MC68EN360VR25L

IC MPU M683XX 25MHZ 357BGA
Part Description

CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 357-PBGA (25x25)

Quantity 911 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC68
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorCPU32+Device Package357-PBGA (25x25)
ECCNEAR99Ethernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 70°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed25MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O5.0V

Overview of MC68EN360VR25L – IC MPU M683XX 25MHZ 357BGA

The MC68EN360VR25L is a CPU32+ microprocessor from the MC68 series featuring a single 32‑bit core running at 25 MHz. Engineered as an integrated communications controller, it combines a CPU32+ core with dedicated communications subsystems suited for embedded controller and networking-oriented applications.

With on‑chip communications peripherals and a compact 357‑pin PBGA (25×25) package, this device targets designs that require integrated serial channels, DMA and memory interfaces while operating from a 5 V IO domain within a 0 °C to 70 °C temperature range.

Key Features

  • CPU Core — CPU32+ at 25 MHz: Single 32‑bit CPU32+ core delivering approximately 4.5 MIPS at 25 MHz, with byte‑misaligned addressing and background debug mode.
  • Bus and Memory Interface: Up to 32‑bit data bus with dynamic sizing for 8/16 bits and up to 32 address lines; supports DRAM controllers and boot chip select options for 8/16/32‑bit memory.
  • Communications Processor Module (CPM): On‑chip RISC communications controller with 224 buffer descriptors, continuous mode support and commands for efficient serial channel handling.
  • Serial Channels and Ethernet: Four SCCs plus additional serial channels (SMCs and SPI); Ethernet (IEEE 802.3) 10 Mbps support available on SCC1 for the EN360 variant.
  • DMA and Timers: Two independent DMAs with buffer chaining and auto buffer modes for efficient transfers; four general‑purpose timers configurable as four 16‑bit or two 32‑bit timers.
  • System Integration Module (SIM60): On‑chip bus monitor, double bus fault monitor, spurious interrupt monitor, software watchdog, periodic interrupt timer, clock synthesizer and breakpoint logic; includes IEEE 1149.1 test access port.
  • Package and Mounting: 357‑PBGA (25×25) supplier package, surface‑mount, compact footprint for space‑constrained embedded designs.
  • Operating Conditions and Compliance: 5 V IO supply and operating temperature range of 0 °C to 70 °C; RoHS compliant.

Typical Applications

  • Networking and Communications Equipment: Integrated SCCs, CPM and optional 10 Mbps Ethernet make this device suitable for protocol handling, gateway and communications controller roles.
  • Embedded Controllers: Single‑chip integration of CPU, DMA, timers and serial peripherals supports compact controllers for industrial and OEM embedded systems.
  • Legacy Serial and HDLC-Based Systems: Multiple SCC channels with HDLC/SDLC support enable use in systems requiring serial protocol management and HDLC bus implementations.

Unique Advantages

  • Integrated Communications Subsystem: CPM plus multiple SCCs and serial channels reduce external peripheral requirements for communications‑centric designs.
  • Flexible Memory and DMA Support: 32‑bit bus with dynamic sizing, DRAM controller support and two IDMAs enable efficient memory access and high‑throughput data transfers.
  • On‑Chip System Management: SIM60 features such as watchdog, bus monitors and breakpoint logic simplify system reliability and debug implementation.
  • Ethernet‑Enabled Variant: The EN360 designation includes optional 10 Mbps Ethernet on SCC1, allowing direct network connectivity without additional MAC controllers.
  • Compact Surface‑Mount Packaging: 357‑pin PBGA provides high pin density in a compact footprint suitable for space‑constrained boards.
  • Regulatory and Assembly-Friendly: RoHS compliance and standard surface‑mount PBGA packaging support modern manufacturing and environmental requirements.

Why Choose MC68EN360VR25L?

The MC68EN360VR25L positions itself as a purpose‑built embedded communications microprocessor that combines a CPU32+ core with a comprehensive communications subsystem and system integration features. Its mix of on‑chip CPM, multiple serial controllers and flexible memory interfaces makes it well suited for designs that require integrated protocol handling, DMA accelerated transfers and compact packaging.

This part is appropriate for engineering teams building embedded networking modules, protocol gateways or controller boards where reduced external BOM, established peripheral sets and RoHS compliance are important for long‑term production and support.

Request a quote or submit an inquiry to receive pricing, availability and technical support for the MC68EN360VR25L. Our team can provide lead‑time details and help confirm suitability for your design requirements.

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