Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
NLAS4684FCTCGN/ANLAS4684FCTCGonsemiIC SW SPDTX2 800MOHM 10MICROBUMPAnalog Switches, Multiplexers, Demultiplexers10-MicrobumpN/A-55°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
800mOhm
Channel-to-Channel Matching (ΔRon):
60mOhm
Voltage – Supply, Single (V+):
1.8V ~ 5.5V
Switch Time (Ton, Toff) (Max):
30ns, 30ns
-3db Bandwidth:
9.5MHz
Charge Injection:
15pC
Channel Capacitance (CS(off), CD(off)):
102pF, 104pF
Current – Leakage (IS(off)) (Max):
1µA
Crosstalk:
-83dB @ 100kHz
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-UFBGA, FCBGA
Supplier Device Package:
10-Microbump
283
NLAS4684MNR2N/ANLAS4684MNR2onsemiIC SWITCH SPDT X 2 800MOHM 10DFNAnalog Switches, Multiplexers, Demultiplexers10-DFN (3x3)N/A-55°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
800mOhm
Channel-to-Channel Matching (ΔRon):
60mOhm
Voltage – Supply, Single (V+):
1.8V ~ 5.5V
Switch Time (Ton, Toff) (Max):
30ns, 30ns
-3db Bandwidth:
9.5MHz
Charge Injection:
15pC
Channel Capacitance (CS(off), CD(off)):
102pF, 104pF
Current – Leakage (IS(off)) (Max):
1µA
Crosstalk:
-83dB @ 100kHz
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-VFDFN Exposed Pad
Supplier Device Package:
10-DFN (3×3)
393
NLAS4684MNR2GN/ANLAS4684MNR2GonsemiIC SWITCH SPDT X 2 800MOHM 10DFNAnalog Switches, Multiplexers, Demultiplexers10-DFN (3x3)N/A-55°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
800mOhm
Channel-to-Channel Matching (ΔRon):
60mOhm
Voltage – Supply, Single (V+):
1.8V ~ 5.5V
Switch Time (Ton, Toff) (Max):
30ns, 30ns
-3db Bandwidth:
9.5MHz
Charge Injection:
15pC
Channel Capacitance (CS(off), CD(off)):
102pF, 104pF
Current – Leakage (IS(off)) (Max):
1µA
Crosstalk:
-83dB @ 100kHz
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-VFDFN Exposed Pad
Supplier Device Package:
10-DFN (3×3)
465
NLAS4684MR2N/ANLAS4684MR2onsemiIC SWITCH SPDTX2 800MOHM 10MICROAnalog Switches, Multiplexers, Demultiplexers10-MicroN/A-55°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
800mOhm
Channel-to-Channel Matching (ΔRon):
60mOhm
Voltage – Supply, Single (V+):
1.8V ~ 5.5V
Switch Time (Ton, Toff) (Max):
30ns, 30ns
-3db Bandwidth:
9.5MHz
Charge Injection:
15pC
Channel Capacitance (CS(off), CD(off)):
102pF, 104pF
Current – Leakage (IS(off)) (Max):
1µA
Crosstalk:
-83dB @ 100kHz
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-TFSOP, 10-MSOP (0.118″”, 3.00mm Width)
Supplier Device Package:
10-Micro
1,422
NLAS4684MR2GN/ANLAS4684MR2GonsemiIC SWITCH SPDTX2 800MOHM 10MICROAnalog Switches, Multiplexers, Demultiplexers10-MicroN/A-55°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
800mOhm
Channel-to-Channel Matching (ΔRon):
60mOhm
Voltage – Supply, Single (V+):
1.8V ~ 5.5V
Switch Time (Ton, Toff) (Max):
30ns, 30ns
-3db Bandwidth:
9.5MHz
Charge Injection:
15pC
Channel Capacitance (CS(off), CD(off)):
102pF, 104pF
Current – Leakage (IS(off)) (Max):
1µA
Crosstalk:
-83dB @ 100kHz
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-TFSOP, 10-MSOP (0.118″”, 3.00mm Width)
Supplier Device Package:
10-Micro
512
NLAS4685FCT1N/ANLAS4685FCT1onsemiIC SW SPDTX2 800MOHM 10MICROBUMPAnalog Switches, Multiplexers, Demultiplexers10-MicrobumpN/A-55°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
800mOhm
Channel-to-Channel Matching (ΔRon):
60mOhm
Voltage – Supply, Single (V+):
1.8V ~ 5.5V
Switch Time (Ton, Toff) (Max):
30ns, 25ns
-3db Bandwidth:
11.5MHz
Charge Injection:
20pC
Channel Capacitance (CS(off), CD(off)):
208pF, 102pF
Current – Leakage (IS(off)) (Max):
1µA
Crosstalk:
-81dB @ 100kHz
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-UFBGA, FCBGA
Supplier Device Package:
10-Microbump
86
NLAS4685FCT1GN/ANLAS4685FCT1GonsemiIC SW SPDTX2 800MOHM 10MICROBUMPAnalog Switches, Multiplexers, Demultiplexers10-MicrobumpN/A-55°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
