MC68EN360VR25VL

IC MPU M683XX 25MHZ 357BGA
Part Description

CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 357-PBGA (25x25)

Quantity 178 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC68
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorCPU32+Device Package357-PBGA (25x25)
ECCNEAR99Ethernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 70°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed25MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MC68EN360VR25VL – IC MPU M683XX 25MHZ 357BGA

The MC68EN360VR25VL from NXP Semiconductors is a CPU32+ microprocessor in the MC68 series featuring a single 32‑bit core running at 25 MHz. It is designed for embedded systems that require integrated communication processing, on‑chip peripheral controllers and flexible memory interfacing.

With an on‑chip Communications Processor Module (CPM), multiple serial controllers and optional 10 Mbps Ethernet on SCC1, this device targets communications‑focused embedded applications where integration, peripheral density and bus flexibility are important.

Key Features

  • Core  CPU32+ single 32‑bit core at 25 MHz, delivering approximately 4.5 MIPS at 25 MHz as specified for the series.
  • Memory and Bus  Up to 32‑bit data bus with dynamic bus sizing for 8/16‑bit operation and up to 32 address lines; supports external memory types including SRAM, EPROM and Flash with boot chip select options.
  • Communications Processor Module (CPM)  On‑chip RISC CPM with support for 224 buffer descriptors and commands for efficient serial channel management.
  • Serial Channels  Four SCCs, two SMCs and one SPI channel (series feature); SCC1 supports optional Ethernet/IEEE 802.3 at full 10 Mbps on the EN360 variant.
  • DMA and Timers  Two independent IDMAs with buffer chaining and auto buffer modes, plus four general‑purpose timers (configurable as four 16‑bit or two 32‑bit timers).
  • System Integration Module (SIM60)  Includes bus monitor, double bus fault monitor, watchdog, periodic interrupt timer, clock synthesizer and IEEE 1149.1 test access port for system reliability and debug.
  • Interfaces and Controllers  DRAM controller and additional SCC interface support for diverse peripheral connectivity and communications tasks.
  • Power, Package and Thermal  3.3 V I/O, surface‑mount 357‑PBGA package (25×25 mm footprint), RoHS compliant, rated operating temperature 0 °C to 70 °C.

Typical Applications

  • Communications Equipment  Protocol handling and multi‑channel serial communications using the CPM and multiple SCC/SMC channels.
  • Embedded Networking & Gateways  Network interface designs leveraging the optional 10 Mbps Ethernet on SCC1 for connectivity and data bridging.
  • Industrial Control  Real‑time control and I/O handling using timers, DMA channels and flexible memory interfaces.
  • Companion/Bridge Processors  Slave mode and MC68040 companion support allow use as a companion or bus‑shared device in mixed‑processor systems.

Unique Advantages

  • Integrated Communications Subsystem: The CPM plus multiple serial controllers reduce external peripheral requirements for communications‑centric designs.
  • Flexible Memory Interface: Support for 8/16/32‑bit memory sizing and boot chip select options simplifies board memory design and boot strategies.
  • Hardware DMA and Timers: Independent IDMAs and configurable timers offload data movement and timing tasks from the CPU for efficient real‑time processing.
  • System‑level Reliability Features: On‑chip watchdog, bus monitors and IEEE 1149.1 test access improve system robustness and facilitate production test and debug.
  • Industry‑standard Package and Voltage: 3.3 V I/O in a 357‑PBGA surface‑mount package (25×25) supports compact board layouts and modern power domains.
  • RoHS Compliant: Meets applicable lead‑free environmental requirements for easier regulatory and supply compliance.

Why Choose MC68EN360VR25VL?

The MC68EN360VR25VL provides a compact, communications‑focused microprocessor solution with a CPU32+ core, integrated CPM and a rich set of serial interfaces that reduce external component count and simplify system architecture. Its DMA, timer and system integration features make it suitable for embedded designs that require deterministic handling of serial data and robust system control.

This device is well suited to engineering teams building networked embedded controllers, protocol gateways or companion processor solutions that benefit from on‑chip communications acceleration, flexible memory interfacing and standard surface‑mount packaging with 3.3 V I/O.

Request a quote or submit an inquiry for pricing and availability for MC68EN360VR25VL to receive current lead times and ordering information.

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