MC68EN360EM33L
| Part Description |
CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 33MHz 240-FQFP (32x32) |
|---|---|
| Quantity | 1,001 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MC68 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | CPU32+ | Device Package | 240-FQFP (32x32) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 70°C (TA) | ||
| Package / Case | 240-BFQFP | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 33MHz | Supplier Device Package | 240-FQFP (32×32) | ||
| Voltage – I/O | 5.0V |
Overview of MC68EN360EM33L – IC MPU M683XX 33MHZ 240FQFP
The MC68EN360EM33L is a single-core, 32-bit microprocessor based on the CPU32+ architecture, offered in a 240-pin FQFP (32×32) surface-mount package. It combines a CPU32+ core with integrated communications functionality and memory-controller support to address embedded systems that require on-chip communications peripherals and DRAM interfacing.
With a 33 MHz core clock, 5 V I/O rating and built-in Communications Processor Module (CPM) functionality as described in the MC68360 documentation, this device targets embedded and communications-focused applications where integrated interfaces and a compact package are important.
Key Features
- Core and Architecture CPU32+ core, single 32-bit processing element providing primary application processing at 33 MHz.
- Performance 33 MHz core clock delivering deterministic, single-core operation for embedded control and communications tasks.
- Integrated Communications Communications co-processor functionality (CPM) and serial communication controller (SCC) interfaces for serial and communications protocol handling.
- Memory Support On-chip DRAM controller support to interface with external dynamic RAM devices.
- Networking Integrated 10 Mbps Ethernet interface (1) for network connectivity in legacy Ethernet environments.
- Package and Mounting 240-pin FQFP (32×32) surface-mount package suited for high-pin-count embedded designs.
- Voltage and Power 5 V I/O voltage compatibility for interfacing with standard 5 V logic domains.
- Testability The MC68360 user documentation references IEEE 1149.1 test access, supporting boundary-scan test and board-level debug workflows.
- Operating Range Specified for operation from 0 °C to 70 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Embedded Communications Controllers Use the integrated CPU32+ and CPM/SCC interfaces to manage serial and protocol processing tasks in communications equipment.
- Networking and Gateway Devices Leverage the on-chip 10 Mbps Ethernet interface and DRAM controller for legacy network nodes and protocol gateways.
- Industrial Control Systems Deploy in control modules requiring a 32-bit processing core, DRAM access, and robust serial communications.
- Board-Level Prototyping and Integration The 240-FQFP package and IEEE 1149.1 test support simplify prototype development and board bring-up.
Unique Advantages
- Integrated Communications Processing: On-chip CPM and SCC capability streamlines handling of serial protocols without requiring extensive external logic.
- Single 32‑Bit Core at 33 MHz: A unified CPU32+ core provides consistent processing for control and communications tasks in embedded designs.
- On-Board DRAM Controller: Simplifies external memory interfacing and reduces system design complexity for memory-centric applications.
- Legacy Ethernet Support: Built-in 10 Mbps Ethernet interface enables straightforward connection to established network infrastructures.
- Production-Ready Package: 240-pin FQFP (32×32) surface-mount footprint supports compact, high-pin-count board layouts and automated assembly.
- RoHS Compliant: Conforms to RoHS requirements for environmentally regulated production environments.
Why Choose MC68EN360EM33L?
The MC68EN360EM33L positions itself as a compact, communications-focused microprocessor solution combining a CPU32+ core with CPM-based communications functionality and DRAM interfacing. Its 240-FQFP package, 5 V I/O compatibility, and on-chip network and serial interfaces make it suitable for embedded systems where integration and board-level testability are priorities.
This device is aimed at engineering teams designing embedded communications, networking, and industrial control products that require an integrated processor plus communications peripherals, along with RoHS compliance and standard operating-temperature support.
Request a quote or submit an inquiry to receive pricing and availability details for the MC68EN360EM33L and to discuss how it fits your design requirements.

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