Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AMKE02Z16VLC4RNXP SemiconductorsIC MCU 32BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
40MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
28
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,680
MKE02Z16VLD2MKE02Z16VLD2NXP SemiconductorsIC MCU 32BIT 16KB FLASH 44LQFPMicrocontrollers44-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
37
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-LQFP (10×10)
Package / Case:
44-LQFP
1,167
MKE02Z16VLD4MKE02Z16VLD4NXP SemiconductorsIC MCU 32BIT 16KB FLASH 44LQFPMicrocontrollers44-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
37
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-LQFP (10×10)
Package / Case:
44-LQFP
688
MKE02Z32VFM4MKE02Z32VFM4NXP SemiconductorsIC MCU 32BIT 32KB FLASH 32QFNMicrocontrollers32-HVQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
28
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-HVQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
123
MKE02Z32VFM4RMKE02Z32VFM4RNXP SemiconductorsIC MCU 32BIT 32KB FLASH 32QFNMicrocontrollers32-HVQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
28
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-HVQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
1,104
MKE02Z32VLC2MKE02Z32VLC2NXP SemiconductorsIC MCU 32BIT 32KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
28
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
773
MKE02Z32VLC2RMKE02Z32VLC2RNXP SemiconductorsIC MCU 32BIT 32KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
28
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
304
MKE02Z32VLC4MKE02Z32VLC4NXP SemiconductorsIC MCU 32BIT 32KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
28
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,121
MKE02Z32VLC4RMKE02Z32VLC4RNXP SemiconductorsIC MCU 32BIT 32KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
28
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
228
MKE02Z32VLD2MKE02Z32VLD2NXP SemiconductorsIC MCU 32BIT 32KB FLASH 44LQFPMicrocontrollers44-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
37
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-LQFP (10×10)
Package / Case:
44-LQFP
568
MKE02Z32VLD2RMKE02Z32VLD2RNXP SemiconductorsIC MCU 32BIT 32KB FLASH 44LQFPMicrocontrollers44-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
37
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-LQFP (10×10)
Package / Case:
44-LQFP
879
MKE02Z32VLD4MKE02Z32VLD4NXP SemiconductorsIC MCU 32BIT 32KB FLASH 44LQFPMicrocontrollers44-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
37
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-LQFP (10×10)
Package / Case:
44-LQFP
1,179
MKE02Z32VLD4RMKE02Z32VLD4RNXP SemiconductorsIC MCU 32BIT 32KB FLASH 44LQFPMicrocontrollers44-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
37
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-LQFP (10×10)
Package / Case:
44-LQFP
286
MKE02Z32VLH2MKE02Z32VLH2NXP SemiconductorsIC MCU 32BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
57
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
36
MKE02Z32VLH4MKE02Z32VLH4NXP SemiconductorsIC MCU 32BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
57
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,169
N/AMKE02Z32VLH4RNXP SemiconductorsKINETIS KE02: 40MHZ CORTEX-M0+ 5Microcontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
40MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
57
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,366
MKE02Z32VQH2MKE02Z32VQH2NXP SemiconductorsIC MCU 32BIT 32KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
57
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
344
MKE02Z32VQH4MKE02Z32VQH4NXP SemiconductorsIC MCU 32BIT 32KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
57
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
746
MKE02Z64VFM4MKE02Z64VFM4NXP SemiconductorsIC MCU 32BIT 64KB FLASH 32QFNMicrocontrollers32-HVQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
28
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b; D/A 2x6b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-HVQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
115
N/AMKE02Z64VFM4RNXP SemiconductorsKINETIS KE02: 40MHZ CORTEX-M0+ 5Microcontrollers32-HVQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
40MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
LVD, PWM, WDT
Number of I/O:
28
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-HVQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
418

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