Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC9S12DG256BCPVMC9S12DG256BCPVNXP SemiconductorsIC MCU 16BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
296
MC9S12DG256BMPVMC9S12DG256BMPVNXP SemiconductorsIC MCU 16BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
1,220
MC9S12DG256BVPVMC9S12DG256BVPVNXP SemiconductorsIC MCU 16BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
973
MC9S12DG256CCFUMC9S12DG256CCFUNXP SemiconductorsIC MCU 16BIT 256KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
59
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,710
MC9S12DG256CCPVMC9S12DG256CCPVNXP SemiconductorsIC MCU 16BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
935
MC9S12DG256CFUEMC9S12DG256CFUENXP SemiconductorsIC MCU 16BIT 256KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
59
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
181
MC9S12DG256CFUERMC9S12DG256CFUERNXP SemiconductorsIC MCU 16BIT 256KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
59
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,373
MC9S12DG256CPVEMC9S12DG256CPVENXP SemiconductorsIC MCU 16BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
353
MC9S12DG256MFUEMC9S12DG256MFUENXP SemiconductorsIC MCU 16BIT 256KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
59
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
70
MC9S12DG256MPVEMC9S12DG256MPVENXP SemiconductorsIC MCU 16BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
1,169
MC9S12DG256VFUEMC9S12DG256VFUENXP SemiconductorsIC MCU 16BIT 256KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
59
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
394
MC9S12DG256VPVEMC9S12DG256VPVENXP SemiconductorsIC MCU 16BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
828
MC9S12DJ128BCFUMC9S12DJ128BCFUNXP SemiconductorsIC MCU 16BIT 128KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
59
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
912
MC9S12DJ128BCPVMC9S12DJ128BCPVNXP SemiconductorsIC MCU 16BIT 128KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
1,080
MC9S12DJ128CFUEMC9S12DJ128CFUENXP SemiconductorsIC MCU 16BIT 128KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
59
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
144
MC9S12DJ128CPVEMC9S12DJ128CPVENXP SemiconductorsIC MCU 16BIT 128KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
674
MC9S12DJ128MFUEMC9S12DJ128MFUENXP SemiconductorsIC MCU 16BIT 128KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
59
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
813
MC9S12DJ128MPVEMC9S12DJ128MPVENXP SemiconductorsIC MCU 16BIT 128KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
177
MC9S12DJ128VFUEMC9S12DJ128VFUENXP SemiconductorsIC MCU 16BIT 128KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
59
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
688
MC9S12DJ128VPVEMC9S12DJ128VPVENXP SemiconductorsIC MCU 16BIT 128KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
PWM, WDT
Number of I/O:
91
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
1,167

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