800mOhm
Channel-to-Channel Matching (ΔRon):
60mOhm
Voltage – Supply, Single (V+):
1.8V ~ 5.5V
Switch Time (Ton, Toff) (Max):
30ns, 25ns
-3db Bandwidth:
11.5MHz
Charge Injection:
20pC
Channel Capacitance (CS(off), CD(off)):
208pF, 102pF
Current – Leakage (IS(off)) (Max):
1µA
Crosstalk:
-81dB @ 100kHz
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-UFBGA, FCBGA
Supplier Device Package:
10-Microbump
1,945
NLAS4717EPFCT1GN/ANLAS4717EPFCT1GonsemiIC SW SPDTX2 3.5OHM 10MICROBUMPAnalog Switches, Multiplexers, Demultiplexers10-MicrobumpN/A-40°C ~ 85°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
3.5Ohm
Channel-to-Channel Matching (ΔRon):
100mOhm
Voltage – Supply, Single (V+):
1.8V ~ 5.5V
Switch Time (Ton, Toff) (Max):
30ns, 40ns
-3db Bandwidth:
90MHz
Charge Injection:
9pC
Channel Capacitance (CS(off), CD(off)):
15pF
Current – Leakage (IS(off)) (Max):
1nA
Crosstalk:
-110dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-UFBGA, FCBGA
Supplier Device Package:
10-Microbump
1,043
NLAS4717EPMTR2GN/ANLAS4717EPMTR2GonsemiIC SWITCH SPDT X 2 3.5OHM 10WQFNAnalog Switches, Multiplexers, Demultiplexers10-WQFN (1.4x1.8)N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
3.5Ohm
Channel-to-Channel Matching (ΔRon):
100mOhm
Voltage – Supply, Single (V+):
1.8V ~ 5.5V
Switch Time (Ton, Toff) (Max):
30ns, 40ns
-3db Bandwidth:
90MHz
Charge Injection:
9pC
Channel Capacitance (CS(off), CD(off)):
15pF
Current – Leakage (IS(off)) (Max):
1nA
Crosstalk:
-110dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-WFQFN
Supplier Device Package:
10-WQFN (1.4×1.8)
825
NLAS4717FCT1NLAS4717FCT1onsemiIC SW SPDTX2 3.5OHM 10MICROBUMPAnalog Switches, Multiplexers, Demultiplexers10-MicrobumpN/A-40°C ~ 85°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
3.5Ohm
Channel-to-Channel Matching (ΔRon):
100mOhm
Voltage – Supply, Single (V+):
1.8V ~ 5.5V
Switch Time (Ton, Toff) (Max):
30ns, 40ns
-3db Bandwidth:
40MHz
Charge Injection:
9pC
Channel Capacitance (CS(off), CD(off)):
30pF
Current – Leakage (IS(off)) (Max):
1nA
Crosstalk:
-110dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-UFBGA, FCBGA
Supplier Device Package:
10-Microbump
58
NLAS4717FCT1GNLAS4717FCT1GonsemiIC SW SPDTX2 3.5OHM 10MICROBUMPAnalog Switches, Multiplexers, Demultiplexers10-MicrobumpN/A-40°C ~ 85°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
3.5Ohm
Channel-to-Channel Matching (ΔRon):
100mOhm
Voltage – Supply, Single (V+):
1.8V ~ 5.5V
Switch Time (Ton, Toff) (Max):
30ns, 40ns
-3db Bandwidth:
40MHz
Charge Injection:
9pC
Channel Capacitance (CS(off), CD(off)):
30pF
Current – Leakage (IS(off)) (Max):
1nA
Crosstalk:
-110dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-UFBGA, FCBGA
Supplier Device Package:
10-Microbump
230
NLAS4717MR2NLAS4717MR2onsemiIC SWITCH SPDTX2 3.5OHM 10MICROAnalog Switches, Multiplexers, Demultiplexers10-MicroN/A-40°C ~ 85°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
3.5Ohm
Channel-to-Channel Matching (ΔRon):
100mOhm
Voltage – Supply, Single (V+):
1.8V ~ 5.5V
Switch Time (Ton, Toff) (Max):
30ns, 40ns
-3db Bandwidth:
40MHz
Charge Injection:
9pC
Channel Capacitance (CS(off), CD(off)):
30pF
Current – Leakage (IS(off)) (Max):
1nA
Crosstalk:
-110dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-TFSOP, 10-MSOP (0.118″”, 3.00mm Width)
Supplier Device Package:
10-Micro
637
NLAS4717MR2GNLAS4717MR2GonsemiIC SWITCH SPDTX2 3.5OHM 10MICROAnalog Switches, Multiplexers, Demultiplexers10-MicroN/A-40°C ~ 85°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
3.5Ohm
Channel-to-Channel Matching (ΔRon):
100mOhm
Voltage – Supply, Single (V+):
1.8V ~ 5.5V
Switch Time (Ton, Toff) (Max):
30ns, 40ns
-3db Bandwidth:
40MHz
Charge Injection:
9pC
Channel Capacitance (CS(off), CD(off)):
30pF
Current – Leakage (IS(off)) (Max):
1nA
