Device Package: 241-PGA (47.24×47.24) | 441 | |
 | | MC68EN360VR25L | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 376 | |
 | | MC68EN360VR25LR2 | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,346 | |
 | | MC68EN360VR25VL | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 936 | |
 | | MC68EN360VR33L | NXP Semiconductors | IC MPU M683XX 33MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,045 | |
 | | MC68EN360ZP25VL | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 539 | |
 | | MC68EN360ZQ25VL | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,284 | |
| N/A | | MC68F375BGMVR33 | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 217PBGA | Microcontrollers | 217-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 217-PBGA (23×23) | 1,464 | |
| N/A | | MC68F375BGMZP33 | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 217PBGA | Microcontrollers | 217-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 217-PBGA (23×23) | 1,321 | |
| N/A | | MC68F375MZP33R2 | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 217PBGA | Microcontrollers | 217-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 217-PBGA (23×23) | 1,227 | |
 | | MC68HC000CEI16 | NXP Semiconductors | IC MPU M680X0 16MHZ 68PLCC | Microprocessors | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (24.21×24.21) | 99 | |
 | | MC68HC000CEI16R | NXP Semiconductors | IC MPU M680X0 16MHZ 68PLCC | Microprocessors | 68-PLCC (24.21x24.21) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (24.21×24.21) | 870 | |
 | | MC68HC000CRC10 | NXP Semiconductors | IC MPU M680X0 10MHZ 68PGA | Microprocessors | 68-PGA (26.92x26.92) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 68-PGA (26.92×26.92) | 162 | |
 | | MC68HC000CRC12 | NXP Semiconductors | IC MPU M680X0 12MHZ 68PGA | Microprocessors | 68-PGA (26.92x26.92) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 68-PGA (26.92×26.92) | 1,518 | |
 | | MC68HC000CRC16 | NXP Semiconductors | IC MPU M680X0 16MHZ 68PGA | Microprocessors | 68-PGA (26.92x26.92) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 68-PGA (26.92×26.92) | 189 | |
 | | MC68HC000CRC8 | NXP Semiconductors | IC MPU M680X0 8MHZ 68PGA | Microprocessors | 68-PGA (26.92x26.92) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 68-PGA (26.92×26.92) | 52 | |