MC68EN360EM25L
| Part Description |
CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 240-FQFP (32x32) |
|---|---|
| Quantity | 300 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MC68 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | CPU32+ | Device Package | 240-FQFP (32x32) | ||
|---|---|---|---|---|---|---|---|
| ECCN | EAR99 | Ethernet | 10Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 70°C (TA) | ||
| Package / Case | 240-BFQFP | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 25MHz | Supplier Device Package | 240-FQFP (32×32) | ||
| Voltage – I/O | 5.0V |
Overview of MC68EN360EM25L – IC MPU M683XX 25MHZ 240FQFP
The MC68EN360EM25L is a CPU32+ microprocessor IC with a single 32‑bit core running at 25 MHz, designed for embedded communications and control applications. It integrates communications-focused subsystems including a Communications Processor Module (CPM) and System Integration Module (SIM60), providing a compact platform for embedded networking and protocol handling.
Built by NXP Semiconductors as part of the MC68 series, this device emphasizes system integration—combining a 32‑bit core, DRAM controller support and serial/ethernet interfaces in a 240‑lead FQFP surface‑mount package for straightforward board implementation.
Key Features
- Core CPU32+ single 32‑bit core running at 25 MHz, suitable for embedded control and communications tasks.
- Communications Processing Integrated Communications Processor Module (CPM) and co‑processor support for communications functions, as outlined in the MC68360 family documentation.
- Memory and Bus On‑chip support for DRAM controllers to interface with external memory for system and protocol buffers.
- Ethernet 10 Mbps Ethernet interface (1), enabling basic network connectivity for embedded systems.
- Serial Interfaces Includes SCC and other serial interface options for peripheral and protocol connectivity.
- Package and Mounting 240‑lead FQFP (32×32 mm) surface‑mount package for high‑density PCB designs.
- Power 5 V I/O voltage compatible with legacy embedded designs.
- Operating Range Specified operating temperature from 0 °C to 70 °C for standard commercial environments.
- Compliance RoHS compliant, meeting common environmental directives for electronic components.
Typical Applications
- Embedded Communications Controllers Use as a communications‑centric MPU where integrated CPM and serial subsystems manage protocol and I/O tasks.
- Networking and Protocol Equipment Suitable for modest‑speed Ethernet‑enabled devices and control planes that require a dedicated communications processor.
- Industrial Control Systems Deploy in embedded control nodes that need DRAM interfacing, serial connectivity, and a reliable 32‑bit processing core.
- Telecommunications Interfaces Appropriate for systems implementing serial configurations and offloaded communications processing using the CPM and SIM60 architecture.
Unique Advantages
- Integrated Communications Subsystem: CPM and related modules consolidate communications functions, reducing external controller requirements.
- 32‑Bit CPU32+ Core: Provides a straightforward 32‑bit architecture at 25 MHz for control and protocol execution in embedded systems.
- DRAM Controller Support: Enables scalable external memory configurations for buffering and application code storage.
- Ethernet Connectivity: Built‑in 10 Mbps Ethernet support provides basic network connectivity without separate PHY/controller components.
- Standard Surface‑Mount Package: 240‑lead FQFP (32×32) eases integration into compact, high‑density PCB layouts.
- Commercial Temperature Rating: 0 °C to 70 °C operation aligns with many standard embedded deployments.
Why Choose MC68EN360EM25L?
The MC68EN360EM25L offers a focused combination of a CPU32+ 32‑bit core and integrated communications modules tailored for embedded applications that require serialized interfaces, DRAM support, and Ethernet connectivity in a single package. Its system integration features—documented within the MC68360 family manuals—make it a practical option for designs where on‑chip communications processing reduces external component count and simplifies system architecture.
Produced by NXP Semiconductors as part of the MC68 series, this device is supported by comprehensive family documentation and is a suitable choice for engineers specifying compact, communications‑oriented microprocessor solutions for commercial embedded systems.
Request a quote to obtain pricing and availability or submit an RFQ to start your procurement process for the MC68EN360EM25L.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016