Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MIMXRT1051DVJ6BMIMXRT1051DVJ6BNXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-LFBGA (12x12)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (12×12)
Package / Case:
196-LFBGA
858
MIMXRT1051DVL6AMIMXRT1051DVL6ANXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-LFBGA (10x10)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (10×10)
Package / Case:
196-LFBGA
1,693
MIMXRT1051DVL6BMIMXRT1051DVL6BNXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-LFBGA (10x10)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (10×10)
Package / Case:
196-LFBGA
807
MIMXRT1051DVL6BRMIMXRT1051DVL6BRNXP SemiconductorsIC MCU 32BIT ROMLESS 196LFBGAMicrocontrollers196-LFBGA (10x10)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (10×10)
Package / Case:
196-LFBGA
575
MIMXRT1052CVJ5BMIMXRT1052CVJ5BNXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-LFBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (12×12)
Package / Case:
196-LFBGA
26
MIMXRT1052CVL5AMIMXRT1052CVL5ANXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-LFBGA (10x10)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (10×10)
Package / Case:
196-LFBGA
191
MIMXRT1052CVL5BMIMXRT1052CVL5BNXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-LFBGA (10x10)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (10×10)
Package / Case:
196-LFBGA
195
MIMXRT1052CVL5BRMIMXRT1052CVL5BRNXP SemiconductorsIC MCU 32BIT ROMLESS 196LFBGAMicrocontrollers196-LFBGA (10x10)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (10×10)
Package / Case:
196-LFBGA
107
MIMXRT1052DVJ6BMIMXRT1052DVJ6BNXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-LFBGA (12x12)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (12×12)
Package / Case:
196-LFBGA
85
MIMXRT1052DVL6AMIMXRT1052DVL6ANXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-LFBGA (10x10)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (10×10)
Package / Case:
196-LFBGA
825
MIMXRT1052DVL6BMIMXRT1052DVL6BNXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-LFBGA (10x10)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (10×10)
Package / Case:
196-LFBGA
978
MIMXRT1052DVL6BRMIMXRT1052DVL6BRNXP SemiconductorsIC MCU 32BIT ROMLESS 196LFBGAMicrocontrollers196-LFBGA (10x10)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (10×10)
Package / Case:
196-LFBGA
126
MIMXRT105SCVL5BMIMXRT105SCVL5BNXP SemiconductorsMXRT1050 - i.MXRT105AMicrocontrollers196-MAPBGA (10x10)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
ROM
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
1.15V ~ 1.26V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-MAPBGA (10×10)
Package / Case:
196-LFBGA
917
MIMXRT105SDVL6BMIMXRT105SDVL6BNXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-MAPBGA (10x10)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-MAPBGA (10×10)
Package / Case:
196-LFBGA
668
MIMXRT1061CVJ5AMIMXRT1061CVJ5ANXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-LFBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (12×12)
Package / Case:
196-LFBGA
1,640
MIMXRT1061CVJ5ARN/AMIMXRT1061CVJ5ARNXP SemiconductorsIC MCU 32BIT EXT MEM 196LFBGAMicrocontrollers196-LFBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (12×12)
Package / Case:
196-LFBGA
1,272
MIMXRT1061CVJ5BMIMXRT1061CVJ5BNXP SemiconductorsIC MCU 32BIT EXT MEM 196LFBGAMicrocontrollers196-LFBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (12×12)
Package / Case:
196-LFBGA
1,397
MIMXRT1061CVJ5BRMIMXRT1061CVJ5BRNXP SemiconductorsIC MCU 32BIT EXT MEM 196LFBGAMicrocontrollers196-LFBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (12×12)
Package / Case:
196-LFBGA
583
MIMXRT1061CVL5AMIMXRT1061CVL5ANXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-LFBGA (10x10)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (10×10)
Package / Case:
196-LFBGA
1,907
MIMXRT1061CVL5BMIMXRT1061CVL5BNXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-MAPBGA (10x10)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-MAPBGA (10×10)
Package / Case:
196-LFBGA
599

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