MC68EN360EM25VL

The MC68EN360EM25VL is an NXP Semiconductors MC68 series microprocessor featuring a CPU32+ single 32‑bit core operating at 25 MHz. Designed for embedded applications that require integrated communications and system integration functionality, the device combines a CPU32+ core with on‑chip communications support and DRAM controller capability.

This device is targeted at embedded systems requiring a compact, surface‑mount microprocessor solution with 3.3 V I/O, a 240‑pin FQFP package, and commercial temperature operation (0 °C to 70 °C). Documentation for the MC68360 family describes system integration modules and a communications processor module (CPM) useful for serial and networked embedded designs.

Key Features

• CPU Core — CPU32+ Single 32‑bit CPU32+ core running at 25 MHz for deterministic embedded processing.
• Communications Co‑processor (CPM) On‑chip communications processing (CPM) to support serial and networked interfaces.
• Serial Interfaces — SCC Includes SCC (Serial Communications Controller) interfaces for multi‑channel serial connectivity.
• Ethernet Support Integrated support for a 10 Mbps Ethernet interface (1 port) for networked embedded applications.
• Memory Interface — DRAM Controller On‑chip DRAM controller to simplify external memory interfacing and system design.
• Power and I/O 3.3 V I/O voltage level for compatibility with common embedded peripherals.
• Package and Mounting 240‑pin FQFP package (32 × 32 mm) in a surface‑mount form factor for compact PCB implementation.
• Operating Range Commercial temperature rating from 0 °C to 70 °C.
• Standards Compliance RoHS compliant to meet current environmental and manufacturing requirements.
• Documentation and Architecture Family documentation describes QUICC architecture, System Integration Module (SIM60), CPM programming and system integration guidance useful for development and system design.

Typical Applications

• Embedded Communications Use as a communications controller in embedded systems that require serial and 10 Mbps Ethernet connectivity.
• Networked Control Modules Suitable for compact networked controllers that need an integrated DRAM interface and CPM for protocol handling.
• Industrial and Commercial Embedded Systems Deployed in commercial‑temperature embedded applications where a surface‑mount 240‑pin solution with 3.3 V I/O is required.

Unique Advantages

• Integrated Communications Processing: The on‑chip CPM and SCC interfaces reduce external controller requirements for serial and network protocols.
• Single‑Chip System Integration: CPU32+ core combined with DRAM controller and system integration features streamlines BOM and board design.
• Standard Voltage I/O: 3.3 V I/O compatibility simplifies interfacing with common peripherals and transceivers.
• Compact Surface‑Mount Package: 240‑pin FQFP (32×32 mm) provides a high‑pin‑count solution in a standard SMD format.
• Commercial Temperature Rating: Rated for 0 °C to 70 °C for deployments in commercial embedded environments.
• RoHS Compliant: Meets environmental requirements for lead‑free manufacturing.

Why Choose MC68EN360EM25VL?

The MC68EN360EM25VL delivers a compact, integrated microprocessor solution combining a CPU32+ core with communications processing, DRAM controller capability, and a 10 Mbps Ethernet interface in a 240‑pin surface‑mount package. Its 3.3 V I/O and documented QUICC architecture elements such as the System Integration Module and Communications Processor Module make it well suited for embedded designs that prioritize integrated communications and straightforward memory interfacing.

This device is ideal for engineers building commercial‑temperature embedded systems requiring on‑chip communications support, modest processing throughput, and a standard FQFP mounting option. Comprehensive family documentation and programming references are available to support system integration and development efforts.

Request a quote or submit a product inquiry to receive pricing and availability information for the MC68EN360EM25VL.