MC68EN360CEM25L

IC MPU M683XX 25MHZ 240FQFP
Part Description

CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 240-FQFP (32x32)

Quantity 568 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC68
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorCPU32+Device Package240-FQFP (32x32)
ECCN3A991A2Ethernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case240-BFQFPRAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed25MHzSupplier Device Package240-FQFP (32×32)
Voltage – I/O5.0V

Overview of MC68EN360CEM25L – IC MPU M683XX 25MHz 240-FQFP

The MC68EN360CEM25L is a CPU32+ 32-bit microprocessor offered by NXP Semiconductors in a 240-pin FQFP package. Operating at 25 MHz with a single CPU32+ core and integrated communications functionality, it targets embedded and industrial applications that require on-chip communications processing and system integration.

Designed for systems that need deterministic embedded processing and serial/communications interfaces, the device combines a CPU32+ core with a Communications Processor Module (CPM) and System Integration Module (SIM60) as described in the MC68360 documentation, providing a consolidated platform for embedded communications and control tasks.

Key Features

  • CPU Core — CPU32+ single 32-bit core running at 25 MHz, suitable for embedded control workloads.
  • Communications Processing — Includes Communications Processor Module (CPM) capabilities for communications and DSP-related functions as identified in the MC68360 user documentation.
  • Integrated System Modules — System Integration Module (SIM60) presence noted in the series documentation for system-level integration and peripheral management.
  • Memory and Bus Support — On-chip DRAM controller functionality is specified, enabling external DRAM interfacing for system memory expansion.
  • Ethernet — Single 10 Mbps Ethernet interface available for basic networking connectivity.
  • Serial Interfaces — Additional serial controller channel (SCC) support for serial communications.
  • Package and Mounting — 240-FQFP (32×32 mm) surface-mount package optimized for board-level integration.
  • Power — 5 V I/O voltage compatibility for legacy and industrial I/O domains.
  • Industrial Temperature Range — Rated for operation from -40 °C to 85 °C for deployment in industrial environments.
  • Compliance — RoHS-compliant for environmental regulation conformance.
  • Testability — Series documentation includes support for IEEE 1149.1 Test Access Port (JTAG), facilitating board-level testing and debugging.

Typical Applications

  • Industrial Control — Embedded control systems that require a 32-bit core with industrial temperature operation and integrated communications.
  • Communications Equipment — Networked modules and controllers leveraging the on-chip CPM and 10 Mbps Ethernet for connectivity and protocol handling.
  • Embedded Systems — General-purpose embedded devices that benefit from an integrated DRAM controller, serial channels, and consolidated system integration features.
  • Networking Modules — Small networking or interface modules that need serial communications, Ethernet, and a CPU32+ core in a compact 240-FQFP package.

Unique Advantages

  • Integrated Communications Subsystem: The Communications Processor Module (CPM) reduces the need for external communications controllers, simplifying BOM and software partitioning.
  • Consolidated System Integration: System Integration Module (SIM60) functionality centralizes peripheral and system management for streamlined designs.
  • Industrial Ready: -40 °C to 85 °C operating range and 5 V I/O support make the device suitable for industrial embedded deployments.
  • Compact Surface-Mount Package: 240-FQFP (32×32) offers high I/O density in a standard surface-mount form factor for PCB space optimization.
  • On-Board Memory Interface: DRAM controller support allows designers to scale system memory without adding separate memory-controller ICs.
  • Standards-Based Test Support: IEEE 1149.1 Test Access Port support in the series documentation enables structured board test and debug workflows.

Why Choose MC68EN360CEM25L?

The MC68EN360CEM25L positions itself as a highly integrated microprocessor solution for embedded and industrial applications that require a 32-bit CPU32+ core paired with dedicated communications capabilities. Its combination of on-chip CPM, SIM60 system integration features, DRAM controller support, and a 10 Mbps Ethernet interface delivers a compact baseline for communication-focused embedded designs.

Engineers building industrial controllers, networked modules, or embedded communications platforms will find the MC68EN360CEM25L suited to designs that prioritize integration, predictable performance at 25 MHz, and compliance with industrial temperature and RoHS requirements.

Request a quote or submit a pricing inquiry to evaluate the MC68EN360CEM25L for your next embedded communications or industrial control project.

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