Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MIMXRT1061DVJ6AMIMXRT1061DVJ6ANXP SemiconductorsIC MCU 32BIT ROMLESS 196LFBGAMicrocontrollers196-LFBGA (12x12)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (12×12)
Package / Case:
196-LFBGA
118
MIMXRT1061DVJ6BMIMXRT1061DVJ6BNXP SemiconductorsIC MCU 32BIT EXT MEM 196LFBGAMicrocontrollers196-LFBGA (12x12)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (12×12)
Package / Case:
196-LFBGA
120
MIMXRT1061DVL6AMIMXRT1061DVL6ANXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-LFBGA (10x10)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (10×10)
Package / Case:
196-LFBGA
1,337
MIMXRT1061DVL6BMIMXRT1061DVL6BNXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-MAPBGA (10x10)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-MAPBGA (10×10)
Package / Case:
196-LFBGA
210
MIMXRT1061XVN5BMIMXRT1061XVN5BNXP SemiconductorsIC MCU 32BIT 128KB ROM 225MAPBGAMicrocontrollers225-MAPBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
500MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
149
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
ROM
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
225-MAPBGA (13×13)
Package / Case:
225-LFBGA
258
MIMXRT1062CVJ5AMIMXRT1062CVJ5ANXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-LFBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (12×12)
Package / Case:
196-LFBGA
120
MIMXRT1062CVJ5ARN/AMIMXRT1062CVJ5ARNXP SemiconductorsIC MCU 32BIT EXT MEM 196LFBGAMicrocontrollers196-LFBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (12×12)
Package / Case:
196-LFBGA
1,117
MIMXRT1062CVJ5BMIMXRT1062CVJ5BNXP SemiconductorsIC MCU 32BIT EXT MEM 196LFBGAMicrocontrollers196-LFBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (12×12)
Package / Case:
196-LFBGA
157
MIMXRT1062CVJ5BRMIMXRT1062CVJ5BRNXP SemiconductorsIC MCU 32BIT EXT MEM 196LFBGAMicrocontrollers196-LFBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (12×12)
Package / Case:
196-LFBGA
605
MIMXRT1062CVL5AMIMXRT1062CVL5ANXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-LFBGA (10x10)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (10×10)
Package / Case:
196-LFBGA
424
MIMXRT1062CVL5BMIMXRT1062CVL5BNXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-MAPBGA (10x10)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-MAPBGA (10×10)
Package / Case:
196-LFBGA
1,568
N/AMIMXRT1062CVL5BRNXP SemiconductorsIC MCU 32BIT 128MB ROM 196LFBGAMicrocontrollers196-MAPBGA (10x10)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
ROM
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.15V ~ 1.26V, 3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-MAPBGA (10×10)
Package / Case:
196-LFBGA
823
MIMXRT1062DVJ6AMIMXRT1062DVJ6ANXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-LFBGA (12x12)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (12×12)
Package / Case:
196-LFBGA
1,117
MIMXRT1062DVJ6BMIMXRT1062DVJ6BNXP SemiconductorsIC MCU 32BIT EXT MEM 196LFBGAMicrocontrollers196-LFBGA (12x12)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (12×12)
Package / Case:
196-LFBGA
506
MIMXRT1062DVL6AMIMXRT1062DVL6ANXP SemiconductorsIC MCU 32BIT EXT MEM 196MAPBGAMicrocontrollers196-LFBGA (10x10)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (10×10)
Package / Case:
196-LFBGA
722
MIMXRT1062DVL6BMIMXRT1062DVL6BNXP SemiconductorsIC MCU 32BIT EXT MEM 196LFBGAMicrocontrollers196-LFBGA (10x10)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Type:
External Program Memory
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (10×10)
Package / Case:
196-LFBGA
20
MIMXRT1062DVN6BMIMXRT1062DVN6BNXP SemiconductorsIC MCU 32BIT 128KB ROM 225MAPBGAMicrocontrollers225-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
149
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
ROM
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
225-MAPBGA (13×13)
Package / Case:
225-LFBGA
282
MIMXRT1062XVN5BMIMXRT1062XVN5BNXP SemiconductorsIC MCU 32BIT 128KB ROM 225MAPBGAMicrocontrollers225-MAPBGA (13x13)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
500MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
149
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
ROM
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
225-MAPBGA (13×13)
Package / Case:
225-LFBGA
72
MIMXRT1064CVJ5BMIMXRT1064CVJ5BNXP SemiconductorsIC MCU 32BIT 4MB FLASH 196LFBGAMicrocontrollers196-LFBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (12×12)
Package / Case:
196-LFBGA
942
MIMXRT1064CVL5AMIMXRT1064CVL5ANXP SemiconductorsIC MCU 32BIT 4MB FLASH 196MAPBGAMicrocontrollers196-LFBGA (10x10)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
528MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LFBGA (10×10)
Package / Case:
196-LFBGA
1,194

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