Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC9S12E128MPVEMC9S12E128MPVENXP SemiconductorsIC MCU 16BIT 128KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
1,453
MC9S12E128VFUEMC9S12E128VFUENXP SemiconductorsIC MCU 16BIT 128KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
143
MC9S12E256CFUEMC9S12E256CFUENXP SemiconductorsIC MCU 16BIT 256KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.97V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,755
MC9S12E256CPVEMC9S12E256CPVENXP SemiconductorsMC9S12E256CPVE - S12E 16-bit MCUMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
S12
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
90
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
587
MC9S12E256MPVEMC9S12E256MPVENXP SemiconductorsIC MCU 16BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
967
MC9S12E256VPVEMC9S12E256VPVENXP SemiconductorsIC MCU 16BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
1,205
MC9S12E32CFUEMC9S12E32CFUENXP SemiconductorsIC MCU 16BIT 32KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
776
MC9S12E32VFUE16RMC9S12E32VFUE16RNXP SemiconductorsIC MCU 16BIT 32KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
745
MC9S12E64CFUMC9S12E64CFUNXP SemiconductorsIC MCU 16BIT 64KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
84
MC9S12E64CFUEMC9S12E64CFUENXP SemiconductorsIC MCU 16BIT 64KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,043
MC9S12E64CFUERMC9S12E64CFUERNXP SemiconductorsIC MCU 16BIT 64KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
345
MC9S12E64CPVMC9S12E64CPVNXP SemiconductorsIC MCU 16BIT 64KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
92
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
345
MC9S12E64CPVEMC9S12E64CPVENXP SemiconductorsIC MCU 16BIT 64KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
92
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
1,011
MC9S12E64MFUMC9S12E64MFUNXP SemiconductorsIC MCU 16BIT 64KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
665
MC9S12E64MFUEMC9S12E64MFUENXP SemiconductorsIC MCU 16BIT 64KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
435
MC9S12E64MPVEMC9S12E64MPVENXP SemiconductorsIC MCU 16BIT 64KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
92
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
875
MC9S12E64VFUE16RMC9S12E64VFUE16RNXP SemiconductorsIC MCU 16BIT 64KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 2.75V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
168
MC9S12GC128CFUEMC9S12GC128CFUENXP SemiconductorsIC MCU 16BIT 128KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
195
MC9S12GC128CPBEMC9S12GC128CPBENXP SemiconductorsIC MCU 16BIT 128KB FLASH 52TQFPMicrocontrollers52-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-TQFP (10×10)
Package / Case:
52-LQFP
1,013
MC9S12GC128CPBERMC9S12GC128CPBERNXP SemiconductorsIC MCU 16BIT 128KB FLASH 52TQFPMicrocontrollers52-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-TQFP (10×10)
Package / Case:
52-LQFP
651

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