Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MK66FN2M0VMD18MK66FN2M0VMD18NXP SemiconductorsIC MCU 32BIT 2MB FLASH 144MAPBGAMicrocontrollers144-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
100
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 2x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-MAPBGA (13×13)
Package / Case:
144-LBGA
70
MK66FX1M0VLQ18MK66FX1M0VLQ18NXP SemiconductorsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
100
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 2x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
338
MK66FX1M0VMD18MK66FX1M0VMD18NXP SemiconductorsIC MCU 32BIT 1MB FLASH 144MAPBGAMicrocontrollers144-MAPBGA (13x13)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
100
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 2x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-MAPBGA (13×13)
Package / Case:
144-LBGA
125
MK70FN1M0VMJ12MK70FN1M0VMJ12NXP SemiconductorsIC MCU 32BIT 1MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 71x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
1,483
MK70FN1M0VMJ12RN/AMK70FN1M0VMJ12RNXP SemiconductorsIC MCU 32BIT 1MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 71x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
272
MK70FN1M0VMJ15MK70FN1M0VMJ15NXP SemiconductorsIC MCU 32BIT 1MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 71x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
1,785
MK70FN1M0VMJ15RN/AMK70FN1M0VMJ15RNXP SemiconductorsIC MCU 32BIT 1MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 71x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
808
MK70FX512VMJ12MK70FX512VMJ12NXP SemiconductorsIC MCU 32B 512KB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 71x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
832
MK70FX512VMJ15MK70FX512VMJ15NXP SemiconductorsIC MCU 32B 512KB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 71x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
42
MK80FN256VDC15MK80FN256VDC15NXP SemiconductorsIC MCU 32BIT 256KB FLSH 121XFBGAMicrocontrollers121-XFBGA (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM
Number of I/O:
87
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 1x16b; D/A 2x6b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-XFBGA (8×8)
Package / Case:
121-XFBGA
422
MK80FN256VLL15MK80FN256VLL15NXP SemiconductorsIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM
Number of I/O:
66
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 1x16b; D/A 2x6b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
21
MK81FN256VDC15MK81FN256VDC15NXP SemiconductorsIC MCU 32BIT 256KB FLSH 121XFBGAMicrocontrollers121-XFBGA (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM
Number of I/O:
85
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 17x16b; D/A 2x6b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-XFBGA (8×8)
Package / Case:
121-XFBGA
825
N/AN/AMK81FN256VDC15RNXP SemiconductorsIC MCU 32BIT 256KB FLSH 121XFBGAMicrocontrollers121-XFBGA (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM
Number of I/O:
85
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 17x16b; D/A 2x6b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-XFBGA (8×8)
Package / Case:
121-XFBGA
582
MK81FN256VLL15N/AMK81FN256VLL15NXP SemiconductorsIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM
Number of I/O:
66
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x16b; D/A 2x6b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
351
MK82FN256VDC15MK82FN256VDC15NXP SemiconductorsIC MCU 32BIT 256KB FLSH 121XFBGAMicrocontrollers121-XFBGA (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM
Number of I/O:
87
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 18x16b; D/A 2x6b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-XFBGA (8×8)
Package / Case:
121-XFBGA
1,314
MK82FN256VLL15MK82FN256VLL15NXP SemiconductorsIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LVD, POR, PWM
Number of I/O:
66
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 18x16b; D/A 2x6b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,221
MKE02Z16VFM4MKE02Z16VFM4NXP SemiconductorsIC MCU 32BIT 16KB FLASH 32QFNMicrocontrollers32-HVQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
28
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-HVQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
270
MKE02Z16VLC2MKE02Z16VLC2NXP SemiconductorsIC MCU 32BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
28
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,204
MKE02Z16VLC2RMKE02Z16VLC2RNXP SemiconductorsIC MCU 32BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
28
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
666
MKE02Z16VLC4MKE02Z16VLC4NXP SemiconductorsIC MCU 32BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
28
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
335

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