MC68EN360RC25L
| Part Description |
CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 241-PGA (47.24x47.24) |
|---|---|
| Quantity | 829 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MC68 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | CPU32+ | Device Package | 241-PGA (47.24x47.24) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Through Hole | ||
| Mounting Type | Through Hole | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 70°C (TA) | ||
| Package / Case | 241-BEPGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 25MHz | Supplier Device Package | 241-PGA (47.24×47.24) | ||
| Voltage – I/O | 5.0V |
Overview of MC68EN360RC25L – IC MPU M683XX 25MHZ 241PGA
The MC68EN360RC25L is a CPU32+ microprocessor IC from the MC68 series, featuring a single 32‑bit CPU core running at 25 MHz in a 241‑PGA package. It targets embedded systems that require integrated communications functionality and memory interface support.
This device integrates a Communications Processor Module (CPM) and serial controllers alongside a DRAM controller and a 10 Mbps Ethernet interface, providing a consolidated hardware foundation for embedded communications and control applications.
Key Features
- Core and Performance CPU32+ core, single 32‑bit processor running at 25 MHz.
- Voltage 5 V I/O voltage level for interface compatibility with 5 V systems.
- Communications Processing Integrated Communications Processor Module (CPM) and communications DSP support for on‑chip handling of serial and communications tasks.
- Serial Interfaces Additional serial interface capability via SCC (Serial Communications Controller) for multi‑channel serial connectivity.
- Memory Support On‑chip DRAM controller to simplify connection to external dynamic memory.
- Ethernet Single 10 Mbps Ethernet interface for network connectivity.
- Package and Mounting 241‑PGA supplier package (47.24 × 47.24) / 241‑BEPGA package case with through‑hole mounting.
- Operating Range Rated for operation from 0 °C to 70 °C.
- Compliance RoHS compliant.
Typical Applications
- Embedded Communications Controllers Use the integrated CPM, SCC and Ethernet interface to implement embedded communications functions and protocol handling.
- Networking and Telecom Equipment Suitable for network interface or controller roles that require a dedicated communications processor and serial connectivity.
- Industrial Embedded Systems Appropriate for control systems requiring a 32‑bit CPU, DRAM interface and reliable through‑hole mounting for robust board assembly.
Unique Advantages
- Integrated Communications Support: On‑chip Communications Processor Module (CPM) and SCC reduce the need for external comms controllers.
- Built‑in Memory Interface: DRAM controller support streamlines external memory integration and system memory design.
- Network Connectivity: Includes a 10 Mbps Ethernet interface for basic networked applications without additional PHY logic on the board.
- Through‑Hole 241‑PGA Packaging: Large PGA package (241‑PGA) supports through‑hole mounting for select assembly and thermal profiles.
- RoHS Compliance: Conforms to RoHS requirements for reduced hazardous substances in manufacturing.
Why Choose MC68EN360RC25L?
The MC68EN360RC25L combines a CPU32+ 32‑bit core with dedicated communications hardware—CPM, SCC and Ethernet—plus a DRAM controller in a single 241‑PGA package. This integration simplifies board-level design for embedded systems that need serial and network connectivity alongside general‑purpose processing.
Engineers designing embedded communications, networking or industrial control systems will find the MC68EN360RC25L suited to applications where consolidated communications features, a 5 V I/O domain, and through‑hole package considerations are important. The device’s documentation and series resources provide the technical detail needed for system integration and migration planning.
Request a quote or submit a pricing inquiry to evaluate the MC68EN360RC25L for your next embedded design. Our team can provide availability, lead times and ordering information.

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Headquarters: Eindhoven, North Brabant, Netherlands
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