Crosstalk:
-110dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-TFSOP, 10-MSOP (0.118″”, 3.00mm Width)
Supplier Device Package:
10-Micro
872
NLAS4783BMN1R2GN/ANLAS4783BMN1R2GonsemiIC SWITCH SPDT X 3 1OHM 16QFNAnalog Switches, Multiplexers, Demultiplexers16-QFN (3x3)N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
3
On-State Resistance (Max):
1Ohm
Channel-to-Channel Matching (ΔRon):
400mOhm (Max)
Voltage – Supply, Single (V+):
1.65V ~ 4.5V
Switch Time (Ton, Toff) (Max):
27ns, 20ns
-3db Bandwidth:
17MHz
Charge Injection:
50pC
Channel Capacitance (CS(off), CD(off)):
5pF
Current – Leakage (IS(off)) (Max):
500nA
Crosstalk:
-62dB @ 100kHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-VFQFN Exposed Pad
Supplier Device Package:
16-QFN (3×3)
569
NLAS4783MN1R2GN/ANLAS4783MN1R2GonsemiIC SWITCH SPDT X 3 1OHM 16QFNAnalog Switches, Multiplexers, Demultiplexers16-QFN (3x3)N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
3
On-State Resistance (Max):
1Ohm
Channel-to-Channel Matching (ΔRon):
400mOhm (Max)
Voltage – Supply, Single (V+):
1.65V ~ 4.5V
Switch Time (Ton, Toff) (Max):
27ns, 20ns
-3db Bandwidth:
17MHz
Charge Injection:
50pC
Channel Capacitance (CS(off), CD(off)):
5pF
Current – Leakage (IS(off)) (Max):
500nA
Crosstalk:
-62dB @ 100kHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-VFQFN Exposed Pad
Supplier Device Package:
16-QFN (3×3)
125
NLAS5113DFT2GN/ANLAS5113DFT2GonsemiIC SWITCH SPST-NOX1 1.3OHM SC88Analog Switches, Multiplexers, DemultiplexersSC-88/SC70-6/SOT-363N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
1
On-State Resistance (Max):
1.3Ohm
Voltage – Supply, Single (V+):
1.65V ~ 4.5V
Switch Time (Ton, Toff) (Max):
7ns, 4.5ns
-3db Bandwidth:
457MHz
Channel Capacitance (CS(off), CD(off)):
14pF
Current – Leakage (IS(off)) (Max):
100nA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-TSSOP, SC-88, SOT-363
Supplier Device Package:
SC-88/SC70-6/SOT-363
546
NLAS5113MUTBGN/ANLAS5113MUTBGonsemiIC SWITCH SPST-NOX1 1.3OHM 6UDFNAnalog Switches, Multiplexers, Demultiplexers6-UDFN (1.2x1)N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
1
On-State Resistance (Max):
1.3Ohm
Voltage – Supply, Single (V+):
1.65V ~ 4.5V
Switch Time (Ton, Toff) (Max):
7ns, 4.5ns
-3db Bandwidth:
457MHz
Channel Capacitance (CS(off), CD(off)):
14pF
Current – Leakage (IS(off)) (Max):
100nA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-UFDFN
Supplier Device Package:
6-UDFN (1.2×1)
381
NLAS5123MNR2GNLAS5123MNR2GFairchild SemiconductorSPDT, 1 CHANNEL, PDSO6Analog Switches, Multiplexers, DemultiplexersN/AN/AN/A

N/A

1,202
NLAS5123MUR2GN/ANLAS5123MUR2GonsemiIC SWITCH SPDT X 1 1OHM 6UDFNAnalog Switches, Multiplexers, Demultiplexers6-UDFN (1.2x1)N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
1
On-State Resistance (Max):
1Ohm
Channel-to-Channel Matching (ΔRon):
120mOhm
Voltage – Supply, Single (V+):
1.65V ~ 4.5V
Switch Time (Ton, Toff) (Max):
20ns, 15ns
-3db Bandwidth:
55MHz
Charge Injection:
48pC
Channel Capacitance (CS(off), CD(off)):
20pF
Current – Leakage (IS(off)) (Max):
2nA
Crosstalk:
-70dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-UFDFN
Supplier Device Package:
6-UDFN (1.2×1)
1,370
NLAS5157MUTCGN/ANLAS5157MUTCGonsemiIC SWITCH SPDT X 1 500MOHM 6UDFNAnalog Switches, Multiplexers, Demultiplexers6-UDFN (1.45x1)N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
1
On-State Resistance (Max):
500mOhm
Channel-to-Channel Matching (ΔRon):
80mOhm
Voltage – Supply, Single (V+):
1.65V ~ 4.5V
Switch Time (Ton, Toff) (Max):
40ns, 25ns
-3db Bandwidth:
36MHz
Charge Injection:
38pC
Channel Capacitance (CS(off), CD(off)):
47pF
Current – Leakage (IS(off)) (Max):
100nA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-UFDFN
Supplier Device Package:
6-UDFN (1.45×1)
1,803

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